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Chip on Board

Below is a curated list of chip on board materials. Feel free to browse by application type or jump over to the Gluespec Grids in Advanced Search. Our goal is to help you find the right material to test for your application.

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47 Materials

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Chip on Board

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Ultra Light-Weld 9-20557

Dymax

Conformal Coating; 1-Part; Liquid; Low VOCs; Heat

UV/Visible Light cure, Flexible, Conformal Coating and Medium Viscosity

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Ultra Light-Weld 9-20557

Dymax

Industry: Chip-on-Board; Avionics; Bare die; Battery Systems; E-Mobility Solutions; Infotainment systems; Lead Frame; PCB

Application Type: Conformal Coating

Color: Clear; Colorless Transparent ; Light Yellow

1 Part or 2 Part: 1-Part

Package Sizes

10 ml Machine-Ready Syringe Request Quote
30 ml Machine-Ready Syringe Request Quote
Liter Bottle Request Quote
15 L Pail Request Quote
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E-Max 10024

Dymax

Bond; 1-Part; Liquid; Modified urethane; UV/Visible Light

A flexible UV/visible light curing encapsulant, with improved moisture, thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to long wave UV and visible light, E-max 10024 is environmentally resistant with good ionic and electrical properties.

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E-Max 10024

Dymax

Industry: Chip on board; Chip on flex; Electronic components; Multi chip modules; PC boards

Application Type: Bond; Encapsulate; Instant Adhesives

Color: Clear

1 Part or 2 Part: 1-Part

Package Sizes

15 L Pail Request Quote
300 ml Cartridge Request Quote
30 ml Machine-Ready Syringe Request Quote
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Multi-Cure 9001-E-V3.0

Dymax

Encapsulant ; 1-Part; Liquid; Isocyanate Content: None; UV/Visible light-curable

UV/Visible light-curable encapsulant, with improved moisture and thermal cycle resistance, and adhesion to various component substrates. Excellent adhesion to printed circuit boards and electronic components and is especially well suited for chip-on-board, chip-on-flex, and multi-chip modules.

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Multi-Cure 9001-E-V3.0

Dymax

Industry: Especially well suited for chip-on-board; Bare die; Especially well suited for chip-on-flex; Especially well suited for multi-chip module; Excellent adhesion to electronic components; Excellent adhesion to printed circuit boards; Flex circuits

Application Type: Encapsulant

Color: Clear; Colorless

1 Part or 2 Part: 1-Part

Package Sizes

Clear 10 ml Manual Syringe Request Quote
Clear 10 ml Machine-Ready Syringe Request Quote
Clear 30 ml Manual Syringe Request Quote
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Ultra Light-Weld 9008

Dymax

Encapsulate; 1-Part; Liquid; Acrylated Urethane; UV/Visible Light Cure

A general purpose product for encapsulating and sealing electronic components in chip-on-Board or Chip-on-Flex (COF) applications. Forms flexible, highly moisture resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal and PET.

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Ultra Light-Weld 9008

Dymax

Industry: Chip on Board; Avionics; Bare die; Battery Systems; Camera Module; Chip on Flex; E-Mobility Solutions; Ideal for COF Applications; Wire Bonding

Application Type: Encapsulate

Color: Clear; Light Straw; Lt. Yellow

1 Part or 2 Part: 1-Part

Package Sizes

30 ml Manual Syringe Request Quote
30 ml Machine-Ready Syringe Request Quote
170 ml Cartridge Request Quote
550 ml Cartridge Request Quote
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Light Cap 9624 Conformal Coating for LEDs

Dymax

Conformal Coating; 1-Part; Liquid; Solvent Free; UV Light Cure

It is designed for rapid, room-temperature coating of LED arrays. Dymax Light Cap materials contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs.

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Light Cap 9624 Conformal Coating for LEDs

Dymax

Industry: Colorless encapsulation of COB LEDs; Colorless encapsulation of COB LEDs; Conformal coating for LED arrays; Electronic assembly; Leadframe; Protective lens for high intensity LEDs

Application Type: Colorless Encapsulation ; Conformal Coating

Color: Colorless ; Transparent

1 Part or 2 Part: 1-Part

Package Sizes

30 ml Machine-Ready Syringe Request Quote
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EO1059R

Henkel

Pot/Encapsulate; 1-Part; Liquid; Epoxy; Snap Cure

A medium viscosity, liquid encapsulant for chip-on-board (plastic substrate). This product is designed to cure in less than five minutes @ 140°C.

