Resin Designs TP-1502 Thermally ConDuctive Pad

Resin Designs TP-1502 Thermally ConDuctive Pad Datasheet
  • Description for Resin Designs TP-1502 Thermally ConDuctive Pad

    Thin thermal interface; fiberglass reinforced; flame retardant; both sides tacky.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Thermal Interface Material
    1 Part or 2 Part 1 Part
    Material Form Gel, Solid, Pad
    Industry Heat sinks of power components
    Manufacturer Resin Designs
    Chemistry Silicone
    Cure Method Pressure Sensitive
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0
  • Technical Data for Resin Designs TP-1502 Thermally ConDuctive Pad

    Overview
    • Application Type
      • Thermal Interface Material (TIM) - Thermal Interface Material
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Gel
      • Other - Solid
      • Pad
    • Industry
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94 V-0
    Specifications
    Bond Strength
    Tear Strength (piw) 30 (lb/in)
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Conductivity
    Filler Alumina
    Dielectric Strength (V/mil) 8,858,268
    Thermal Conductivity (W/m°K) 0.90
    Volume Resistivity (O) 1e12 (ohms/cm)
    Hardness
    Flexibility Conformal
    Other Properties
    Specific Gravity 2.000
    Coefficient of Thermal Expansion (CTE) 590 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.
  • Best Practices for Resin Designs TP-1502 Thermally ConDuctive Pad

    *See Terms of Use Below

    1. Clean-Up

      The material can be removed easily and cleanly, with no special tools, for access.

  • Comparable Materials for Resin Designs TP-1502 Thermally ConDuctive Pad

    *See Terms of Use Below

    Spec Engine® Results

    Closest Results from this Manufacturer

Questions about this material?

Resin Designs - TP-1502 Thermally ConDuctive Pad

Get personal assistance with your specific application needs.

Your Profile Edit

Popular Articles

6 objects held together by adhesives you probably can't live without

Read Article

Electrically Conductive Adhesives

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Who do you read or follow for engineering news and entertainment?
;