Dow Dowsil SE 9185 Clear or White Adhesive

Dow Dowsil SE 9185 Clear or White Adhesive Datasheet
  • Description for Dow Dowsil SE 9185 Clear or White Adhesive

    A one-part moisture cure adhesives, translucent or white, non-flowing adhesive, fast tack free with controlled volatility, Sealing PCB System assembly equipment and modules

    *See Terms of Use Below

    Brand Dowsil
    Application Type Seal, Gaskets, Bond
    1 Part or 2 Part 1 Part
    Material Form Pre-Cure: Liquid, Post-Cure: Elastomer
    Substrate Ceramics, Glass, Many reactive metals, Selected plastics, Selected resins
    Industry CRT module, Light Emitting Diodes (LEDs), Advanced driver-assistance systems (ADAS), E-Mobility Solutions, Smart Meters, Sealing PCB system assembly equipment , Smart Home Devices, Electronic equipment, Fixing parts on circuit board, LCD module, Sealing modules, PDP module
    Manufacturer Dow
    Chemistry Polydimethylsiloxane
    Cure Method Moisture, RTV, Room temperature
    Cure Temperature (°C) 20 to 25 Room temperature
    Cure Time (min) 1,440 to 4,320
    Viscosity (cPs) Non-flowing
    Color Translucent, White, Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Durability Durable
  • Technical Data for Dow Dowsil SE 9185 Clear or White Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Elastomer - Post-Cure: Elastomer
      • Liquid - Pre-Cure: Liquid
    • Substrate
      • Ceramic - Ceramics
      • Glass
      • Metal - Many reactive metals
      • Plastic - Selected plastics, Selected resins
      • Other - Selected laminates
    • Industry
      • LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
      • Advanced driver-assistance systems (ADAS)
      • E-Mobility Solutions
      • Electronics - CRT module, Electronic equipment, LCD module, Sealing modules, PDP module
      • Smart Meters
      • Printed Circuit Board (PCB) - Sealing PCB system assembly equipment , Fixing parts on circuit board
      • Smart Home Devices
      • Power Supplies
      • Industrial - Housings
    • Chemistry
    • Application Method
      • Dispenser - Automated or manual needle dispense systems
    • Cure Method
      • Room Temperature / Air Dry - Room temperature
      • Moisture / Condensation Cure - Moisture
      • RTV (Room Temperature Vulcanization) - RTV
    • Color
      • Translucent
      • Clear / Transparent - Clear
      • White
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room temperature
    Cure Time (min) 1,440 to 4,320
    Viscosity (cPs) Non-flowing
    Tack Free Time (min) Fast, 8 Test Method
    Work / Pot Time (min) <60
    Bond Strength
    Shear Strength (psi) 83 Test Method
    Tensile Strength (psi) 435
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Conductivity
    Dissipation Factor 0.00070 Test Method
    Dielectric Strength (V/mil) Good, 550
    Dielectric Constant 2.80 Test Method
    Volume Resistivity (O) 2.0 E+16 (ohm*cm)
    Hardness
    Durability Durable
    Shore A Hardness 31 Test Method
    Elongation (%) 515
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.050 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F).
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 15
    Not Good For
    Don't Use With Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized, Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon®, Polyethylene, Polypropylene
  • Best Practices for Dow Dowsil SE 9185 Clear or White Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, cohesive failure of the product in a lap shear or similar test is needed to ensure compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Fast
8 min 25°C
Shear Strength Test Methods
Shear Strength Type Substrate
83 psi Lap shear Glass
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.80 1MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00070 1MHz
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
31 Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
1.050 Cured