Brand Dowsil Application Type Sealing, Gaskets, Bonding 1 Part or 2 Part 2 Part Material Form Liquid Substrate Ceramics, Glass, Reactive metals, Plastics, Many reactive metals, Selected plastics Industry Circuit boards, Connectors, Electronic components, Flyback transformer, ECUs, Sealing PCB module components, Electronic modules, Electronics parts Manufacturer Dow Chemistry Silicone Cure Method Heat, 2-Part Cure Cure Temperature (°C) Faster or lower, 70, 80, 100 Cure Time (min) Fast, 50, 30, 10 Viscosity (cPs) 85,000, Non-slump, 89,700 Color White High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55
Technical Data for Dow Dowsil SE 1720 CV
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
- Electronic Control Unit - ECUs
- Electronics - Electronic components, Electronic modules, Electronics parts
- Printed Circuit Board (PCB) - Circuit boards, Sealing PCB module components
- Transformers - Flyback transformer
- Power Supplies - Power modules
- Industrial - Condensers, Housing seals, Lids
- Other - Bonding agent for key pad of PC, Sealing ceramic condensers
- Dispenser - Automated or manual needle dispense
- 2-Part Cure
Cure Temperature (°C) Faster or lower, 70, 80, 100 Cure Time (min) Fast, 50, 30, 10 Viscosity (cPs) 85,000, Non-slump, 89,700 Test Method Tack Free Time (min) Fast Test Method Work / Pot Time (min) 360 Test Method Mix Ratio 1:1 (by volume)
General Bond Strength (psi) High Shear Strength (psi) 240 Test Method Tensile Strength (psi) 480
Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture resistance
Dissipation Factor 0.00200 Test Method Dielectric Strength (V/mil) Good, Durable, 650 Dielectric Constant 2.70 Test Method Volume Resistivity (O) 3.0 E+16 (ohms/cm)
Elongation (%) 375 Flexibility Flexible
Specific Gravity 1.060 Test Method
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. Shelf Life Temperature (°F) 77 Shelf Life (mon) 9
Not Good For
Don't Use With Plastic, rubber
Best Practices for Dow Dowsil SE 1720 CV
All surfaces should be thoroughly cleaned and/or degreased with Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
users should determine the best techniques for their particular applications.
Dow silicone 1:1 adhesives are supplied in two parts that do not require lot matching. The 1:1 mix ratio, by weight or volume, simplifies the proportioning process. To ensure uniform distribution of filler, Parts A and B must each be thoroughly mixed prior to their combination in a 1:1 ratio. When thoroughly blended, the Part A and B liquid mixture should have a uniform appearance. The presence of light colored streaks or marbling indicates inadequate mixing and will result in incomplete cure. For fast-curing adhesives automated mix and dispense equipment should be utilized.
In applications sensitive to air entrapment, de-airing with 28 to 30 inches Hg vacuum is required.
Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
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Tack Free Time Test Methods
|Tack Free Time||Tack Free Temperature|
Viscosity Test Methods
Work / Pot Time Test Methods
|Work / Pot Time||Test Method||Temperature|
|360 min||Pot Life||25°C|
Shear Strength Test Methods
|Shear Strength||Type||Substrate||Test Method|
|240 psi||Lap shear strength||Aluminum||Unprimed Adhesion|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|
Specific Gravity Test Methods
|Specific Gravity||Test Method|