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EO1059R

Henkel

Industry: Snap Cure Encapsulant for Chip-On-Board

Application Type: Pot/Encapsulate

Color: Black

1 Part or 2 Part: 1-Part

Package Sizes

10 cc Request Quote
30 cc Request Quote
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Multi-Cure 9037-F

Dymax

Encapsulant; 1-Part; Gel; Acrylated Urethane; UV/Visible Light Cure

An improved, resilient, chip-encapsulant material designed with a UV/Visible light and secondary heat-cure system, making it ideal for encapsulation applications where shadow areas are present.

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Multi-Cure 9037-F

Dymax

Industry: Chip on Board; Advanced Driver-Assistance Systems (ADAS); Avionics; Bare die; Battery Systems; Chip on Flex; Chip on Glass; E-Mobility Solutions; Infotainment systems; PCB Board; Power Tools; Wire Bonding

Application Type: Bond; Encapsulant

Color: Clear; Translucent

1 Part or 2 Part: 1-Part

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MD 1040-M

Dymax

Bond; 1-Part; Liquid; Contain no nonreactive solvents; UV/Visible Light Cure

It is designed for rapid bonding, potting, or encapsulation on devices that require multiple autoclave cycles and is also compatible with many commonly used plastics for single use devices or housing assemblies. It contain no nonreactive solvents and cure upon exposure to light.

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MD 1040-M

Dymax

Industry: Chip-on-Board; Assemblies Requiring Repeat Sterilization; Bare die; Housing Assemblies; Medical PCB Coating; Medical PCB Coating; Reservoirs; RFID; Sensor; Single use plastic components; Survives Repeated Autoclave Cycles

Application Type: Bond; Encapsulation; Potting

Color: Colorless to Light-Yellow; Colorless to Light-Yellow

1 Part or 2 Part: 1-Part

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Dual-Cure 9014

Dymax

Encapsulant; 1-Part; Gel; Contain no nonreactive solvents; UV light cure

• UV light cure • Secondary moisture cure capability • Flexible encapsulant • Blue fluorescing • Contain no nonreactive solvents • In full compliance with RoHS directives 2015/863/EU.

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Dual-Cure 9014

Dymax

Industry: Chip on board; Bare die; Battery systems; Chip on flex; Chip on glass; E-mobility solutions; Ruggedizing; Wire bonding; Wire tacking

Application Type: Encapsulant

Color: Light yellow translucent; Light yellow translucent

1 Part or 2 Part: 1-Part

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Loctite Eccobond EO 1062

Henkel

Encapsulant; 1-Part; Liquid; Epoxy; Heat cure

• One-component • High performance • Low flow • Epoxy • Heat cure • Encapsulant • Chip-on-board

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Loctite Eccobond EO 1062

Henkel

Industry: Chip-on-board; Glob-top; Semiconductor encapsulant

Application Type: Encapsulant

Color: Black

1 Part or 2 Part: 1-Part

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9615

Dymax

Casting; 1-Part; Liquid; Acrylate resins; UV

Self-leveling viscosity for casting or potting, cures through UV transparent molds for consistent lens profile, potting without air entrapment

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9615

Dymax

Industry: Protect COB LED wire bonds; Brighter LEDs over time; Consistent lens profile; Designed for higher powered LEDs; High performance; Increased transmittance; Lower reject rates; Protect COB LED wire bonds

Application Type: Casting; Potting

Color:

1 Part or 2 Part: 1-Part

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Loctite Eccobond EO1061

Henkel

Encapsulation; 1-Part; Liquid; Epoxy; Heat cure

One-component, high performance, medium flow, heat cure, encapsulation, chip-on-board and low profile divices.

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Loctite Eccobond EO1061

Henkel

Industry: Chip-on-board; Electrical; Semiconductor encapsulant

Application Type: Encapsulation; Pot

Color: Black

1 Part or 2 Part: 1-Part

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Multi-Cure 9001-E-V3.7

Dymax

Encapsulant; 1-Part; Liquid; Modified Urethane; UV/Visible light-curable

UV/Visible light-curable encapsulant, this material is environmentally resistant with good ionic and electrical properties, excellent adhesion to printed circuit boards and electronic components.

