Electrically Conductive Heat Cure Adhesives

Gluespec provides deep data on adhesives & other niche materials. This curated electrically conductive heat cure adhesives catalog contains popular materials broken down by chemistry. Compare materials or visit individual datasheet pages. Datasheets contain technical data, key specs, best practices, comparable materials, and test method information. Use Advanced Search to filter by data points that are important to you. You can also order samples to test.

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Electrically Conductive Heat Cure Adhesives

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Loctite Ablestik 56C w/ Cat 11

Henkel

Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure

Two component, high temperature, general purpose. Adhesive - Electrically Conductive

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Loctite Ablestik 56C w/ Cat 11

Henkel

Cure Method: Heat Cure; 2-Part Cure

Electrical Conductivity (mhos/cm): Electrically conductive; High

Application Type: Bond

Chemistry: Epoxy

Package Sizes

Resin 113 g Request Quote
Resin 454 g Request Quote
Catalyst Brown 4 oz Request Quote
Catalyst Brown 1 lb Request Quote
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Loctite Ablestik CT 5047-2

Henkel

Bond; 2-Part; Paste (Comp. A); Epoxy; Heat

Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive

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Loctite Ablestik CT 5047-2

Henkel

Cure Method: Heat; Part A/Part B

Electrical Conductivity (mhos/cm): Good

Application Type: Bond

Chemistry: Epoxy

Package Sizes

Part A 500 g Request Quote
Part B 10 g Request Quote
Part B 25 g Request Quote
Part B 50 g Request Quote
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Loctite Ablestik 64C

Henkel

Bond; 2-Part; Liquid (Component B); Epoxy; Heat

A low cost, two component, non-silver, electrically conductive epoxy adhesive.

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Loctite Ablestik 64C

Henkel

Cure Method: Heat; 2-Part Cure; Room temperature cure

Electrical Conductivity (mhos/cm): Good

Application Type: Bond

Chemistry: Epoxy

Package Sizes

Part A 400 g Request Quote
Part B 20 g Request Quote
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XCE-3104MT

Henkel

Bond; 1-Part; Paste; Epoxy; Thermosetting

A one component, thermosetting, electrically conductive adhesive that is a lead-free alternative to solder for surface mount device (SMD) interconnect formation.

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XCE-3104MT

Henkel

Cure Method: Heat; Thermosetting

Electrical Conductivity (mhos/cm): Electrically conductive

Application Type: Bond; Mask stencil

Chemistry: Epoxy

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Electrically Conductive Adhesive Transfer Tape 9703

3M

Bond; Transfer tape; Acrylic; Heat

A pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. It offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films.

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Electrically Conductive Adhesive Transfer Tape 9703

3M

Cure Method: Heat; Pressure Sensitive

Electrical Conductivity (mhos/cm): Anisotropic electrical conductivity

Application Type: Bond

Chemistry: Acrylic

Package Sizes

1/2 in x 36 yd Request Quote
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1 in x 36 yd Request Quote
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Loctite Ablestik 2902

Henkel

Bonding; 2-Part; Paste; Solvent-free; Heat Cure

● Two components ● Electrically conductive ● Thermally conductive ● Solvent-free ● High adhesion ● Room temperature cure ● Good adhesion to a variety of substrates

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Loctite Ablestik 2902

Henkel

Cure Method: Heat Cure; 2-Part Cure; Room temperature cure

Electrical Conductivity (mhos/cm): Electrically Conductive

Application Type: Bonding; Repair; Sealing

Chemistry: Epoxy; Solvent-free

Package Sizes

2.65 gram Bipax Request Quote
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20 g Bipax Request Quote
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TF E2213F

Resin Designs

Bond; 1-Part; B-Staged Film; Epoxy; Heat

A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.

