Dow Q3-6575 Dielectric Gel A/B Kit

Dow Q3-6575 Dielectric Gel A/B Kit Datasheet
  • Description for Dow Q3-6575 Dielectric Gel A/B Kit

    Extremely soft to medium hardness, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wider temperature range than the other types of gels.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Circuits, Electronics, Optoelectronics
    Manufacturer Dow Corning
    Chemistry Silicone, Solvent-free
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 20 to 25, 70, 100
    Cure Time (min) 300, 1,440, 40, 20
    Viscosity (cPs) 750
    Color Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -80
    Light Refractive Index (RI) High
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
20 min Time to double initial viscosity initial mixed viscosity for two-part products at room temperature. This property is sometimes referred to as pot life. 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.82 Dielectric constant, 100 Hz
2.83 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 Dissipation factor, 100 Hz
<0.00010 Dissipation factor, 100 KHz
Specific Gravity Test Methods
Specific Gravity Test Method
1.020 Cured or uncured A & B.