
Epoxy Adhesives
Below is a curated list of epoxy adhesives materials. Feel free to browse by material form or jump over to the Gluespec Grids in Advanced Search. Our goal is to help you find the right material to test for your application.
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All Epoxy Adhesives
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Epoxy Adhesives
EP11HT
Resinlab
Bond; 2-Part; Thixotropic paste; Epoxy; Part A/Part B
A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.

EP11HT
Resinlab
Structural/Load-Bearing: Structural/Load-Bearing
Application Type: Bond
Industry: Electronics; Aerospace; Construction; Furniture/Wood Working; Industrial; Military; Sporting Equipment; Transportation
Chemistry: Epoxy
Package Sizes
Part A Gray Quart | Request Quote |
Part A Gray Gal | Request Quote |
Part A Gray 5 Gal Pail | Request Quote |
Part B Gray Quart | Request Quote |

EP750
Resinlab
Bond; 2-Part; Liquid; Epoxy; Part A/Part B
A two part unfilled epoxy structural adhesive, room temperature to a tough, semi-rigid polymer, good wetting and adhesion to most surfaces and has a free flowing viscosity, very good resistance, ASTM E-595 for outgassing.

EP750
Resinlab
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Electronics; Construction; Food & Drug; Food & Drug; Furniture/Wood Working; Industrial; Military; Sporting Equipment; Transportation
Chemistry: Epoxy
Package Sizes
Part A Clear Pint | Request Quote |
Part A Clear Quart | Request Quote |
Part A Clear Gal | Request Quote |
Part A Gray Pail | Request Quote |

2 Ton Epoxy
Devcon (ITW)
Bond; 2-Part; Liquid; Epoxy; 2-Part Cure
Extremely strong, water-resistant epoxy adhesive that forms a powerful bond with ferrous and non-ferrous metals, ceramics wood, concrete, or glass in any combination. Self-levels after application.

2 Ton Epoxy
Devcon (ITW)
Structural/Load-Bearing: Structural
Application Type: Bond; Pot
Industry: Electronic assemblies; Electronic components; Electronics
Chemistry: Epoxy
Package Sizes
Clear 25 ml Tube | Request Quote |
Clear 50 ml | Request Quote |
Clear 400 ml | Request Quote |
Clear 9 lb Kit | Request Quote |

EP1215
Resinlab
Bond; 2-Part; Liquid; Epoxy; Part A/Part B
A two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance.

EP1215
Resinlab
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Electronics; Construction; Furniture/Wood Working; Industrial; Military; Sporting Equipment; Transportation
Chemistry: Epoxy
Package Sizes
Part B Black 5 Gal Pail | Request Quote |
Black 400 ml Cartridge | Request Quote |
Part B Black Gal | Request Quote |
Black 50 ml Cartridge | Request Quote |

320/322 Epoxy Adhesive
Parker Lord
Bond; 2-Part; Paste; Epoxy; 2-Part Cure
It is a general purpose, two-component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). It also provides excellent adhesion to prepared metals, rubber, fiberglass reinforced plastics (FRP).

320/322 Epoxy Adhesive
Parker Lord
Structural/Load-Bearing: Load bearing
Application Type: Bond; Gaskets
Industry: Voice coils; Automotive applications; Automotive sheet molded compound (SMC); Dust caps; General Purpose; Industrial/Commercial; Post-Vulcanization Bonding; Speaker cones; Spider components; Vehicles
Chemistry: Epoxy; Contains no solvent; Non-flammable ; Toughened
Package Sizes
Resin Quart | Request Quote |
Resin 5 Gal Pail | Request Quote |
Resin 60 lb Straight-Side Pail | Request Quote |
Resin 650 lb Drum | Request Quote |

310 Epoxy Adhesive
Parker Lord
Bond; 2-Part; Paste; Epoxy; Resin/Hardener
Modified, thixotropic, two-component epoxy adhesive system used to bond many types of prepared metals, prepared rubber, urethane and plastics.

