Elantas (Altana) FP-1303

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Description for Elantas (Altana) FP-1303

A two-component, unfilled, fast setting polyurethane sealant designed for use in Hepa and other air filtration devices. It is also used for potting, casting, embedding, and encapsulating of electronic circuits, components, and power devices.

Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

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Brand	Cytec
Application Type	Seal
1 Part or 2 Part	2 Part
Material Form	Liquid
Industry	electronic circuits, air filtration devices, components, power devices
Manufacturer	Elantas (Altana)
Chemistry	polyurethane
Cure Method	Resin/Hardener
Cure Temperature (°C)	35, 25, 80
Cure Time (min)	10,080, 240
Viscosity (cPs)	1,100
Color	Amber, White
High Temperature Resistance (°C)	54
Low Temperature Resistance (°C)	-54

Best Practices for Elantas (Altana) FP-1303

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Technical Data for Elantas (Altana) FP-1303

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Overview

Application Type
- Sealant - Seal
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
Material Form
- Liquid
Industry
- Electronics - electronic circuits, components, power devices
- Industrial - machine casting and rapid production.
- Filters - air filtration devices
- Other - Hepa
Chemistry
- Polyurethane
Application Method
- Other - hand processing
Cure Method
- 2-Part Cure - Resin/Hardener
Color
- Red - Amber
- White
Brand
- Cytec

Specifications

Cure Specs

Cure Temperature (°C)	35, 25, 80	Test Method
Cure Time (min)	10,080, 240	Test Method
Viscosity (cPs)	1,100	Test Method
Set Time (min)	Fast, 12	Test Method
Work / Pot Time (min)	2.00	Test Method
Mix Ratio	100:116 (by weight)

Bond Strength

Tear Strength (piw)	119 (pli)
Tensile Strength (psi)	2,000

Material Resistance

High Temperature Resistance (°C)	54
Low Temperature Resistance (°C)	-54

Conductivity

Dissipation Factor	0.01700, 0.03000	Test Method
Filler	Unfilled
Insulation Resistance (O)	>2.5e13 (ohms), Insulation Resistance, 1.4e9 (ohms)	Test Method
Dielectric Strength (V/mil)	650 (vpm)	Test Method
Dielectric Constant	3.40, 6.10	Test Method
Thermal Conductivity (W/m°K)	7.1e-4 (CAL/SEC/CM2/°C/CM)
Surface Resistivity (O)	>1.0e15 (ohms), 6.9e12 (ohms)	Test Method
Volume Resistivity (O)	7.2e14 (ohm-cm), 1.8e11 (ohm-cm)	Test Method

Hardness

Shore A Hardness	80
Elongation (%)	155

Other Properties

Specific Gravity	1.070	Test Method

Business Information

Shelf Life Details	The Part A and Part B components of these systems are storage stable in their original, unopened containers for 18 months from the date of manufacture when stored at 65-85°F.
Shelf Life Temperature (°F)	149 to 185
Shelf Life Type	From the date of manufacture
Shelf Life (mon)	18

Best Practices for Elantas (Altana) FP-1303

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1. Application
  
  Pour into dry preheated units. Best results are generally obtained when the unit is at least 10°C warmer than the mixed material. Pour down the side of the unit to be potted to avoid air entrapment.
2. Mixing
  
  Mix the two components together thoroughly at room temperature in metal, plastic, or glass containers, using a metal spatula. DO NOT use paper containers or wooden sticks. Any moisture introduced into the system will cause bubbling and/or foaming during curing.
3. Deairing/Degassing
  
  If void-free castings are required for the particular application, degas the mixed system at 1-5mm of mercury vacuum. Allow froth to rise and collapse, continue vacuum for 2-5 minutes. Containers should generally have twice the volume of mixed material to allow for frothing.
4. Curing
  
  If the potted device is to be heat cured, it is best to allow the device to sit at room temperature for 1-2 hours to permit air bubbles, entrapped during pouring, to dissipate.
Comparable Materials for Elantas (Altana) FP-1303

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Spec Engine^® Results
- 20-2162 Urethane Sealant, Adhesive & Potting Compound(Epoxies Etc)
  Epoxies Etc 20-2162 Urethane Sealant, Adhesive & Potting Compound is a 2 Part Iso/Polyol Urethane Liquid used to Seal
- US1150(Henkel)
  An extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards.
- EL500F(Resinlab)
  A rigid, two-part, fast curing polyurethane adhesive, Bonding, Sealing, Structural support, Fast-curing, Hard, Good adhesion to substrate
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- Conap AD-6402(Elantas (Altana))
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