Dow SE 1885 M Kit

Dow SE 1885 M Kit Datasheet
  • Description for Dow SE 1885 M Kit

    Extremely soft to medium hardness, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wider temperature range than the other types of gels.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Circuits, Electronics, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 150
    Cure Time (min) 30
    Viscosity (cPs) Low, 800
    Color Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -80
    Light Refractive Index (RI) High
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Dielectric Constant Test Methods
Dielectric Constant Test Method
2.75 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00020 1 MHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Cured or uncured A & B.