310 Epoxy Adhesive
Parker Lord
Structural/Load-Bearing: Load bearing
Application Type: Bond
Industry: Bond disk drives; Automotive body panels; Down-hole oil field equipment; Post-Vulcanization Bonding; Spoilers; Vibration damping mounts
Chemistry: Epoxy; Nonflammable; Solvent-free
Package Sizes
Resin 1/2 Pint | Request Quote |
Resin Quart | Request Quote |
Resin Gallon | Request Quote |
Resin 5 Gal Pail | Request Quote |

Thermal Bonding Film AF42 (4 mil)
3M
Bond; 1-Part; Film; Epoxy; Heat cure
It is a thermosetting epoxy film adhesive, Its flexibility provides excellent drop and impact resistance as well as stress relief for joints encountering coefficient of thermal expansion (CTE) mismatch, Structural bond strength to metals and glass.

Thermal Bonding Film AF42 (4 mil)
3M
Structural/Load-Bearing: Structural bond strength
Application Type: Bond
Industry: Electronics; Joints encountering
Chemistry: Epoxy; Low halogen content
Package Sizes
3 in x 72 yd, 3 mil | Request Quote |
20 x 72, 3 Mil | Request Quote |

EP1199
Resinlab
Bond; 2-Part; Liquid; Epoxy; Part A/Part B
A two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics.

EP1199
Resinlab
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Electronics; Construction; Furniture/Wood Working; Industrial; Military; Sporting Equipment; Transportation
Chemistry: Epoxy
Package Sizes
Part A Clear Quart | Request Quote |
Part A Clear Gallon | Request Quote |
Part A Clear 5 Gal Pail | Request Quote |
Part A Black 5 Gal Pail | Request Quote |

Conapoxy AD-10
Elantas (Altana)
Bond; 1-Part; Paste; Epoxy; Elevated temperature cure
A one-component, 100% solids, elevated temperature cure epoxy adhesive system and miniature electronic potting compound ideal for electrical applications.

Conapoxy AD-10
Elantas (Altana)
Structural/Load-Bearing: Structural
Application Type: Bond; Potting; Sealing; Staking
Industry: Batteries; Electrical applications; Miniature electronic potting compound; End cap filling; Filters; Magnet assemblies; Miniature potting ; Miniature staking; Speaker assemblies; Structural materials
Chemistry: Epoxy
Package Sizes
12 oz Cartridge | Request Quote |
Quart | Request Quote |
Gallon | Request Quote |
5 Gallon | Request Quote |

AF111
3M
Bond; 1-Part; Film; Epoxy; Heat
An epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).

AF111
3M
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Electronics applications
Chemistry: Epoxy
Package Sizes
40 in x 36 yd | Request Quote |

EP1115
Resinlab
Bond; 2-Part; Liquid; Epoxy; Part A/Part B
A two part epoxy adhesive, good resistance to water, salt spray, inorganic acids, bases and most organic solvents, MMD equipment.

EP1115
Resinlab
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Electronics; Construction; Furniture/Wood Working; Industrial; Military; Sporting Equipment; Transportation
Chemistry: Epoxy
Package Sizes
Part A Clear Pint | Request Quote |
Part A Clear Quart | Request Quote |
Part A Clear 5 Gal Pail | Request Quote |
Part B Clear Pint | Request Quote |

3135/7111
Parker Lord
Bond; 2-Part; Liquid; Epoxy-based; Resin/Hardener
An epoxy-based, room-temperature-curing structural adhesive. Most metals, wood, glass, concrete and masonry, and various synthetic materials can be bonded with this adhesive. It provides high strength bonds, with a degree of flexibility in the bondline.

3135/7111
Parker Lord
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Cadmium Foil; Copper Foil; Lead Foil; Tin Foil; Masonry; Polyurethane foams; Skins to plastic or metal honey-comb cores
Chemistry: Epoxy-based
Package Sizes
Part A Quart | Request Quote |
Part B Pint | Request Quote |
Part A Pint | Request Quote |

2290
3M
Bonding; 1-Part; Liquid; Epoxy; Solvent
21% solids liquid epoxy • B-stageable • Laminating steel cores for motor stators and rotors • Thin metal stack laminations

2290
3M
Structural/Load-Bearing: Structural
Application Type: Bonding; Coating
Industry: Coil; Core; Electronic Subassemblies; Printed Circuits; Rotor; Stack; Laminated Steel Cores; Motor; Motor Stator
Chemistry: Epoxy; Epoxy resin; Methyl Ethyl Ketone (MEK) Tetrahydrofuran
Package Sizes
5 Gallon Pail | Request Quote |
Gallon | Request Quote |

10-3216CTR
Epoxies Etc
Adhesive; 2-Part; Liquid; Epoxy; Resin/Catalyst
A two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths.

