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Description for Dow Sylgard 528 Firm Gel Parts A & B
Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.Brand Sylgard Application Type Seal 1 Part or 2 Part 2 Part Material Form Gel Industry Circuits, Smart Meters, E-Mobility Solutions, Smart Home Devices, Electronics, Optoelectronics Manufacturer Dow Chemistry Silicone, Solvent-free Cure Method Part A/Part B, Heat Cure Temperature (°C) 20 to 25, 120 Cure Time (min) 80 Viscosity (cPs) Low, 400 Color Clear High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -45, -55 Durability Tough Light Refractive Index (RI) High
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