Dow Sylgard 535 Thixotropic Dielectric Gel Datasheet Dow Sylgard 535 Thixotropic Dielectric Gel

Information provided by Gluespec
  • Description for Dow Sylgard 535 Thixotropic Dielectric Gel

    A 1-part, translucent, thixotropic gel, heat cure, resistance to some solvents and fuels, controlled volatility gels for sensitive applications, and UV curing.

    *See Terms of Use Below

    Brand Sylgard
    Chemical Resistance Resistance to some solvents, Resistance to fuels
    Application Type Seal
    1 Part or 2 Part 1-Part
    Material Form Gel
    Industry Circuits, Smart Meters, E-Mobility Solutions, Smart Home Devices, Electronics, Optoelectronics, Interconnections
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2-Part Cure, Heat cure
    Cure Temperature (°C) 20 to 25, 150
    Cure Time (min) 60, Very fast
    Viscosity (cPs) Controlled flow, 2,925
    Color Translucent
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 6.0 E+14 (ohm*cm)
    Stress Relief Stress relief
    Light Refractive Index (RI) High
  • Technical Data for Dow Sylgard 535 Thixotropic Dielectric Gel

    Overview
    • Chemical Resistance
      • Chemical Resistance - Resistance to fuels, Resistance to some solvents
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Gel
    • Industry
      • Smart Meters
      • Smart Home Devices
      • E-Mobility Solutions
      • Electronics - Circuits, Optoelectronics, Interconnections
      • Industrial - Delicate components
      • Other - Sensitive applications
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • Heat - Heat cure
      • 2-Part Cure
    • Color
      • Translucent
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 150 Test Method
    Cure Time (min) 60, Very fast Test Method
    Viscosity (cPs) Controlled flow, 2,925 Test Method
    Thixotropic Thixotropic
    Material Resistance
    Dimensional Stability (%) Dimensional stability
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dielectric Strength (V/mil) Excellent, 279
    Volume Resistivity (O) 6.0 E+14 (ohm*cm) Test Method
    Hardness
    Stress Relief Stress relief
    Flexibility Firm, Flexible, Resilient, Extremely soft
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.970 Test Method
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 41
    Shelf Life (mon) 9
    Not Good For
    Don't Use For Other sulfur containing materials, Polysulfides, Silicone rubber containing organotin catalyst, Organotin, Some solder flux residues, Polysulfones, Sulfur, Other organometallic compounds, Chemicals
    Don't Use With Unsaturated hydrocarbon plasitcizers, Curing agents, Plasticizers, Certain materials
  • Best Practices for Dow Sylgard 535 Thixotropic Dielectric Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.

    2. Deairing/Degassing

      If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    3. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

  • Comparable Materials for Dow Sylgard 535 Thixotropic Dielectric Gel

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
150°C Heat Cure, These values are not intended for use in preparing specifications.
Cure Time Test Methods
Cure Time Test Method
60 min Heat Cure, These values are not intended for use in preparing specifications.
Very fast
Viscosity Test Methods
Viscosity Test Method
Controlled flow
2,925 cPs These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
6.0 E+14 (ohm*cm) These values are not intended for use in preparing specifications.
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Cured or uncured A & B.