Brand Sylgard Application Type Seal 1 Part or 2 Part 1 Part Material Form Gel Industry Circuits, E-Mobility Solutions, Smart Meters, Smart Home Devices, Electronics, Optoelectronics, Interconnections Manufacturer Dow Chemistry Silicone, Solvent-free Cure Method Heat cure, 2-Part Cure Cure Temperature (°C) 20 to 25, 150 Cure Time (min) 60, Very fast Viscosity (cPs) Controlled flow, 2,925 Color Translucent Chemical Resistance Resistance to some solvents, Resistance to fuels High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Stress Relief Stress relief Light Refractive Index (RI) High
Technical Data for Dow Sylgard 535 Thixotropic Dielectric Gel
- Sealant - Seal
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Dispenser - Automated dispensing equipment
- Heat - Heat cure
- 2-Part Cure
Cure Temperature (°C) 20 to 25, 150 Test Method Cure Time (min) 60, Very fast Test Method Viscosity (cPs) Controlled flow, 2,925 Test Method Thixotropic Thixotropic
Dimensional Stability (%) Dimensional stability Chemical Resistance Resistance to some solvents, Resistance to fuels High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dielectric Strength (V/mil) Excellent, 279 Volume Resistivity (O) 6.0 E+14 (ohm*cm) Test Method
Stress Relief Stress relief Flexibility Firm, Flexible, Resilient, Extremely soft
Light Refractive Index (RI) High Specific Gravity 0.970 Test Method
Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label. Shelf Life Temperature (°F) 41 Shelf Life (mon) 9
Not Good For
Don't Use For Other sulfur containing materials, Polysulfides, Silicone rubber containing organotin catalyst, Organotin, Some solder flux residues, Polysulfones, Sulfur, Other organometallic compounds, Chemicals Don't Use With Unsaturated hydrocarbon plasitcizers, Curing agents, Plasticizers, Certain materials
Best Practices for Dow Sylgard 535 Thixotropic Dielectric Gel
Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.
If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
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Cure Temperature Test Methods
|Cure Temperature||Cure Time Test Method|
|20 to 25°C|
|150°C||Heat Cure, These values are not intended for use in preparing specifications.|
Cure Time Test Methods
|Cure Time||Test Method|
|60 min||Heat Cure, These values are not intended for use in preparing specifications.|
Viscosity Test Methods
|2,925 cPs||These values are not intended for use in preparing specifications.|
Volume Resistivity Test Methods
|Volume Resistivity||Test Method|
|6.0 E+14 (ohm*cm)||These values are not intended for use in preparing specifications.|
Specific Gravity Test Methods
|Specific Gravity||Test Method|
|0.970||Cured or uncured A & B.|