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Multi-Cure 9001-E-V3.7

Dymax

Industry: Chip-on-board; Bare-die encapsulation; Chip-on-flex; Electronic Components; Multi-chip modules; Printed circuit boards

Application Type: Encapsulant

Color: Clear

1 Part or 2 Part: 1-Part

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KER-2500 A/B

Shinetsu

Potting encapsulant; 2-Part; Liquid; Methyl-based; Heat

A dual component, heat cure LED potting encapsulant that is designed for use in conjunction with Shin-Etsu's KER-2000 DAM/KER-2020 DAM damming materials for LED and COB applications.

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KER-2500 A/B

Shinetsu

Industry: COB applications; LED applications

Application Type: Potting encapsulant

Color: Transparent

1 Part or 2 Part: 2-Part

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9006-V3.1

Dymax

Encapsulate; 1-Part; Liquid; Modified urethane; UV/Visible Light

A toughened upgrade of the flexible “instant curing” Dymax 9006 UV/visible light curing encapsulant, specifically designed to provide protection for fine wires against mechanical force or pressure.

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9006-V3.1

Dymax

Industry: Chip on board; Chip on flex; Multichip modules; PC board and electronic components

Application Type: Encapsulate

Color: Black

1 Part or 2 Part: 1-Part

Package Sizes

Black 10 ml Manual Syringe Request Quote
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Loctite Eccobond EN 3410

Henkel

Coating; 1-Part; Liquid; Acrylate; Ultraviolet (UV) light, LED light

It is designed for COG/COF of LCD module or micro patterned FPC substrate of OLED module assembly applications. It is designed to improve crack/fracture resistance.

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Loctite Eccobond EN 3410

Henkel

Industry: Chip-On-Board; Delamination for overall improvement of package reliability; Designed for COF of LCD module; Designed for COG of LCD module; OLED module assembly applications

Application Type: Coating; Encapsulant

Color: Light yellow

1 Part or 2 Part: 1-Part

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Epo-Tek EJ2189-LV

Epoxy Technology

Adhesive; 2-Part; Paste; Epoxy; 2-Part Cure

An electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.

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Epo-Tek EJ2189-LV

Epoxy Technology

Industry: Chip on board; Cryogenic applications; Die-attach; Hybrids; IC packages; ITO interconnections in LCDs; Low temperature die-attach used in hybrids; RF shielding; SMD

Application Type: Adhesive; EMI shielding

Color:

1 Part or 2 Part: 2-Part

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Loctite Eccobond DS 3318BL

Henkel

Encapsulation; 1-Part; Liquid; Acrylic; UV LED Cure

A one-part, fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules.

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Loctite Eccobond DS 3318BL

Henkel

Industry: Chip-On-Board; Glob top; Protection of COF (Chip-on-Film) in LCD modules.; Use in applications requiring lower energy cure

Application Type: Encapsulation

Color: Blue

1 Part or 2 Part: 1-Part

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Loctite Eccobond DS 3318LV

Henkel

Coating; 1-Part; Liquid; Acrylic; UV LED

Suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly.

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Loctite Eccobond DS 3318LV

Henkel

Industry: Chip-on-Board; A wide variety of coating applications; ITO/COG overcoat in LCD module assembly

Application Type: Coating; Sealant

Color: Light yellow; Transparent

1 Part or 2 Part: 1-Part

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Epo-Tek H70E-4

Epoxy Technology

Bond; 2-Part; Paste; Epoxy; 2-Part Cure

A two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level.

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Epo-Tek H70E-4

Epoxy Technology

Industry: COB attach; Active and passive SMT packages; Adhesive for opto-electronic packaging; Adhesive for opto-electronic packaging; Bonding ferrites and magnets for electronic sub-assemblies; Bonding ferrites and magnets for electronic sub-assemblies; Bonding SMDs to PCB; Die attach onto substrates; Direct-chip attach; Fiber optic components; Heat sinks; May be used for heat sinking power devices in the form of hybrid circuits; May be used in aluminum heat sinking power devices at PCB level; May be used in aluminum heat sinking power devices at PCB level; May be used in aluminum heat sinking power devices at the SMD level; May be used in aluminum heat sinking power devices at the SMD level; Micro-electronic; PCB; Semiconductor; Staking SMDs to PCB for double sided circuits

Application Type: Bond

Color:

1 Part or 2 Part: 2-Part

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9309-SC

Dymax

Adhesive; 1-Part; Gel; Acrylated Urethane; UV/Visible Light

The blue color disappears when fully cured. The optimum balance of UV and visible light for the fastest, deepest cures.

