WEICON Silicone F

WEICON Silicone F Datasheet
  • Description for WEICON Silicone F

    WEICON Silicone F is a 1 Part Humidity Free of solvents Liquid used to Seal Glass, Aluminium and Steel

    *See Terms of Use Below

    Application Type Sealing, Casting, Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Glass, Aluminium, Steel, Ceramics
    Industry Electrical industry
    Manufacturer WEICON
    Chemistry Free of solvents, 1-C polysiloxane (oxime)
    Cure Method Humidity
    Cure Temperature (°C) 5 to 40, 23
    Gap Fill Up to max. 3 mm
    Cure Time (min) 1,440
    Viscosity (cPs) Self-levelling, 30,000
    Color Transparent
    High Temperature Resistance (°C) 180
    Low Temperature Resistance (°C) -50
    Other Resistance Resistant to ageing
    Density (g/cm³) 1.030
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
5 to 40°C 30 % to 95 % rel. humidity
23°C 2 -3 mm; Measured at 50% relative air humidity
Tack Free Time Test Methods
Tack Free Time Test Method
15 min Skin-overtime; Measured at 50% relative air humidity and +23 °C
Cure Time Test Methods
Cure Time Test Method
1,440 min 2 -3 mm; Measured at 50% relative air humidity
Tensile Strength Test Methods
Tensile Strength Test Method
261 psi Acc. to ISO 37, S3A
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
5 to 15 DIN 5355 / ASTM D 224
Elongation Test Methods
Elongation Test Method
600 % At break acc. to ISO 37, S3A