Resin Designs TP-2100 Thermally ConDuctive Pad

Overview

• Chemical Resistance

  • Chemical Resistance - Good

• Application Type

  • Thermal Interface Material (TIM) - Thermal Interface Material
  • Gap Filler

• 1 Part or 2 Part

  • 1-Part

• Material Form

  • Gel
  • Other - Solid
  • Pad

• Industry

  • Electronics - Heat sinks of power components
  • Industrial - Heat sources

• Chemistry

  • Silicone

• Cure Method

  • Pressure Sensitive (min) - Pressure Sensitive

• Color

  • Gray

• Key Specifications

  • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB

Specifications

Cure Specs

Gap Fill (in)	Gap Filler

Bond Strength

Tensile Strength (psi)	40

Material Resistance

Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40

Conductivity

Filler	Alumina
Dielectric Strength (V/mil)	8,858,268
Thermal Conductivity (W/m°K)	0.70
Volume Resistivity (O)	1e11 (ohms/cm)

Hardness

Elongation (%)	2
Shore OO Hardness	50
Flexibility	Conformal

Other Properties

Specific Gravity	1.900
Coefficient of Thermal Expansion (CTE)	380 (Linear (micron/m °C or ppm ))

Business Information

Shelf Life Details	The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.