| Application Type | Seal, Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Paste |
| Manufacturer | Dow |
| Chemistry | Silicone |
| Cure Method | Moisture |
| Cure Time (min) | 1,440 to 10,080 |
| High Temperature Resistance (°C) | 200 |
| Low Temperature Resistance (°C) | -40 |
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