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9309-SC

Dymax

Industry: Chip-on-Board; Avionics; Bare die; Battery Systems; BGA Reinforcement; Camera Module; CSP Reinforcement; E-Mobility Solutions; Leadframe; Printed Circuit Boards (PCB); Ruggedizing; Wire Tacking

Application Type: Adhesive; Instant Adhesives

Color: Blue; Clear

1 Part or 2 Part: 1-Part

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Emax Dual-Cure 99004

Dymax

Encapsulant; 1-Part; Gel; Contain no nonreactive solvents; UV Light Cure

Blue Fluorescing Encapsulant/Wire Bond Adhesive with Secondary Moisture Cure.

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Emax Dual-Cure 99004

Dymax

Industry: Chip-on-Board; Chip-on-Flex; Wire Bond

Application Type: Bond; Encapsulant; Instant Adhesives

Color: Light Yellow Translucent; Light Yellow Translucent

1 Part or 2 Part: 1-Part

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Loctite Eccobond EN 3839

Henkel

Encapsulant; 1-Part; Liquid; Acrylic; UV curable

• One component • UV/ heat curable • Thixotropic • Low Tg • Low modulus • Reworkable • Halogen-free • Acrylic • Transparent light blue liquid • Encapsulant, Glob top.

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Loctite Eccobond EN 3839

Henkel

Industry: Chip-on-Board; BGA; CSP; Designed for encapsulating components on PCB applications; Glob top; Stable electrical performance in temperature humidity bias

Application Type: Encapsulant

Color: Light blue; Transparent

1 Part or 2 Part: 1-Part

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Epo-Tek 353ND-T4

Epoxy Technology

Bond; 2-Part; Paste; Epoxy; 2-Part Cure

A two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance .This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow.

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Epo-Tek 353ND-T4

Epoxy Technology

Industry: Suitable for COB glob top DAM material; Bonding ferrite cores together in copper coil windings; Circuit Assembly Applications; Fiber optic; Fiber optic; Hybrid devices; Inductor coils; Medical devices; Power devices; Staking SMD's to PCB; Suitable for COB glob top DAM material

Application Type: Bond

Color:

1 Part or 2 Part: 2-Part

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Ultra Light-Weld 9-20557

Conformal Coating; 1-Part; Liquid; Low VOCs; Heat
UV/Visible Light cure, Flexible, Conformal Coating and Medium Viscosity
Manufacturer: Dymax
Industry: Chip-on-Board; Avionics; Bare die; Battery Systems; E-Mobility Solutions; Infotainment systems; Lead Frame; PCB
Color: Clear; Colorless Transparent ; Light Yellow
Glass Transition Temp (Tg) (°C): 49
Light Refractive Index (RI) (): 1.5100

Package Sizes

10 ml Machine-Ready Syringe 30 ml Machine-Ready Syringe Liter Bottle 15 L Pail
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E-Max 10024

Bond; 1-Part; Liquid; Modified urethane; UV/Visible Light
A flexible UV/visible light curing encapsulant, with improved moisture, thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to long wave UV and visible light, E-max 10024 is environmentally resistant with good ionic and electrical properties.
Manufacturer: Dymax
Industry: Chip on board; Chip on flex; Electronic components; Multi chip modules; PC boards
Color: Clear
Glass Transition Temp (Tg) (°C): 25
Coefficient of Thermal Expansion (CTE): 100e-6 (in/in/oC); 250e-6 (in/in/oC)

Package Sizes

15 L Pail 300 ml Cartridge 30 ml Machine-Ready Syringe
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Multi-Cure 9001-E-V3.0

Encapsulant ; 1-Part; Liquid; Isocyanate Content: None; UV/Visible light-curable
UV/Visible light-curable encapsulant, with improved moisture and thermal cycle resistance, and adhesion to various component substrates. Excellent adhesion to printed circuit boards and electronic components and is especially well suited for chip-on-board, chip-on-flex, and multi-chip modules.
Manufacturer: Dymax
Industry: Especially well suited for chip-on-board; Bare die; Especially well suited for chip-on-flex; Especially well suited for multi-chip module; Excellent adhesion to electronic components; Excellent adhesion to printed circuit boards; Flex circuits
Color: Clear; Colorless
Glass Transition Temp (Tg) (°C): 41
Coefficient of Thermal Expansion (CTE): 180 (mm/m/°C); 95 (mm/m/°C)