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TF E2213F

Resin Designs

Cure Method: Heat

Electrical Conductivity (mhos/cm): Electrically Conductive

Application Type: Bond; EMI/RFI grounding; EMI/RFI grounding

Chemistry: Epoxy

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Loctite Ablestik XCE 3104XL

Henkel

Bond; 1-Part; Liquid; Epoxy; Heat cure

● One component ● Thermosetting ● Controlled particle size ● Electrically conductive ●Pb-free alternative to solder ● Long stencil work life at high print speed ● Low temperature cure ● No post cure required ● Low CTE ● Intrinsically clean ●

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Loctite Ablestik XCE 3104XL

Henkel

Cure Method: Heat cure

Electrical Conductivity (mhos/cm): Electrically Conductive

Application Type: Bond; Coat; Encapsulate

Chemistry: Epoxy

Package Sizes

17 g/10 cc Syringe Request Quote
35 g/10 cc Syringe Request Quote
.01 kg 3 cc Syringe Request Quote
150 g/2 oz Jar Request Quote
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Loctite CT 5030 E&C

Henkel

Bond; 2-Part; Liquid; Solvent containing epoxy; Heat

A two component, silver filled, heat cured, solvent based, electrically conductive epoxy ink and coating.

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Loctite CT 5030 E&C

Henkel

Cure Method: Heat; 2-Part Cure; Solvent

Electrical Conductivity (mhos/cm): Ultimate

Application Type: Bond; Coating

Chemistry: Imidizole; Solvent containing epoxy; Solvent-based

Package Sizes

Part A 500 g Request Quote
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Loctite Ablestik 57C

Henkel

Adhesive; 2-Part; Paste; Epoxy; Heat

● Two component - requires mixing ● Electrically conductive ● Thermally conductive ● Thixotropic ● Ease of use ● Good bond strength ● Room temperature cure

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Loctite Ablestik 57C

Henkel

Cure Method: Heat; Part A/Part B

Electrical Conductivity (mhos/cm): Electrically conductive; Good; Ultimate

Application Type: Adhesive

Chemistry: Epoxy

Package Sizes

Catalyst 57 Gram Request Quote
Catalyst 454 Gram Request Quote
Resin 454 g Resin Request Quote
Resin 57 g Request Quote
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Loctite Ablestik 56C w/ Cat 9

Henkel

Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat

Two component, general purpose. Adhesive - Electrically Conductive

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Loctite Ablestik 56C w/ Cat 9

Henkel

Cure Method: Heat; 2 Parts

Electrical Conductivity (mhos/cm): High; Ultimate

Application Type: Bond

Chemistry: Epoxy

Package Sizes

Resin 113 g Request Quote
Catalyst Amber 1 oz Request Quote
Catalyst Amber 4 oz Request Quote
Catalyst Amber 1 lb Request Quote
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Loctite Ablestik 5025E

Henkel

Bond; 1-Part; Film; Epoxy; Heat

It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.

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Loctite Ablestik 5025E

Henkel

Cure Method: Heat

Electrical Conductivity (mhos/cm): Excellent

Application Type: Bond

Chemistry: Epoxy

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Loctite Ablestik 56C w/ Cat 11

Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure
Two component, high temperature, general purpose. Adhesive - Electrically Conductive
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically conductive; High
Substrate: Aluminum; Ceramics; Glass; Metals; Plastics

Package Sizes

Resin 113 g Resin 454 g Catalyst Brown 4 oz Catalyst Brown 1 lb Catalyst 1 lb Mil-Spec Catalyst 40 lb
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Loctite Ablestik CT 5047-2

Bond; 2-Part; Paste (Comp. A); Epoxy; Heat
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Good
Substrate: Aluminum

Package Sizes

Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
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Loctite Ablestik 64C

Bond; 2-Part; Liquid (Component B); Epoxy; Heat
A low cost, two component, non-silver, electrically conductive epoxy adhesive.
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Good

Package Sizes

Part A 400 g Part B 20 g
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XCE-3104MT

Bond; 1-Part; Paste; Epoxy; Thermosetting
A one component, thermosetting, electrically conductive adhesive that is a lead-free alternative to solder for surface mount device (SMD) interconnect formation.
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically conductive
Substrate: Aluminum Lead Frame; FR-4; Lead; Nickel; OSP-copper; Tin
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Electrically Conductive Adhesive Transfer Tape 9703

