Dow Dowsil EG-3000 Thixotropic Gel

Dow Dowsil EG-3000 Thixotropic Gel Datasheet
  • Description for Dow Dowsil EG-3000 Thixotropic Gel

    • Two part • Translucent • 1:1 mix ratio • thixotropic gel • Heat cure gel

    *See Terms of Use Below

    Brand Dowsil
    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Circuits, E-Mobility Solutions, Smart Meters, Smart Home Devices, PCB system assemblies, Electronics, Optoelectronics, Interconnections
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2-Part Cure, Heat cure
    Cure Temperature (°C) 20 to 25, 150
    Cure Time (min) 60
    Viscosity (cPs) 2,300
    Color Translucent
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data for Dow Dowsil EG-3000 Thixotropic Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Gel
    • Industry
      • E-Mobility Solutions
      • Electronics - Circuits, Optoelectronics, Interconnections
      • Smart Meters
      • Smart Home Devices
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Industrial - Delicate components
    • Application Method
      • Dispenser - Automated dispensing equipment, Easy dispensing
    • Cure Method
      • Heat - Heat cure
      • 2-Part Cure
    • Color
      • Translucent
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 150 Test Method
    Cure Time (min) 60 Test Method
    Viscosity (cPs) 2,300 Test Method
    Set Time (min) 8 Test Method
    Work / Pot Time (min) 360 Test Method
    Thixotropic Thixotropic
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dielectric Strength (V/mil) 550 Test Method
    Dielectric Constant 2.70 Test Method
    Volume Resistivity (O) 2.70E+14 (ohm*cm) Test Method
    Hardness
    Flexibility Extremely soft , Resilient
    Other Properties
    Light Refractive Index (RI) High
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Some solder flux residues, Other sulfur containing materials, Chemicals, Organometallic compounds, Sulfur, Polysulfones, Unsaturated hydrocarbon plasitcizers,, Organotin, Silicone rubber containing organotin catalyst, Polysulfides
    Don't Use With plasticizers, Certain materials, Curing agents
  • Best Practices for Dow Dowsil EG-3000 Thixotropic Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.

    2. Deairing/Degassing

      If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    3. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
150°C Heat Cure, These values are not intended for use in preparing specifications.
Cure Time Test Methods
Cure Time Test Method
60 min Heat Cure, These values are not intended for use in preparing specifications.
Viscosity Test Methods
Viscosity Test Method
2,300 cPs Mixed, These values are not intended for use in preparing specifications.
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
360 min These values are not intended for use in preparing specifications. 25°C
Set Time Test Methods
Set Time Set Temperature Test Method
8 min 135°C Gel Time, These values are not intended for use in preparing specifications.
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.70 At 100 kHz, These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
550 V/mil These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
2.70E+14 (ohm*cm) These values are not intended for use in preparing specifications.