10-3216CTR
Epoxies Etc
Structural/Load-Bearing: Strong structural bonds
Application Type: Adhesive
Industry: Electronic; Aerospace; Industrial; Masonry
Chemistry: Epoxy; Toughened

EP950NMF Gray
Resinlab
Bond; 1-Part; Thixotropic paste; Epoxy; Heat
A one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated temperature.

EP950NMF Gray
Resinlab
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Electronics; Furniture/Wood Working; Industrial; Military; Sporting Equipment; Transportation
Chemistry: Epoxy; Rubber modified epoxy
Package Sizes
20 oz Cartridge | Request Quote |
30 cc Air Fisnar Syringe | Request Quote |
30 cc Manual Syringe | Request Quote |
10 cc Air Syringe | Request Quote |

1 Minute Epoxy Gel
Devcon (ITW)
Bond; 2-Part; Gel; Epoxy; 2-Part Cure
Ultra-fast-curing, thixotropic adhesive gel adhesive for filling gaps, cracks and holes in metals, wood, concrete and glass.

1 Minute Epoxy Gel
Devcon (ITW)
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Appliance; Appliance; China; Furniture; Jewelry; Models
Chemistry: Epoxy
Package Sizes
50 ml | Request Quote |

Oxy-Bond TP-05LV
Henkel
Bond; 2-Part; Liquid; Epoxy; Resin/Hardener
Low viscosity system contains no solvents, and is suitable for high performance structural-bonding applications where the combination of very fast room temperature cure coupled with low shrinkage and excellent mechanical and electrical properties is required.

Oxy-Bond TP-05LV
Henkel
Structural/Load-Bearing: Structural
Application Type: Bond; Repair
Industry: Component assembly; Electronics; Fiber optics; Staking; Appliances; Construction; Construction materials; Fillet bonds; General industrial repairs; Masonry materials
Chemistry: Epoxy; Solvent-free

Duopox DB8989
Delo
Bond; 2-Part; Liquid; Modified epoxy resin; Light-fixable
• Modified epoxy resin • 2C • Light-fixable / room-temperature-curing • Very good temperature resistance • Halogen-free according to IEC 61249-2-21 • Compliant with RoHS Directive 2015/863/EU • Low-outgassing according to ECSS-Q-70-02.

Duopox DB8989
Delo
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Electronic
Chemistry: Modified epoxy resin; Halogen-free according to IEC 61249-2-21

Araldite 2011 Structural Adhesive
Huntsman
Bond; 2-Part; Paste; Epoxy; 2-Part Cure
Two part component has long pot life, self-levelling properties. The unique combination of low viscosity and a long open time helps eliminate air entrapment, making this adhesive ideal for jobs ranging from the encapsulation of electronic components to jewelry assembly.

Araldite 2011 Structural Adhesive
Huntsman
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Ideal for jobs ranging from the encapsulation of electronic components to jewelry assembly; A reliable choice in airplane galley assembly; Bonding motor magnets; Bonding wood in marine applications; Ideal for jobs ranging from the encapsulation of electronic components to jewelry assembly; Industrial use only; Most industrial applications; Multipurpose; Provided reliable bonding in large applications; Provided reliable bonding in small applications
Chemistry: Epoxy; Versatile

Oxy-Bond 1109-DP
Henkel
Bond; 2-Part; Liquid; Epoxy; Resin/Hardener
A transparent, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarity and excellent structural, mechanical and electrical properties are required.

Oxy-Bond 1109-DP
Henkel
Structural/Load-Bearing: Excellent
Application Type: Bond; Laminate; Pot; Repair
Industry: Electronic; Aerospace; Industrial; Slating applications; Small potting and laminating applications
Chemistry: Epoxy

9246
3M
Bond; 1-Part; Tape; Epoxy hybrid; Pressure Sensitive
High strength permanent bonds to glass, metals, ceramics, and engineered plastics.

9246
3M
Structural/Load-Bearing: Structural
Application Type: Bond
Industry: Non-conductive plastic to metal bonds in electronics; Wire mesh; Belts; Brackets; Glass door; Hinges; Knobs; Weld-free stainless steel joining; Windows
Chemistry: Epoxy hybrid; Acrylic

Araldite 2014
Huntsman
Adhesive; 2-Part; Paste; Epoxy; Part A/Part B
A two component, room temperature curing, thixotropic paste adhesive of high strength with good environmental resistance.

