Dow TC-5022 Thermally ConDuctive Compound

Dow TC-5022 Thermally ConDuctive Compound Datasheet
  • Description for Dow TC-5022 Thermally ConDuctive Compound

    Non-curing, thermally conductive silicone paste; low thermal resistance; high thermal conductivity.

    Note: This material has been discontinued. Please view the Manufacturer's Recommended Replacement tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 1 Part
    Material Form Grease, Paste, Compound
    Industry Electronics, Thermal interface for CPUs, Chassis, Heat sink
    Manufacturer Dow
    Chemistry Silicone paste
    Cure Temperature (°C) 20 to 25
    Viscosity (cPs) 91,000
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Other Resistance Thermal
  • Technical Data for Dow TC-5022 Thermally ConDuctive Compound

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Compound
      • Paste
      • Grease
    • Industry
    • Chemistry
    • Application Method
      • Dispenser
      • Screen Print - Stencil print
    • Cure Method
      • None - Non-Curing
    • Color
      • Gray
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25
    Viscosity (cPs) 91,000 Test Method
    Work / Pot Time (min) N/A Test Method
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Other Resistance Thermal
    Conductivity
    Dissipation Factor 0.12800 Test Method
    Filler Heat conductive metal oxides
    Dielectric Strength (V/mil) Durable, 4,527,559, Low
    Dielectric Constant 18.00 Test Method
    Thermal Conductivity (W/m°K) High, 4.00 Test Method
    Volume Resistivity (O) 55000000000 (ohms/cm)
    Other Properties
    Specific Gravity 3.230
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.
  • Best Practices for Dow TC-5022 Thermally ConDuctive Compound

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    3. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

  • Manufacturer's Recommended Replacement Materials

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Test Method
91,000 cPs Measurement after dilution with 1 wt % Dow Corning® OS-30 Fluid.
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
N/A Time to double initial mixed viscosity. 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
18.00 Dielectric constant, 1 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.12800 Dissipation factor, 1 KHz
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
High 25°C
4.00 W/m°K