Electrically Conductive Adhesives

Below is a curated list of electrically conductive adhesives materials. Feel free to browse by chemistry or jump over to the Gluespec Grids in Advanced Search. Our goal is to help you find the right material to test for your application.

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214 Materials

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  • All Electrically Conductive Adhesives

  • Epoxy

  • Solvent-Free

  • Acrylic

  • Silicone

  • Volatile Content

  • Silyl Modified Polymer (SMP) / MS Polymer

  • Halogen-free

  • Solvent-Based

  • Non-flammable

  • Polyurethane

  • VOC-free

  • Acrylated Urethane

  • Isocyanate

  • Silicone-Free

  • Thermoplastic

  • Toughened

Electrically Conductive Adhesives

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Loctite Ablestik 56C w/ Cat 11

Henkel

Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure

Two component, high temperature, general purpose. Adhesive - Electrically Conductive

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Loctite Ablestik 56C w/ Cat 11

Henkel

Electrical Conductivity (mhos/cm): Electrically conductive; High

Application Type: Bond

Chemistry: Epoxy

Cure Method: 2-Part Cure; Heat Cure

Package Sizes

Resin 113 g Request Quote
Resin 454 g Request Quote
Catalyst Brown 4 oz Request Quote
Catalyst Brown 1 lb Request Quote
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Loctite Ablestik CT 5047-2

Henkel

Bond; 2-Part; Paste (Comp. A); Epoxy; Heat

Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive

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Loctite Ablestik CT 5047-2

Henkel

Electrical Conductivity (mhos/cm): Good

Application Type: Bond

Chemistry: Epoxy

Cure Method: Heat; Part A/Part B

Package Sizes

Part A 500 g Request Quote
Part B 10 g Request Quote
Part B 25 g Request Quote
Part B 50 g Request Quote
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FE7004A+B

HB Fuller

Bond; 2-Part; Liquid; Epoxy; Part A/Part B

Bonds to most metals and rigid plastics, rubber, concrete, wood, ceramics and most other fabricating materials. Features high shear strength with high impact, chemical and water resistance.

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FE7004A+B

HB Fuller

Electrical Conductivity (mhos/cm): 2.88 (ohm); 3.01 (ohm)

Application Type: Bond

Chemistry: Epoxy

Cure Method: Part A/Part B

Package Sizes

Part A 2.4 lb Quart Request Quote
Part A 9.6 lb Gal Pail Request Quote
Part A 48 lb Pail Request Quote
Part B 2 lb Quart Request Quote
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Loctite Ablestik 64C

Henkel

Bond; 2-Part; Liquid (Component B); Epoxy; 2-Part Cure

A low cost, two component, non-silver, electrically conductive epoxy adhesive.

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Loctite Ablestik 64C

Henkel

Electrical Conductivity (mhos/cm): Good

Application Type: Bond

Chemistry: Epoxy

Cure Method: 2-Part Cure; Heat; Room temperature cure

Package Sizes

Part A 400 g Request Quote
Part B 20 g Request Quote
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SEC1233

Resinlab

Bond; 2-Part; Paste; Epoxy; Part A/Part B

A silver filled, two component, room temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications.

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SEC1233

Resinlab

Electrical Conductivity (mhos/cm): Electrically conductive

Application Type: Bond

Chemistry: Epoxy

Cure Method: Part A/Part B

Package Sizes

Part A 30 cc Manual Syringe Request Quote
Part B 30 cc Manual Syringe Request Quote
3 cc Air Syringe Request Quote
3cc Air Syringe (2 cc Fill) Request Quote
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Electrically Conductive Adhesive Transfer Tape 9703

3M

Bond; Transfer tape; Acrylic; Pressure Sensitive

A pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. It offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films.

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Electrically Conductive Adhesive Transfer Tape 9703

3M

Electrical Conductivity (mhos/cm): Anisotropic electrical conductivity

Application Type: Bond

Chemistry: Acrylic

Cure Method: Heat; Pressure Sensitive

Package Sizes

1/2 in x 36 yd Request Quote
1/4 in x 36 yd Request Quote
1 in x 36 yd Request Quote
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SEC1222

Resinlab

Bond; 2-Part; Paste; Epoxy; 2-Part Cure

A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.

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SEC1222

Resinlab

Electrical Conductivity (mhos/cm): Excellent

Application Type: Bond

Chemistry: Epoxy

Cure Method: 2-Part Cure

Package Sizes

4 g Twinpak Request Quote
3cc w/ 1cc Fill Request Quote
2.5 g Twinpak Request Quote
100 Gram Jar Kit Request Quote
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XCE-3104MT

Henkel

Bond; 1-Part; Paste; Epoxy; Thermosetting

A one component, thermosetting, electrically conductive adhesive that is a lead-free alternative to solder for surface mount device (SMD) interconnect formation.