Araldite 2014
Huntsman
Structural/Load-Bearing: Structural
Application Type: Adhesive
Industry: Electronic components
Chemistry: Epoxy

Epo-Tek 730-110 Black
Epoxy Technology
Bond; 2-Part; Liquid; Epoxy; Room Temperature Cure
A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, x-ray device, filtration, opto-electronics and PCB industries.

Epo-Tek 730-110 Black
Epoxy Technology
Structural/Load-Bearing: Structural grade
Application Type: Bond; Encapsulating; Sealing
Industry: Opto-Electronics; PCB Industries; Filtration; Medical; X-ray device
Chemistry: Epoxy

Oxy-Bond 105 5 Minute
Henkel
Bond; 2-Part; Liquid; Epoxy; Resin/Hardener
Exceptional epoxy formulation, recommended for lower temperature or wet industrial bonding applications where fast curing is required. An excellent electrical insulator and provides superior resistance to vapors and gases, water, galvanic action, petroleum fuels, salt solutions, and many other organic and inorganic compounds.

Oxy-Bond 105 5 Minute
Henkel
Structural/Load-Bearing: Structural
Application Type: Bond; Repair
Industry: Component assembly; Electronics; Fiber optics; Staking; Appliances; Construction; Construction materials; Fillet bonds; General industrial repairs; Masonry materials; Wet industrial bonding
Chemistry: Epoxy; Solvent-free

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EP11HT
Package Sizes
Part A Gray Quart Part A Gray Gal Part A Gray 5 Gal Pail Part B Gray Quart Part B Gray Gal Part B Gray 5 Gal Pail Gray 6 oz Barrier Techkit Red 10 ml Dual Syringe Red 50 ml Cartridge White 50 ml Cartridge Gray 50 ml Cartridge Gray 150 x 150 ml Ratio Pak Cartridge Gray 200 ml Cartridge Gray 300 x 300 ml Ratio Pak Cartridge Gray 400 ml Cartridge Gray 600 ml Cartridge Gray 1/2 Pint KitEP750
Package Sizes
Part A Clear Pint Part A Clear Quart Part A Clear Gal Part A Gray Pail Part A Clear 5 Gal Pail Part A Clear 5 Gal Pail (Straight Wall) Part A Black 48 lb Pail Part A Clear 50 Ga Drum Part B Clear Pint Part B Clear Quart Part B Clear Gal Part B Gray Pail Part B Black Pail Part B Clear 5 Gal Pail Part B Clear 50 Gal Drum Clear 10 g Twinpak Clear 50 ml Cartridge Black 50 ml Cartridge White 50 ml Cartridge Clear 200 ml Cartridge Black 300 x 300 ml Cartridge Clear 400 ml Cartridge Black 400 ml Cartridge Clear 600 ml Cartridge Black 600 ml Cartridge Clear 750 x 750 ml Cartridge Clear 1500 ml Cartridge2 Ton Epoxy
EP1215
Package Sizes
Part B Black 5 Gal Pail Black 400 ml Cartridge Part B Black Gal Black 50 ml Cartridge Part A Clear 50 Gal Drum Part A Clear Gal Part A Clear 5 Gal Pail Part A Clear Pint Part A Clear Quart Part B Clear 50 Gal Drum Part B Clear Gal Part B Clear 5 Gal Pail Part B Clear Pint Part B Clear Quart Clear 400 ml Cartridge Clear 50 ml Cartridge Clear 6 oz Techkit Black Pre-Mixed & Frozen 55 cc Syringe Part A Black 5 Gal Pail Part A Black Gal320/322 Epoxy Adhesive
310 Epoxy Adhesive
Thermal Bonding Film AF42 (4 mil)
EP1199
Conapoxy AD-10
AF111
Package Sizes
40 in x 36 ydEP1115
3135/7111
2290
10-3216CTR
EP950NMF Gray
1 Minute Epoxy Gel
Package Sizes
50 mlOxy-Bond TP-05LV
Duopox DB8989
Araldite 2011 Structural Adhesive
Oxy-Bond 1109-DP
9246
Araldite 2014
Epo-Tek 730-110 Black
Oxy-Bond 105 5 Minute
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