Bond; Transfer tape; Acrylic; Heat
A pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. It offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films.
Manufacturer: 3M
Electrical Conductivity (mhos/cm): Anisotropic electrical conductivity
Substrate: Aluminum; Common PCB substrates; Copper; DuPont™ Kapton Polyester films; EMI substrates; Metal; RFI substrates; Smooth gasket materials; Stainless steel

Package Sizes

1/2 in x 36 yd 1/4 in x 36 yd 1 in x 36 yd
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Loctite Ablestik 2902

Bonding; 2-Part; Paste; Solvent-free; Heat Cure
● Two components ● Electrically conductive ● Thermally conductive ● Solvent-free ● High adhesion ● Room temperature cure ● Good adhesion to a variety of substrates
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically Conductive
Substrate: A variety of substrates; Aluminum; Carbon additives; Ceramics; Copper; Glass; Many metals; Metals; Plastic laminates

Package Sizes

2.65 gram Bipax 10 gram Bipax 20 g Bipax
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TF E2213F

Bond; 1-Part; B-Staged Film; Epoxy; Heat
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.
Manufacturer: Resin Designs
Electrical Conductivity (mhos/cm): Electrically Conductive
Substrate: Aluminum; Nickel
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Loctite Ablestik XCE 3104XL

Bond; 1-Part; Liquid; Epoxy; Heat cure
● One component ● Thermosetting ● Controlled particle size ● Electrically conductive ●Pb-free alternative to solder ● Long stencil work life at high print speed ● Low temperature cure ● No post cure required ● Low CTE ● Intrinsically clean ●
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically Conductive
Substrate: Copper; Lead; Nickel; Stainless Steel; Tin

Package Sizes

17 g/10 cc Syringe 35 g/10 cc Syringe .01 kg 3 cc Syringe 150 g/2 oz Jar
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Loctite CT 5030 E&C

Bond; 2-Part; Liquid; Solvent containing epoxy; Heat
A two component, silver filled, heat cured, solvent based, electrically conductive epoxy ink and coating.
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Ultimate
Substrate: Ceramics; Glass; Metals; Plastics; Polyester

Package Sizes

Part A 500 g
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Loctite Ablestik 57C

Adhesive; 2-Part; Paste; Epoxy; Heat
● Two component - requires mixing ● Electrically conductive ● Thermally conductive ● Thixotropic ● Ease of use ● Good bond strength ● Room temperature cure
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Electrically conductive; Good; Ultimate
Substrate: Aluminum

Package Sizes

Catalyst 57 Gram Catalyst 454 Gram Resin 454 g Resin Resin 57 g
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Loctite Ablestik 56C w/ Cat 9

Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat
Two component, general purpose. Adhesive - Electrically Conductive
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): High; Ultimate
Substrate: Aluminum; Ceramics; Conductive plastics; Glass; Metals

Package Sizes

Resin 113 g Catalyst Amber 1 oz Catalyst Amber 4 oz Catalyst Amber 1 lb Catalyst Unpigmented 1 lb Catalyst Amber 8 lb Catalyst Amber 40 lb Pail
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Loctite Ablestik 5025E

