Resin Designs TP-2100 Thermally ConDuctive Pad

CONTACT REP

Description for Resin Designs TP-2100 Thermally ConDuctive Pad

Gap filler interface; foam-based thermal gel; both sides tacky.

Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

Chemical Resistance	Good
Application Type	Thermal Interface Material, Gap Filler
1 Part or 2 Part	1-Part
Material Form	Gel, Solid, Pad
Industry	Heat sinks of power components
Manufacturer	Resin Designs
Chemistry	Silicone
Cure Method	Pressure Sensitive
Gap Fill (in)	Gap Filler
Color	Gray
Ozone Resistance	Ozone resistance
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40
Volume Resistivity (O)	1e11 (ohms/cm)
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB

See what Gluespec offers

Email: *

Password: *

Confirm Password: *

Do you prefer to see data in °F or °C?

First Name: *

Last Name: *

Phone: *

Company Name: *

Address: *

Postal Code: *

Country: *

Job Function: *

Industry: *

Describe: *

I agree to the terms of use *

*: Required

Chemical Resistance
- Chemical Resistance - Good
Application Type
- Thermal Interface Material (TIM) - Thermal Interface Material
- Gap Filler
1 Part or 2 Part
- 1-Part
Material Form
- Gel
- Other - Solid
- Pad
Industry
- Electronics - Heat sinks of power components
- Industrial - Heat sources
Chemistry
- Silicone
Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
Color
- Gray
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB

Gap Fill (in)	Gap Filler

Tensile Strength (psi)	40

Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40

Specific Gravity	1.900
Coefficient of Thermal Expansion (CTE)	380 (Linear (micron/m °C or ppm ))

Shelf Life Details	The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.