Dow Fluorogel Q3-6679 Dielectric Gel

Dow Fluorogel Q3-6679 Dielectric Gel Datasheet
  • Description for Dow Fluorogel Q3-6679 Dielectric Gel

    A two-part, clear, solvent resistant gel, room temperature or heat cure, long working time, resistant to fuels.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Circuits, E-Mobility Solutions, Smart Meters, Smart Home Devices, PCB system assemblies, Electronics, Optoelectronics, Interconnections
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2-Part Cure, Heat cure, Room temperature cure
    Cure Temperature (°C) 20 to 25 Room temperature, 100
    Cure Time (min) 120, Very fast
    Viscosity (cPs) 1,100, Controlled flow
    Color Clear
    Chemical Resistance Resistant to fuels
    Relative Solvent Resistance Chemical Resistance: Solvent resistant
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Stress Relief Stress relief
    Light Refractive Index (RI) High, 1.3900
  • Technical Data for Dow Fluorogel Q3-6679 Dielectric Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Gel
    • Industry
      • E-Mobility Solutions
      • Electronics - Circuits, Optoelectronics, Interconnections
      • Smart Meters
      • Smart Home Devices
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Industrial - Delicate components
      • Other - Sensitive applications
    • Chemistry
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • Heat - Heat cure
      • 2-Part Cure
    • Color
      • Clear / Transparent - Clear
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room temperature, 100 Test Method
    Cure Time (min) 120, Very fast Test Method
    Viscosity (cPs) 1,100, Controlled flow Test Method
    Set Time (min) 7 Test Method
    Work / Pot Time (min) >240, Long Test Method
    Thixotropic Thixotropic
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Material Resistance
    Chemical Resistance Resistant to fuels
    Relative Solvent Resistance Chemical Resistance: Solvent resistant
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.03730, 0.00410 Test Method
    Dielectric Strength (V/mil) Excellent
    Dielectric Constant 7.35, 7.27 Test Method
    Volume Resistivity (O) 4.01E+12 (ohm*cm) Test Method
    Hardness
    Stress Relief Stress relief
    Dimensional Stability Dimensional stability
    Flexibility Extremely soft, Flexible, Resilient
    Other Properties
    Light Refractive Index (RI) High, 1.3900 Test Method
    Specific Gravity 1.260 Test Method
    Coefficient of Thermal Expansion (CTE) 690 (µm/(m·°C))
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Some solder flux residues, Chemicals, Other organometallic compounds, Sulfur, Polysulfides, Unsaturated hydrocarbon plasitcizers, Organotin, Silicone rubber containing organotin catalyst, Polysulfides, Other sulfur containing materials
    Don't Use With Certain materials, Curing agents, Plasticizers
  • Best Practices for Dow Fluorogel Q3-6679 Dielectric Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.

    2. Deairing/Degassing

      If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    3. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room temperature
100°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
120 min Heat Cure
Very fast
Viscosity Test Methods
Viscosity Test Method
1,100 cPs Mixed, These values are not intended for use in preparing specifications.
Controlled flow
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
>240 min These values are not intended for use in preparing specifications. 25°C
Long 20 to 25°C RT
Set Time Test Methods
Set Time Set Temperature Test Method
7 min 135°C Gel Time, These values are not intended for use in preparing specifications.
Dielectric Constant Test Methods
Dielectric Constant Test Method
7.35 At 100 Hz, These values are not intended for use in preparing specifications.
7.27 At 100 kHz, These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.03730 At 100 hz, These values are not intended for use in preparing specifications.
0.00410 At 100 kHz, These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
4.01E+12 (ohm*cm) These values are not intended for use in preparing specifications.
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
High
1.3900 These values are not intended for use in preparing specifications.
Specific Gravity Test Methods
Specific Gravity Test Method
1.260 Uncured, These values are not intended for use in preparing specifications.