Dow Dowsil SC 102 Compound

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Description for Dow Dowsil SC 102 Compound

• One part • White • Non-curing • Non-flowing thermally conductive compound

Chemical Resistance	Good
Application Type	Seal
1 Part or 2 Part	1-Part
Material Form	Paste
Industry	Electronic heat sources, Automotive applications, Heat sink, PCB system assembly modules, Computer, Smart Meters, E-Mobility Solutions, Chassis, Smart Home Devices, Electronics, Heat sinks, Electrical device
Manufacturer	Dow
Chemistry	Silicone, Non Volatile Content : 99.7 %
Application Method	Spatula
Cure Temperature (°C)	20 to 25
Viscosity (cPs)	Non-flowing, 29,000
Color	White
Ozone Resistance	Ozone resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55, Low thermal resistance
Volume Resistivity (O)	2E+16 (Ohm-cm)

Best Practices for Dow Dowsil SC 102 Compound

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Technical Data for Dow Dowsil SC 102 Compound

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Overview

Chemical Resistance
- Chemical Resistance - Good
Application Type
- Sealant - Seal
1 Part or 2 Part
- 1-Part
Material Form
- Paste
Industry
- Storage & Graphics - Computer
- Smart Meters
- Smart Home Devices
- Automotive - Automotive applications
- E-Mobility Solutions
- Chassis
- Electronics - Electronic heat sources, Heat sinks, Electrical device
- Heat sink
- Printed Circuit Board (PCB) - PCB system assembly modules
- Power Supplies - Power supply
- Industrial - Gap fill
Chemistry
- VOC-free - Non Volatile Content : 99.7 %
- Silicone
Application Method
- Dispenser - Automated, Manual dispensing
- Spatula/Trowel - Spatula
- Screen Print - Screen, Stencil
Cure Method
- None - Non-curing
Color
- White

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25
Viscosity (cPs)	Non-flowing, 29,000	Test Method

Material Resistance

Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55, Low thermal resistance

Conductivity

Dissipation Factor	2E-02	Test Method
Filler	Heat-conductive metal oxides, Polydimethylsiloxane
Dielectric Strength (V/mil)	Durable, 50	Test Method
Dielectric Constant	4.00	Test Method
Thermal Conductivity (W/m°K)	High, Moderate, 0.52 (BTU/hr-ft-°F), Thermally conductive	Test Method
Volume Resistivity (O)	2E+16 (Ohm-cm)	Test Method

Other Properties

Specific Gravity	2.400

Business Information

Shelf Life Details	The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Exp. Date found on the label.
Shelf Life Type	From date of manufacture
Shelf Life (mon)	24

Not Good For

Don't Use With	non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.

Best Practices for Dow Dowsil SC 102 Compound

*See Terms of Use Below
1. Surface Preparation
  
  All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
2. Application
  
  Apply grease with a squeegee through a stencil or screen
  
  Apply grease with a squeegee through a stencil or screen
3. Curing
  
  The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.
4. Testing
  
  Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
Comparable Materials for Dow Dowsil SC 102 Compound

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Spec Engine^® Results
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  A nickel plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding.
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