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XCE-3104MT

Henkel

Electrical Conductivity (mhos/cm): Electrically conductive

Application Type: Bond; Mask stencil

Chemistry: Epoxy

Cure Method: Heat; Thermosetting

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Threadlocking Varnish

WEICON

Bond; 1-Part; Liquid; Solvent-based; Solvent

Threadlocking Varnish is a solvent-based, fast drying securing and marking varnish with good adhesion to many materials.

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Threadlocking Varnish

WEICON

Electrical Conductivity (mhos/cm): Electrically conductive

Application Type: Bond; Seal; Threadlocking; Varnish

Chemistry: Solvent-based

Cure Method: Solvent

Package Sizes

WEICON Threadlocking Varnish 30 g red Request Quote
WEICON Threadlocking Varnish 60 g red Request Quote
WEICON Threadlocking Varnish 30 g yellow Request Quote
WEICON Threadlocking Varnish 60 g yellow Request Quote
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Loctite Ablestik 2902

Henkel

Bonding; 2-Part; Paste; Solvent-free; Room temperature cure

● Two components ● Electrically conductive ● Thermally conductive ● Solvent-free ● High adhesion ● Room temperature cure ● Good adhesion to a variety of substrates

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Loctite Ablestik 2902

Henkel

Electrical Conductivity (mhos/cm): Electrically Conductive

Application Type: Bonding; Repair; Sealing

Chemistry: Epoxy; Solvent-free

Cure Method: 2-Part Cure; Heat Cure; Room temperature cure

Package Sizes

2.65 gram Bipax Request Quote
10 gram Bipax Request Quote
20 g Bipax Request Quote
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TF E2213F

Resin Designs

Bond; 1-Part; B-Staged Film; Epoxy; Heat

A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.

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TF E2213F

Resin Designs

Electrical Conductivity (mhos/cm): Electrically Conductive

Application Type: Bond; EMI/RFI grounding; EMI/RFI grounding

Chemistry: Epoxy

Cure Method: Heat

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Loctite Ablestik 57C

Henkel

Adhesive; 2-Part; Paste; Epoxy; Heat

● Two component - requires mixing ● Electrically conductive ● Thermally conductive ● Thixotropic ● Ease of use ● Good bond strength ● Room temperature cure

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Loctite Ablestik 57C

Henkel

Electrical Conductivity (mhos/cm): Electrically conductive; Good; Ultimate

Application Type: Adhesive

Chemistry: Epoxy

Cure Method: Heat; Part A/Part B

Package Sizes

Catalyst 57 Gram Request Quote
Catalyst 454 Gram Request Quote
Resin 454 g Resin Request Quote
Resin 57 g Request Quote
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Loctite Ablestik 56C w/ Cat 11

Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure
Two component, high temperature, general purpose. Adhesive - Electrically Conductive
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically conductive; High
Substrate: Aluminum; Ceramics; Glass; Metals; Plastics

Package Sizes

Resin 113 g Resin 454 g Catalyst Brown 4 oz Catalyst Brown 1 lb Catalyst 1 lb Mil-Spec Catalyst 40 lb
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Loctite Ablestik CT 5047-2

Bond; 2-Part; Paste (Comp. A); Epoxy; Heat
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Good
Substrate: Aluminum

Package Sizes

Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
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FE7004A+B

Bond; 2-Part; Liquid; Epoxy; Part A/Part B
Bonds to most metals and rigid plastics, rubber, concrete, wood, ceramics and most other fabricating materials. Features high shear strength with high impact, chemical and water resistance.
Manufacturer: HB Fuller
Electrical Conductivity (mhos/cm): 2.88 (ohm); 3.01 (ohm)
Substrate: Ceramics; Concrete; Metals; Rigid plastics; Rubber; Wood

Package Sizes

Part A 2.4 lb Quart Part A 9.6 lb Gal Pail Part A 48 lb Pail Part B 2 lb Quart Part B 8 lb Pail Part B 40 lb Pail
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Loctite Ablestik 64C

Bond; 2-Part; Liquid (Component B); Epoxy; 2-Part Cure
A low cost, two component, non-silver, electrically conductive epoxy adhesive.
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Good

Package Sizes

Part A 400 g Part B 20 g
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SEC1233