Bond; 1-Part; Film; Epoxy; Heat
It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.
Manufacturer: Henkel
Electrical Conductivity (mhos/cm): Excellent
Substrate: Ag/Cu leadframe; Al
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Cure Method
Electrical Conductivity (mhos/cm)
Application Type
Chemistry
Substrate
Primerless
Description
Loctite Ablestik 56C w/ Cat 11
Henkel
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Heat Cure; 2-Part Cure
Electrically conductive; High
Bond
Epoxy
Aluminum; Ceramics; Glass; Metals; Plastics
Two component, high temperature, general purpose. Adhesive - Electrically Conductive
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Resin 113 g Resin 454 g Catalyst Brown 4 oz Catalyst Brown 1 lb Catalyst 1 lb Mil-Spec Catalyst 40 lb
Loctite Ablestik CT 5047-2
Henkel
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Heat; Part A/Part B
Good
Bond
Epoxy
Aluminum
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
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Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
Loctite Ablestik 64C
Henkel
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Heat; 2-Part Cure; Room temperature cure
Good
Bond
Epoxy
A low cost, two component, non-silver, electrically conductive epoxy adhesive.
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Part A 400 g Part B 20 g
XCE-3104MT
Henkel
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Heat; Thermosetting
Electrically conductive
Bond; Mask stencil
Epoxy
Aluminum Lead Frame; FR-4; Lead; Nickel; OSP-copper; Tin
A one component, thermosetting, electrically conductive adhesive that is a lead-free alternative to solder for surface mount device (SMD) interconnect formation.
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Electrically Conductive Adhesive Transfer Tape 9703
3M
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Heat; Pressure Sensitive
Anisotropic electrical conductivity
Bond
Acrylic
Aluminum; Common PCB substrates; Copper; DuPont™ Kapton Polyester films; EMI substrates; Metal; RFI substrates; Smooth gasket materials; Stainless steel
A pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. It offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films.
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1/2 in x 36 yd 1/4 in x 36 yd 1 in x 36 yd
Loctite Ablestik 2902
Henkel
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Heat Cure; 2-Part Cure; Room temperature cure
Electrically Conductive
Bonding; Repair; Sealing
Epoxy; Solvent-free
A variety of substrates; Aluminum; Carbon additives; Ceramics; Copper; Glass; Many metals; Metals; Plastic laminates
● Two components ● Electrically conductive ● Thermally conductive ● Solvent-free ● High adhesion ● Room temperature cure ● Good adhesion to a variety of substrates
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2.65 gram Bipax 10 gram Bipax 20 g Bipax
TF E2213F
Resin Designs
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Heat
Electrically Conductive
Bond; EMI/RFI grounding; EMI/RFI grounding
Epoxy
Aluminum; Nickel
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.
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Loctite Ablestik XCE 3104XL
Henkel
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Heat cure
Electrically Conductive
Bond; Coat; Encapsulate
Epoxy
Copper; Lead; Nickel; Stainless Steel; Tin
● One component ● Thermosetting ● Controlled particle size ● Electrically conductive ●Pb-free alternative to solder ● Long stencil work life at high print speed ● Low temperature cure ● No post cure required ● Low CTE ● Intrinsically clean ●
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17 g/10 cc Syringe 35 g/10 cc Syringe .01 kg 3 cc Syringe 150 g/2 oz Jar
Loctite CT 5030 E&C
Henkel
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Heat; 2-Part Cure; Solvent
Ultimate
Bond; Coating
Imidizole; Solvent containing epoxy; Solvent-based
Ceramics; Glass; Metals; Plastics; Polyester
A two component, silver filled, heat cured, solvent based, electrically conductive epoxy ink and coating.
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Part A 500 g
Loctite Ablestik 57C
Henkel
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Heat; Part A/Part B
Electrically conductive; Good; Ultimate
Adhesive
Epoxy
Aluminum
● Two component - requires mixing ● Electrically conductive ● Thermally conductive ● Thixotropic ● Ease of use ● Good bond strength ● Room temperature cure
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Catalyst 57 Gram Catalyst 454 Gram Resin 454 g Resin Resin 57 g
Loctite Ablestik 56C w/ Cat 9
Henkel
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Heat; 2 Parts
High; Ultimate
Bond
Epoxy
Aluminum; Ceramics; Conductive plastics; Glass; Metals
Two component, general purpose. Adhesive - Electrically Conductive
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Resin 113 g Catalyst Amber 1 oz Catalyst Amber 4 oz Catalyst Amber 1 lb Catalyst Unpigmented 1 lb Catalyst Amber 8 lb Catalyst Amber 40 lb Pail
Loctite Ablestik 5025E
Henkel
