Dow Sylgard 528 Firm Gel Parts A & B

Dow Sylgard 528 Firm Gel Parts A & B Datasheet
  • Description for Dow Sylgard 528 Firm Gel Parts A & B

    Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

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    Brand Sylgard
    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Circuits, E-Mobility Solutions, Electronics, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Part A/Part B, Heat
    Cure Temperature (°C) 20 to 25, 120
    Cure Time (min) 80
    Viscosity (cPs) Low, 400
    Color Clear
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Durability Tough
    Light Refractive Index (RI) High
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Work / Pot Time Test Methods
Work / Pot Time Temperature
360 min 25°C
Long
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Cured or uncured A & B.