Bond; 2-Part; Paste; Epoxy; Part A/Part B
A silver filled, two component, room temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications.
Manufacturer: Resinlab
Electrical Conductivity (mhos/cm): Electrically conductive
Substrate: 2024 T3 Al Abraded; Electrical contacts and components; Metals

Package Sizes

Part A 30 cc Manual Syringe Part B 30 cc Manual Syringe 3 cc Air Syringe 3cc Air Syringe (2 cc Fill) 3 cc Manual Syringe 10 cc Pre-Mixed & Frozen Syringe (5 cc Fill) 4 ml Dual Syringe 2.5 g Twinpak 4 g Twinpak 20 g Jar Kit 40 g Twinpak 100 g Jar Kit 50 ml Cartridge
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Electrically Conductive Adhesive Transfer Tape 9703

Bond; Transfer tape; Acrylic; Pressure Sensitive
A pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. It offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films.
Manufacturer: 3M
Electrical Conductivity (mhos/cm): Anisotropic electrical conductivity
Substrate: Aluminum; Common PCB substrates; Copper; DuPont™ Kapton Polyester films; EMI substrates; Metal; RFI substrates; Smooth gasket materials; Stainless steel

Package Sizes

1/2 in x 36 yd 1/4 in x 36 yd 1 in x 36 yd
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SEC1222

Bond; 2-Part; Paste; Epoxy; 2-Part Cure
A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.
Manufacturer: Resinlab
Electrical Conductivity (mhos/cm): Excellent
Substrate: 2024 T3 Al Abraded; Other common assembly materials; Various metals

Package Sizes

4 g Twinpak 3cc w/ 1cc Fill 2.5 g Twinpak 100 Gram Jar Kit 10 cc Manual Syringe 1 lb Kit 3 cc Air Syringe (2 cc Fill) 3 cc Manual Syringe Kit
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XCE-3104MT

Bond; 1-Part; Paste; Epoxy; Thermosetting
A one component, thermosetting, electrically conductive adhesive that is a lead-free alternative to solder for surface mount device (SMD) interconnect formation.
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically conductive
Substrate: Aluminum Lead Frame; FR-4; Lead; Nickel; OSP-copper; Tin
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Threadlocking Varnish

Bond; 1-Part; Liquid; Solvent-based; Solvent
Threadlocking Varnish is a solvent-based, fast drying securing and marking varnish with good adhesion to many materials.
Manufacturer: WEICON
Electrical Conductivity (mhos/cm): Electrically conductive
Substrate: Screw M10

Package Sizes

WEICON Threadlocking Varnish 30 g red WEICON Threadlocking Varnish 60 g red WEICON Threadlocking Varnish 30 g yellow WEICON Threadlocking Varnish 60 g yellow WEICON Threadlocking Varnish 30 g green WEICON Threadlocking Varnish 60 g green
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Loctite Ablestik 2902

Bonding; 2-Part; Paste; Solvent-free; Room temperature cure
● Two components ● Electrically conductive ● Thermally conductive ● Solvent-free ● High adhesion ● Room temperature cure ● Good adhesion to a variety of substrates
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically Conductive
Substrate: A variety of substrates; Aluminum; Carbon additives; Ceramics; Copper; Glass; Many metals; Metals; Plastic laminates

Package Sizes

2.65 gram Bipax 10 gram Bipax 20 g Bipax
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TF E2213F

Bond; 1-Part; B-Staged Film; Epoxy; Heat
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.
Manufacturer: Resin Designs
Electrical Conductivity (mhos/cm): Electrically Conductive
Substrate: Aluminum; Nickel
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Loctite Ablestik 57C

Adhesive; 2-Part; Paste; Epoxy; Heat
● Two component - requires mixing ● Electrically conductive ● Thermally conductive ● Thixotropic ● Ease of use ● Good bond strength ● Room temperature cure
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically conductive; Good; Ultimate
Substrate: Aluminum

