Dow Sylgard 527 Silicone Dielectric Gel

Dow Sylgard 527 Silicone Dielectric Gel Datasheet
  • Description for Dow Sylgard 527 Silicone Dielectric Gel

    Two-part, 1 to 1 mix ratio dielectric gel, Room temperature or heat accelerated cure, Available in clear or red, Low viscosity allows good flow under components, UL flammability rating

    *See Terms of Use Below

    Brand Sylgard
    Application Type Sealing, Coating, Encapsulating, Potting
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Sealing various electronic devices, E-Mobility Solutions, Smart Meters, Protecting various electronic devices, Delicate components, Protect circuits from thermal and mechanical stresses, Protect interconnections from thermal and mechanical stresses, Isolate circuits from the harmful effects of moisture, Isolate circuits from the harmful effects of other contaminants, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2-Part Cure, Heat cure, Room Temperature Cure
    Cure Temperature (°C) 20 to 25 Room Temperature, 100, 125, 150
    Cure Time (min) 210, 75, 35
    Viscosity (cPs) 465, Low, Good flow under components
    Color Red, Clear
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Stress Relief Stress relief
    Light Refractive Index (RI) High
  • Technical Data for Dow Sylgard 527 Silicone Dielectric Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Gel
    • Industry
      • E-Mobility Solutions
      • Electronics - Sealing various electronic devices, Protecting various electronic devices, Delicate components, Protect circuits from thermal and mechanical stresses, Protect interconnections from thermal and mechanical stresses, Isolate circuits from the harmful effects of moisture, Isolate circuits from the harmful effects of other contaminants, Optoelectronics
      • Smart Meters
      • Industrial - Delicate components
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • Room Temperature / Air Dry - Room Temperature Cure
      • Heat - Heat cure
      • 2-Part Cure
    • Color
      • Clear / Transparent - Clear
      • Red
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 100, 125, 150 Test Method
    Cure Time (min) 210, 75, 35 Test Method
    Viscosity (cPs) 465, Low, Good flow under components Test Method
    Mix Ratio 1:1
    Material Resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00200, 0.00010 Test Method
    Dielectric Strength (V/mil) Excellent, 425, Provide electrical insulation for high voltages
    Dielectric Constant 2.85, 2.85 Test Method
    Volume Resistivity (O) 2.75 E+15 (ohms/cm)
    Hardness
    Stress Relief Stress relief
    Flexibility Flexibility, Resilient
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.950 Test Method
    Coefficient of Thermal Expansion (CTE) 335 (ppm/ºC) Test Method
    Flash Point (°F) 212.0
    Business Information
    Shelf Life Details Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35°C, unless otherwise noted.;Storage conditions and shelf life (“Use By” date) are indicated on the product label., Shelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements.
    Shelf Life Temperature (°F) <95
    Shelf Life Type From date of manufacture, Shelf Life Type
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Some solder flux residues, Polysulfides, Polysulfones, Other sulfur containing materials
    Don't Use With Plastic, Rubber, Non-reactive metal substrates, Teflon®, Non-reactive plastic surfaces, Polyethylene, Polypropylene, Plastic or Rubber Substrates that are Highly Plasticized
  • Best Practices for Dow Sylgard 527 Silicone Dielectric Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. In general, gels are supplied as two-part products that are mixed in a 1:1 ratio (Parts A and B)

      one-part gels are available that eliminate the need for mixing. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    2. Curing

      Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). The cure reaction begins when Parts A and B are mixed. As the cure progresses, viscosity increases until the material becomes a soft gel. Cure is defined as the time required for a specific gel to reach 90% of its final properties Gels will reach a no-flow state prior to full cure. Addition-cure silicone gels may be room temperature and heat cure or exclusively heat cure. Adding heat accelerates the cure reaction. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application.

    3. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room Temperature
100°C Heat Cure, (T90)
125°C Heat Cure, (T90)
150°C Heat Cure, (T90)
Cure Time Test Methods
Cure Time Test Method
210 min Heat Cure, (T90)
75 min Heat Cure, (T90)
35 min Heat Cure, (T90)
Viscosity Test Methods
Viscosity Test Method
465 cPs Mixed
Low
Good flow under components
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 At 100 Hz
2.85 At 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 At 100 Hz
0.00010 At 100 kHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.950 Uncured
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
335 (ppm/ºC) By TMA
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