Resin Designs TP-1500 Thermally ConDuctive Pad

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Description for Resin Designs TP-1500 Thermally ConDuctive Pad

Thin thermal interface; fiberglass reinforced; both sides tacky.

Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

Chemical Resistance	Good
Application Type	Thermal Interface Material
1 Part or 2 Part	1-Part
Material Form	Gel, Solid, Pad
Industry	Heat sinks of power components
Manufacturer	Resin Designs
Chemistry	Silicone
Cure Method	Low Pressures
Color	Gray
Ozone Resistance	Ozone resistance
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40
Volume Resistivity (O)	1e12 (ohms/cm)
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB

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Chemical Resistance
- Chemical Resistance - Good
Application Type
- Thermal Interface Material (TIM) - Thermal Interface Material
1 Part or 2 Part
- 1-Part
Material Form
- Gel
- Other - Solid
- Pad
Industry
- Electronics - Heat sinks of power components
- Industrial - Heat sources
Chemistry
- Silicone
Cure Method
- Pressure Sensitive (min) - Low Pressures
Color
- Gray
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB

Tear Strength (piw)	30 (lb/in)

Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40

Flexibility	Conformal

Specific Gravity	2.000
Coefficient of Thermal Expansion (CTE)	590 (Linear (micron/m °C or ppm ))

Shelf Life Details	The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.