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Heat
Excellent
Bond
Epoxy
Ag/Cu leadframe; Al
It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.
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Loctite Ablestik 60L Parts AB
Henkel
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Heat; 2-Part Cure
Electrically conductive
Bond
Epoxy
Aluminum
● Two component - requires mixing ● Electrically conductive ● Good thermal conductivity ● Bonds to a wide variety of substrates ● Room temperature cure and Heat cure
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Part B Gray 4 oz Part A Gray 12 oz
Loctite Ablestik C 990 333
Henkel
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Heat Cure
Electrically conductive
Bond
Epoxy
Al/Al
Epoxy, Silver, One-component, Electrically conductive, silver filled epoxy adhesive is specially suited for die and component bonding in microelectronic applications.
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5 cc Syringe
BA-2958
Henkel
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Snap Cure; Resin/Hardener
Electrically conductive
Bond; Coat; seal
Epoxy
Aluminum
• A two-part • Snap curable • Thermally conductive • Electrically conductive • Long pot life • Screen printable • Heat cure • Bonding or Sealing
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2.65 gram Bipax
Electrically Conductive Single-Sided Tape CEF-3BV
3M
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Heat; Pressure-sensitive
Electrically conductive
Bond; EMI shielding
Acrylic adhesive
A Cu/Ni coated conductive polyester fabric and an electrically conductive pressure-sensitive acrylic adhesive. It is typically used for applications requiring excellent electrical conductivity and EMI/EMC shielding.
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Electrically Conductive Double-Sided Tape 9711S-150
3M
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Heat; Pressure sensitive
Excellent electrically conductive
Bonding; EMI shielding
Acrylic based adhesive
Non-flat surfaces
An XYZ electrically conductive pressure sensitive adhesive (PSA) tapes matrix. An acrylic based adhesive solution and offers adhesion and grounding performance to many surface types.
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Loctite Ablestik CF 3366
Henkel
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Heat cure
High
Bond
Epoxy
Aluminum; Ceramic circuits; Copper; Metal backplanes
● One part ● High electrical conductivity ● High thermal conductivity ● Passes NASA outgassing ● Heat cure ● Copper, Brass, Kovar and Aluminum ● Epoxy Film ● Gray Tan ● High adhesion strength at elevated temperatures
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Loctite Ablestik ECF 561E
Henkel
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Heat cure
Electrically Conductive
Bonding
Glass fabric (Carrier), 1mil; Rubberized Epoxy
Al
An electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion, heat cure.
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Loctite Ablestik CE 3103WLV
Henkel
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Heat cure
Electrically conductive
Bond
Epoxy; Lead-free; Pb-free
Acrylic; Ceramic; Metal; Organic; OSP coated Cu; Plastic; Sn; Sn/Pb
• One component • Epoxy • Heat cure • Electrically conductive • Pb-free alternative to solder • Low cure temperature • SMD component attach
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10 cc EFD Syringe
Dynaloy 335
Versum (formerly Dynaloy)
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Heat; 2-Part Cure; Air dry; Room temperature cure
Electrical conductivity
Bond; EMI shielding; RFI shielding
Epoxy
A two component pure silver filled epoxies, which combine the excellent adhesive properties of the epoxies with the electrical conductivity of pure silver.
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Loctite Ablestik QMI529HT
Henkel
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Heat
Excellent
Bond
BMI/Acrylate
Alloy 42; Ceramic surfaces; Ceramics surfaces; Copper; Metals; Silver-plated copper
For component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices and solder replacement applications.
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9713
3M
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Heat; Pressure Sensitive
Electrically conductivity
Bond; EMI/RFI shield; EMI/RFI shield
Filled Acrylic
Aluminum; Copper; EMI/RFI gasket attachment to metal surfaces; Fiber; Metal surfaces; PVC; PVC laminates; Stainless Steel
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.
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12 in x 36 yd 1/4 in x 36 yd 1 in x 36 yd
QMI529LB
Henkel
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Oven Cure
Excellent
Bond
Silver
Ag-plate Cu; Copper; Ni (Nikel); Pd (Lead)
A silver-filled, low bleed conductive die attach adhesive specifically recommended for Ag-plate Cu, Cu, and NiPdAu leadframe applications. It has excellent electrical and thermal conductivity properties.
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