Dow SE 1886 Kit

Dow SE 1886 Kit Datasheet
  • Description for Dow SE 1886 Kit

    Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Gel, Liquid
    Industry Circuits, Electronics, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Addition cure, Part A/Part B
    Cure Temperature (°C) 20 to 25, 130
    Viscosity (cPs) 1,100
    Color Clear
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data

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  • Best Practices

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  • Comparable Materials

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.70 Dielectric constant, 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
<0.00010 Dissipation factor, 1 MHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.980 Cured or uncured A & B.