Package Sizes

Catalyst 57 Gram Catalyst 454 Gram Resin 454 g Resin Resin 57 g
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Electrical Conductivity (mhos/cm)
Application Type
Chemistry
Cure Method
Substrate
Primerless
Description
Loctite Ablestik 56C w/ Cat 11
Henkel
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Electrically conductive; High
Bond
Epoxy
2-Part Cure; Heat Cure
Aluminum; Ceramics; Glass; Metals; Plastics
Two component, high temperature, general purpose. Adhesive - Electrically Conductive
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Resin 113 g Resin 454 g Catalyst Brown 4 oz Catalyst Brown 1 lb Catalyst 1 lb Mil-Spec Catalyst 40 lb
Loctite Ablestik CT 5047-2
Henkel
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Good
Bond
Epoxy
Heat; Part A/Part B
Aluminum
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
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Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
FE7004A+B
HB Fuller
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2.88 (ohm); 3.01 (ohm)
Bond
Epoxy
Part A/Part B
Ceramics; Concrete; Metals; Rigid plastics; Rubber; Wood
Bonds to most metals and rigid plastics, rubber, concrete, wood, ceramics and most other fabricating materials. Features high shear strength with high impact, chemical and water resistance.
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Part A 2.4 lb Quart Part A 9.6 lb Gal Pail Part A 48 lb Pail Part B 2 lb Quart Part B 8 lb Pail Part B 40 lb Pail
Loctite Ablestik 64C
Henkel
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Good
Bond
Epoxy
2-Part Cure; Heat; Room temperature cure
A low cost, two component, non-silver, electrically conductive epoxy adhesive.
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Part A 400 g Part B 20 g
SEC1233
Resinlab
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Electrically conductive
Bond
Epoxy
Part A/Part B
2024 T3 Al Abraded; Electrical contacts and components; Metals
A silver filled, two component, room temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications.
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Part A 30 cc Manual Syringe Part B 30 cc Manual Syringe 3 cc Air Syringe 3cc Air Syringe (2 cc Fill) 3 cc Manual Syringe 10 cc Pre-Mixed & Frozen Syringe (5 cc Fill) 4 ml Dual Syringe 2.5 g Twinpak 4 g Twinpak 20 g Jar Kit 40 g Twinpak 100 g Jar Kit 50 ml Cartridge
Electrically Conductive Adhesive Transfer Tape 9703
3M
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Anisotropic electrical conductivity
Bond
Acrylic
Heat; Pressure Sensitive
Aluminum; Common PCB substrates; Copper; DuPont™ Kapton Polyester films; EMI substrates; Metal; RFI substrates; Smooth gasket materials; Stainless steel
A pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. It offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films.
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1/2 in x 36 yd 1/4 in x 36 yd 1 in x 36 yd
SEC1222
Resinlab
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Excellent
Bond
Epoxy
2-Part Cure
2024 T3 Al Abraded; Other common assembly materials; Various metals
A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.
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4 g Twinpak 3cc w/ 1cc Fill 2.5 g Twinpak 100 Gram Jar Kit 10 cc Manual Syringe 1 lb Kit 3 cc Air Syringe (2 cc Fill) 3 cc Manual Syringe Kit
XCE-3104MT
Henkel
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Electrically conductive
Bond; Mask stencil
Epoxy
Heat; Thermosetting
Aluminum Lead Frame; FR-4; Lead; Nickel; OSP-copper; Tin
A one component, thermosetting, electrically conductive adhesive that is a lead-free alternative to solder for surface mount device (SMD) interconnect formation.
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Threadlocking Varnish
WEICON
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Electrically conductive
Bond; Seal; Threadlocking; Varnish
Solvent-based
Solvent
Screw M10
Threadlocking Varnish is a solvent-based, fast drying securing and marking varnish with good adhesion to many materials.
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WEICON Threadlocking Varnish 30 g red WEICON Threadlocking Varnish 60 g red WEICON Threadlocking Varnish 30 g yellow WEICON Threadlocking Varnish 60 g yellow WEICON Threadlocking Varnish 30 g green WEICON Threadlocking Varnish 60 g green
Loctite Ablestik 2902
Henkel
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Electrically Conductive
Bonding; Repair; Sealing
Epoxy; Solvent-free
2-Part Cure; Heat Cure; Room temperature cure
A variety of substrates; Aluminum; Carbon additives; Ceramics; Copper; Glass; Many metals; Metals; Plastic laminates
● Two components ● Electrically conductive ● Thermally conductive ● Solvent-free ● High adhesion ● Room temperature cure ● Good adhesion to a variety of substrates
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2.65 gram Bipax 10 gram Bipax 20 g Bipax
TF E2213F
Resin Designs
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Electrically Conductive
Bond; EMI/RFI grounding; EMI/RFI grounding
Epoxy
Heat
Aluminum; Nickel
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.
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Loctite Ablestik 57C
Henkel
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Electrically conductive; Good; Ultimate
Adhesive
Epoxy
