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Description for Dow Dowsil EG-3000 Thixotropic Gel
• Two part • Translucent • 1:1 mix ratio • thixotropic gel • Heat cure gelBrand Dowsil Application Type Seal 1 Part or 2 Part 2-Part Material Form Gel Industry Circuits, E-Mobility Solutions, Smart Meters, Smart Home Devices, PCB system assemblies, Electronics, Optoelectronics, Interconnections Manufacturer Dow Chemistry Silicone, Solvent-free Cure Method 2-Part Cure, Heat cure Cure Temperature (°C) 20 to 25, 150 Cure Time (min) 60 Viscosity (cPs) 2,300 Color Translucent High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 2.70E+14 (ohm*cm) Light Refractive Index (RI) High -
Technical Data for Dow Dowsil EG-3000 Thixotropic Gel
Overview
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Application Type
- Sealant - Seal
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1 Part or 2 Part
- 2-Part
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Material Form
- Gel
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Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Circuits, Optoelectronics, Interconnections
- Printed Circuit Board (PCB) - PCB system assemblies
- Industrial - Delicate components
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Chemistry
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Application Method
- Dispenser - Automated dispensing equipment, Easy dispensing
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Cure Method
- Heat - Heat cure
- 2-Part Cure
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Color
- Translucent
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Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25, 150 Test Method Cure Time (min) 60 Test Method Viscosity (cPs) 2,300 Test Method Set Time (min) 8 Test Method Work / Pot Time (min) 360 Test Method Thixotropic Thixotropic Mix Ratio 1:1 (by volume), 1:1 (by weight) Material Resistance
High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dielectric Strength (V/mil) 550 Test Method Dielectric Constant 2.70 Test Method Volume Resistivity (O) 2.70E+14 (ohm*cm) Test Method Hardness
Flexibility Extremely soft , Resilient Other Properties
Light Refractive Index (RI) High Business Information
Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label. Shelf Life Temperature (°F) 77 Shelf Life (mon) 12 Not Good For
Don't Use For Some solder flux residues, Other sulfur containing materials, Chemicals, Organometallic compounds, Sulfur, Polysulfones, Unsaturated hydrocarbon plasitcizers,, Organotin, Silicone rubber containing organotin catalyst, Polysulfides Don't Use With plasticizers, Certain materials, Curing agents -
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Best Practices for Dow Dowsil EG-3000 Thixotropic Gel
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Mixing
Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.
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Deairing/Degassing
If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
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Testing
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
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Comparable Materials for Dow Dowsil EG-3000 Thixotropic Gel
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
20 to 25°C | |
150°C | Heat Cure, These values are not intended for use in preparing specifications. |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
60 min | Heat Cure, These values are not intended for use in preparing specifications. |
Viscosity Test Methods
Viscosity | Test Method |
---|---|
2,300 cPs | Mixed, These values are not intended for use in preparing specifications. |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
360 min | These values are not intended for use in preparing specifications. | 25°C |
Set Time Test Methods
Set Time | Set Temperature | Test Method |
---|---|---|
8 min | 135°C | Gel Time, These values are not intended for use in preparing specifications. |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
2.70 | At 100 kHz, These values are not intended for use in preparing specifications. |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
---|---|
550 V/mil | These values are not intended for use in preparing specifications. |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
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2.70E+14 (ohm*cm) | These values are not intended for use in preparing specifications. |