Dow Sylgard 535 Thixotropic Dielectric Gel

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Description for Dow Sylgard 535 Thixotropic Dielectric Gel

A 1-part, translucent, thixotropic gel, heat cure, resistance to some solvents and fuels, controlled volatility gels for sensitive applications, and UV curing.

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Brand	Sylgard
Chemical Resistance	Resistance to some solvents, Resistance to fuels
Application Type	Seal
1 Part or 2 Part	1-Part
Material Form	Gel
Industry	Circuits, Smart Meters, E-Mobility Solutions, Smart Home Devices, Electronics, Optoelectronics, Interconnections
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	2-Part Cure, Heat cure
Cure Temperature (°C)	20 to 25, 150
Cure Time (min)	60, Very fast
Viscosity (cPs)	Controlled flow, 2,925
Color	Translucent
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	6.0 E+14 (ohm*cm)
Stress Relief	Stress relief
Light Refractive Index (RI)	High

Best Practices for Dow Sylgard 535 Thixotropic Dielectric Gel

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Technical Data for Dow Sylgard 535 Thixotropic Dielectric Gel

*See Terms of Use Below

Overview

Chemical Resistance
- Chemical Resistance - Resistance to fuels, Resistance to some solvents
Application Type
- Sealant - Seal
1 Part or 2 Part
- 1-Part
Material Form
- Gel
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Circuits, Optoelectronics, Interconnections
- Industrial - Delicate components
- Other - Sensitive applications
Chemistry
- Solvent-Free
- Silicone
Application Method
- Dispenser - Automated dispensing equipment
Cure Method
- Heat - Heat cure
- 2-Part Cure
Color
- Translucent
Brand
- Sylgard

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25, 150	Test Method
Cure Time (min)	60, Very fast	Test Method
Viscosity (cPs)	Controlled flow, 2,925	Test Method
Thixotropic	Thixotropic

Material Resistance

Dimensional Stability (%)	Dimensional stability
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dielectric Strength (V/mil)	Excellent, 279
Volume Resistivity (O)	6.0 E+14 (ohm*cm)	Test Method

Hardness

Stress Relief	Stress relief
Flexibility	Firm, Flexible, Resilient, Extremely soft

Other Properties

Light Refractive Index (RI)	High
Specific Gravity	0.970	Test Method

Business Information

Shelf Life Details	Storage conditions and shelf life (“Use By” date) are indicated on the product label.
Shelf Life Temperature (°F)	41
Shelf Life (mon)	9

Not Good For

Don't Use For	Other sulfur containing materials, Polysulfides, Silicone rubber containing organotin catalyst, Organotin, Some solder flux residues, Polysulfones, Sulfur, Other organometallic compounds, Chemicals
Don't Use With	Unsaturated hydrocarbon plasitcizers, Curing agents, Plasticizers, Certain materials

Best Practices for Dow Sylgard 535 Thixotropic Dielectric Gel

*See Terms of Use Below
1. Mixing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.
2. Deairing/Degassing
  
  If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
3. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
Comparable Materials for Dow Sylgard 535 Thixotropic Dielectric Gel

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Spec Engine^® Results
- Dowsil X3-1598 Adhesive(Dow)
  Noncorrosive; self-priming; rapid heat cure; high strength; flowable; contains UV indicator for automated inspection.
- SE 1880 Clear & Blue (Controlled Volatility)(Dow)
  Extremely soft to medium hardness, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wider temperature range than the other types of gels.
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