Heat; Part A/Part B
Aluminum
● Two component - requires mixing ● Electrically conductive ● Thermally conductive ● Thixotropic ● Ease of use ● Good bond strength ● Room temperature cure
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Catalyst 57 Gram Catalyst 454 Gram Resin 454 g Resin Resin 57 g
Loctite Ablestik 56C w/ Cat 9
Henkel
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High; Ultimate
Bond
Epoxy
2 Parts; Heat
Aluminum; Ceramics; Conductive plastics; Glass; Metals
Two component, general purpose. Adhesive - Electrically Conductive
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Resin 113 g Catalyst Amber 1 oz Catalyst Amber 4 oz Catalyst Amber 1 lb Catalyst Unpigmented 1 lb Catalyst Amber 8 lb Catalyst Amber 40 lb Pail
Loctite Ablestik 5025E
Henkel
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Excellent
Bond
Epoxy
Heat
Ag/Cu leadframe; Al
It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.
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Loctite Ablestik 60L Parts AB
Henkel
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Electrically conductive
Bond
Epoxy
2-Part Cure; Heat
Aluminum
● Two component - requires mixing ● Electrically conductive ● Good thermal conductivity ● Bonds to a wide variety of substrates ● Room temperature cure and Heat cure
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Part B Gray 4 oz Part A Gray 12 oz
Electrically Conductive Single-Sided Tape CEF-3BV
3M
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Electrically conductive
Bond; EMI shielding
Acrylic adhesive
Heat; Pressure-sensitive
A Cu/Ni coated conductive polyester fabric and an electrically conductive pressure-sensitive acrylic adhesive. It is typically used for applications requiring excellent electrical conductivity and EMI/EMC shielding.
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Electrically Conductive Double-Sided Tape 9711S-150
3M
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Excellent electrically conductive
Bonding; EMI shielding
Acrylic based adhesive
Heat; Pressure sensitive
Non-flat surfaces
An XYZ electrically conductive pressure sensitive adhesive (PSA) tapes matrix. An acrylic based adhesive solution and offers adhesion and grounding performance to many surface types.
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Loctite CC 40A E&C
Henkel
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Ultimate
Bond; Coating; Use in radar reflection; Use in RFI shielding
Solvent based elastomer
Hot air drying
● One component ● Electrically conductive ● Elastomeric ● Silver-filled ● Elastomeric surface coating ● use in a variety of electrical and electronic applications ● Hot air drying
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4 oz Jar
Eccocoat EC 210 A/B
Henkel
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Excellent
Bond; Coating
Epoxy
Solvent
Brick; Ceramics; Concrete; Glass; Metals; Plastics; Wood
A general purpose, solvent containing, oxide filled, epoxy surface coating. It has outstanding resistance to moisture, chemical attack, and weathering.
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Part B Gallon Part A Gallon
Dynaloy 335
Versum (formerly Dynaloy)
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Electrical conductivity
Bond; EMI shielding; RFI shielding
Epoxy
2-Part Cure; Air dry; Heat; Room temperature cure
A two component pure silver filled epoxies, which combine the excellent adhesive properties of the epoxies with the electrical conductivity of pure silver.
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Loctite Ablestik XCE 3104XL
Henkel
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Electrically Conductive
Bond; Coat; Encapsulate
Epoxy
Heat cure
Copper; Lead; Nickel; Stainless Steel; Tin
● One component ● Thermosetting ● Controlled particle size ● Electrically conductive ●Pb-free alternative to solder ● Long stencil work life at high print speed ● Low temperature cure ● No post cure required ● Low CTE ● Intrinsically clean ●
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17 g/10 cc Syringe 35 g/10 cc Syringe .01 kg 3 cc Syringe 150 g/2 oz Jar
Loctite CT 5030 E&C
Henkel
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Ultimate
Bond; Coating
Imidizole; Solvent containing epoxy; Solvent-based
2-Part Cure; Heat; Solvent
Ceramics; Glass; Metals; Plastics; Polyester
A two component, silver filled, heat cured, solvent based, electrically conductive epoxy ink and coating.
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Part A 500 g
9713
3M
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Electrically conductivity
Bond; EMI/RFI shield; EMI/RFI shield
Filled Acrylic
Heat; Pressure Sensitive
Aluminum; Copper; EMI/RFI gasket attachment to metal surfaces; Fiber; Metal surfaces; PVC; PVC laminates; Stainless Steel
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.
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12 in x 36 yd 1/4 in x 36 yd 1 in x 36 yd
QMI529LB
Henkel
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Excellent
Bond
Silver
Oven Cure
Ag-plate Cu; Copper; Ni (Nikel); Pd (Lead)
A silver-filled, low bleed conductive die attach adhesive specifically recommended for Ag-plate Cu, Cu, and NiPdAu leadframe applications. It has excellent electrical and thermal conductivity properties.
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