

-
Description for Dow Fluorogel Q3-6679 Dielectric Gel
A two-part, clear, solvent resistant gel, room temperature or heat cure, long working time, resistant to fuels.Chemical Resistance Resistant to fuels, Chemical Resistance: Solvent resistant Application Type Seal 1 Part or 2 Part 2-Part Material Form Gel Industry Circuits, E-Mobility Solutions, Smart Meters, Smart Home Devices, PCB system assemblies, Electronics, Optoelectronics, Interconnections Manufacturer Dow Chemistry Silicone, Solvent-free Cure Method 2-Part Cure, Heat cure, Room temperature cure Cure Temperature (°C) 20 to 25 Room temperature, 100 Cure Time (min) 120, Very fast Viscosity (cPs) 1,100, Controlled flow Color Clear High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 4.01E+12 (ohm*cm) Stress Relief Stress relief Light Refractive Index (RI) High, 1.3900 -
Technical Data for Dow Fluorogel Q3-6679 Dielectric Gel
Overview
-
Chemical Resistance
- Chemical Resistance - Resistant to fuels
- Chemical Resistance : Relative Solvent Resistance - Solvent resistant
-
Application Type
- Sealant - Seal
-
1 Part or 2 Part
- 2-Part
-
Material Form
- Gel
-
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Circuits, Optoelectronics, Interconnections
- Printed Circuit Board (PCB) - PCB system assemblies
- Industrial - Delicate components
- Other - Sensitive applications
-
Chemistry
-
Application Method
- Dispenser - Automated dispensing equipment
-
Cure Method
- Room Temperature / Air Dry - Room temperature cure
- Heat - Heat cure
- 2-Part Cure
-
Color
- Clear / Transparent - Clear
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Room temperature, 100 Test Method Cure Time (min) 120, Very fast Test Method Viscosity (cPs) 1,100, Controlled flow Test Method Set Time (min) 7 Test Method Work / Pot Time (min) >240, Long Test Method Thixotropic Thixotropic Mix Ratio 1:1 (by volume), 1:1 (by weight) Material Resistance
Dimensional Stability (%) Dimensional stability High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.03730, 0.00410 Test Method Dielectric Strength (V/mil) Excellent Dielectric Constant 7.35, 7.27 Test Method Volume Resistivity (O) 4.01E+12 (ohm*cm) Test Method Hardness
Stress Relief Stress relief Flexibility Extremely soft, Flexible, Resilient Other Properties
Light Refractive Index (RI) High, 1.3900 Test Method Specific Gravity 1.260 Test Method Coefficient of Thermal Expansion (CTE) 690 (µm/(m·°C)) Business Information
Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label. Shelf Life Temperature (°F) 77 Shelf Life (mon) 12 Not Good For
Don't Use For Some solder flux residues, Chemicals, Other organometallic compounds, Sulfur, Polysulfides, Unsaturated hydrocarbon plasitcizers, Organotin, Silicone rubber containing organotin catalyst, Polysulfides, Other sulfur containing materials Don't Use With Certain materials, Curing agents, Plasticizers -
-
Best Practices for Dow Fluorogel Q3-6679 Dielectric Gel
-
Mixing
Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.
-
Deairing/Degassing
If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
-
Testing
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
-
-
Comparable Materials for Dow Fluorogel Q3-6679 Dielectric Gel
Spec Engine® Results
Popular Articles
Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleSilicones in LED Lighting | Gluespec
Read ArticleTesting the effectiveness of surface treatments
Read ArticleWhat Are the Differences Between Adhesives and Sealants?
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads

Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
20 to 25°C Room temperature | |
100°C | Heat Cure |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
120 min | Heat Cure |
Very fast |
Viscosity Test Methods
Viscosity | Test Method |
---|---|
1,100 cPs | Mixed, These values are not intended for use in preparing specifications. |
Controlled flow |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
>240 min | These values are not intended for use in preparing specifications. | 25°C |
Long | 20 to 25°C RT |
Set Time Test Methods
Set Time | Set Temperature | Test Method |
---|---|---|
7 min | 135°C | Gel Time, These values are not intended for use in preparing specifications. |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
7.35 | At 100 Hz, These values are not intended for use in preparing specifications. |
7.27 | At 100 kHz, These values are not intended for use in preparing specifications. |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
---|---|
0.03730 | At 100 hz, These values are not intended for use in preparing specifications. |
0.00410 | At 100 kHz, These values are not intended for use in preparing specifications. |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
---|---|
4.01E+12 (ohm*cm) | These values are not intended for use in preparing specifications. |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Test Method |
---|---|
High | |
1.3900 | These values are not intended for use in preparing specifications. |
Specific Gravity Test Methods
Specific Gravity | Test Method |
---|---|
1.260 | Uncured, These values are not intended for use in preparing specifications. |

1 VIEW FREE
Don't Leave!
View Dow - Fluorogel Q3-6679 Dielectric Gel now.