Resin Designs TP-1500 Thermally ConDuctive Pad Datasheet Resin Designs TP-1500 Thermally ConDuctive Pad

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  • Description for Resin Designs TP-1500 Thermally ConDuctive Pad

    Thin thermal interface; fiberglass reinforced; both sides tacky.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Chemical Resistance Good
    Application Type Thermal Interface Material
    1 Part or 2 Part 1-Part
    Material Form Gel, Solid, Pad
    Industry Heat sinks of power components
    Manufacturer Resin Designs
    Chemistry Silicone
    Cure Method Low Pressures
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Volume Resistivity (O) 1e12 (ohms/cm)
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB
  • Technical Data for Resin Designs TP-1500 Thermally ConDuctive Pad

    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
      • Thermal Interface Material (TIM) - Thermal Interface Material
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Gel
      • Other - Solid
      • Pad
    • Industry
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Low Pressures
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB
    Specifications
    Bond Strength
    Tear Strength (piw) 30 (lb/in)
    Material Resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Conductivity
    Filler Alumina
    Dielectric Strength (V/mil) 8,858,268
    Thermal Conductivity (W/m°K) 1.10
    Volume Resistivity (O) 1e12 (ohms/cm)
    Hardness
    Flexibility Conformal
    Other Properties
    Specific Gravity 2.000
    Coefficient of Thermal Expansion (CTE) 590 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.
  • Best Practices for Resin Designs TP-1500 Thermally ConDuctive Pad

    *See Terms of Use Below

    1. Clean-Up

      The material can be removed easily and cleanly, with no special tools, for access.

  • Comparable Materials for Resin Designs TP-1500 Thermally ConDuctive Pad

    *See Terms of Use Below

    Spec Engine® Results

    Closest Results from this Manufacturer

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