Dow JCR 6109

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Description for Dow JCR 6109

Translucent, low-modulus LED gel encapsulant; very long working time.

Application Type	Seal
1 Part or 2 Part	1 Part
Material Form	Liquid
Industry	Light Emitting Diodes (LEDs)
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	Heat
Cure Temperature (°C)	70, 150
Cure Time (min)	60, 960
Viscosity (cPs)	3,900
Color	Translucent
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45
Light Refractive Index (RI)	1.4240, 1.4140, 1.4130

Best Practices for Dow JCR 6109

*See Terms of Use Below

Surface Preparation

Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.
Application

These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application.
Clean-Up

Dow Corning OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
Testing

If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

*See Terms of Use Below
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Light Refractive Index (RI) Test Methods

Light Refractive Index (RI)	Test Method
1.4240	Cures at 633 nm
1.4140	Cured at 1321 nm
1.4130	Cured at 1554 nm

Dow JCR 6109

Description for Dow JCR 6109

Best Practices for Dow JCR 6109

Surface Preparation

Application

Clean-Up