Dow Dowsil SC 102 Compound

Dow Dowsil SC 102 Compound Datasheet
  • Description for Dow Dowsil SC 102 Compound

    • One part • White • Non-curing • Non-flowing thermally conductive compound

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 1 Part
    Material Form Paste
    Industry Electronic heat sources, Chassis, E-Mobility Solutions, Smart Meters, Smart Home Devices, Automotive applications, Computer, PCB system assembly modules, Heat sink, Electronics, Heat sinks, Electrical device
    Manufacturer Dow
    Chemistry Silicone
    Application Method Spatula
    Cure Temperature (°C) 20 to 25
    Viscosity (cPs) Non-flowing, 29,000
    Color White
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low thermal resistance
  • Technical Data for Dow Dowsil SC 102 Compound

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Paste
    • Industry
      • Automotive - Automotive applications
      • Chassis
      • E-Mobility Solutions
      • Electronics - Electronic heat sources, Heat sinks, Electrical device
      • Smart Meters
      • Smart Home Devices
      • Storage & Graphics - Computer
      • Printed Circuit Board (PCB) - PCB system assembly modules
      • Heat sink
      • Power Supplies - Power supply
      • Industrial - Gap fill
    • Chemistry
      • VOC-free - Non Volatile Content : 99.7 %
      • Silicone
    • Application Method
      • Dispenser - Automated, Manual dispensing
      • Spatula/Trowel - Spatula
      • Screen Print - Screen, Stencil
    • Cure Method
      • None - Non-curing
    • Color
      • White
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25
    Viscosity (cPs) Non-flowing, 29,000 Test Method
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low thermal resistance
    Conductivity
    Dissipation Factor 2E-02 Test Method
    Filler Heat-conductive metal oxides, Polydimethylsiloxane
    Dielectric Strength (V/mil) Durable, 50 Test Method
    Dielectric Constant 4.00 Test Method
    Thermal Conductivity (W/m°K) High, Moderate, 0.52 (BTU/hr-ft-°F), Thermally conductive Test Method
    Volume Resistivity (O) 2E+16 (Ohm-cm) Test Method
    Other Properties
    Specific Gravity 2.400
    Business Information
    Shelf Life Details The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Exp. Date found on the label.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.
  • Best Practices for Dow Dowsil SC 102 Compound

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Application

      Apply grease with a squeegee through a stencil or screen

      Apply grease with a squeegee through a stencil or screen

    3. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    4. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Viscosity Test Methods
Viscosity Test Method
Non-flowing
29,000 cPs These values are not intended for use in preparing specifications.
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.00 At 50 Hz, These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Durable
50 V/mil These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
2E-02 At 50 Hz, These values are not intended for use in preparing specifications.
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
High
Moderate
0.52 (BTU/hr-ft-°F) These values are not intended for use in preparing specifications.
Thermally conductive
Volume Resistivity Test Methods
Volume Resistivity Test Method
2E+16 (Ohm-cm) These values are not intended for use in preparing specifications.