• Description for Dow Dowsil SE 1720 CV

    • Two-part • Flowable • 1:1 mix ratio • Heat cure • Energy and time savings when cured at lower temperature or times

    *See Terms of Use Below

    Brand Dowsil
    Application Type Sealing, Bonding
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramics, Glass, Reactive metals, Plastics, Many reactive metals, Selected plastics
    Industry Electronics: Circuit boards, Electronics: Sealing PCB module components, Electronics: Connectors, Electronic components, Electronics: Flyback transformer, Electronic modules, Electronics parts
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Heat, 2-Part Cure
    Cure Temperature (°C) Faster or lower, 70, 80, 100
    Cure Time (min) Fast, 50, 30, 10
    Viscosity (cPs) Non-slump, 85,000, 89,700
    Color White
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Fast
Viscosity Test Methods
Viscosity Test Method
85,000 cPs
Non-slump
89,700 cPs Mixed
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
360 min Pot Life 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
240 psi Lap shear strength Aluminum Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.70 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 1 MHz
Specific Gravity Test Methods
Specific Gravity Test Method
1.060 Cured