Package Sizes

Clear 10 ml Manual Syringe Clear 10 ml Machine-Ready Syringe Clear 30 ml Manual Syringe
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Ultra Light-Weld 9008

Encapsulate; 1-Part; Liquid; Acrylated Urethane; UV/Visible Light Cure
A general purpose product for encapsulating and sealing electronic components in chip-on-Board or Chip-on-Flex (COF) applications. Forms flexible, highly moisture resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal and PET.
Manufacturer: Dymax
Industry: Chip on Board; Avionics; Bare die; Battery Systems; Camera Module; Chip on Flex; E-Mobility Solutions; Ideal for COF Applications; Wire Bonding
Color: Clear; Light Straw; Lt. Yellow
Glass Transition Temp (Tg) (°C): 55
Light Refractive Index (RI) (): 1.5000
Coefficient of Thermal Expansion (CTE): 131 µm/m/°C; 230 µm/m/°C

Package Sizes

30 ml Manual Syringe 30 ml Machine-Ready Syringe 170 ml Cartridge 550 ml Cartridge 10 ml Manual Syringe 10 ml Machine-Ready Syringe
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Light Cap 9624 Conformal Coating for LEDs

Conformal Coating; 1-Part; Liquid; Solvent Free; UV Light Cure
It is designed for rapid, room-temperature coating of LED arrays. Dymax Light Cap materials contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs.
Manufacturer: Dymax
Industry: Colorless encapsulation of COB LEDs; Colorless encapsulation of COB LEDs; Conformal coating for LED arrays; Electronic assembly; Leadframe; Protective lens for high intensity LEDs
Color: Colorless ; Transparent
Light Refractive Index (RI) (): 1.5100

Package Sizes

30 ml Machine-Ready Syringe
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EO1059R

Pot/Encapsulate; 1-Part; Liquid; Epoxy; Snap Cure
A medium viscosity, liquid encapsulant for chip-on-board (plastic substrate). This product is designed to cure in less than five minutes @ 140°C.
Manufacturer: Henkel
Industry: Snap Cure Encapsulant for Chip-On-Board
Color: Black
Glass Transition Temp (Tg) (°C): 125
Coefficient of Thermal Expansion (CTE): 27 (ppm/ºC); 80 (ppm/ºC)

Package Sizes

10 cc 30 cc
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Multi-Cure 9037-F

Encapsulant; 1-Part; Gel; Acrylated Urethane; UV/Visible Light Cure
An improved, resilient, chip-encapsulant material designed with a UV/Visible light and secondary heat-cure system, making it ideal for encapsulation applications where shadow areas are present.
Manufacturer: Dymax
Industry: Chip on Board; Advanced Driver-Assistance Systems (ADAS); Avionics; Bare die; Battery Systems; Chip on Flex; Chip on Glass; E-Mobility Solutions; Infotainment systems; PCB Board; Power Tools; Wire Bonding
Color: Clear; Translucent
Glass Transition Temp (Tg) (°C): 31
Light Refractive Index (RI) (): 1.5000
Coefficient of Thermal Expansion (CTE): 126 (µm/m/°C); 171 (µm/m/°C)
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MD 1040-M

Bond; 1-Part; Liquid; Contain no nonreactive solvents; UV/Visible Light Cure
It is designed for rapid bonding, potting, or encapsulation on devices that require multiple autoclave cycles and is also compatible with many commonly used plastics for single use devices or housing assemblies. It contain no nonreactive solvents and cure upon exposure to light.
Manufacturer: Dymax
Industry: Chip-on-Board; Assemblies Requiring Repeat Sterilization; Bare die; Housing Assemblies; Medical PCB Coating; Medical PCB Coating; Reservoirs; RFID; Sensor; Single use plastic components; Survives Repeated Autoclave Cycles
Color: Colorless to Light-Yellow; Colorless to Light-Yellow
Glass Transition Temp (Tg) (°C): 115
Light Refractive Index (RI) (): 1.4900
Coefficient of Thermal Expansion (CTE): 121 (µm/m/°C); 194 (µm/m/°C )
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Dual-Cure 9014

Encapsulant; 1-Part; Gel; Contain no nonreactive solvents; UV light cure
• UV light cure • Secondary moisture cure capability • Flexible encapsulant • Blue fluorescing • Contain no nonreactive solvents • In full compliance with RoHS directives 2015/863/EU.
Manufacturer: Dymax
Industry: Chip on board; Bare die; Battery systems; Chip on flex; Chip on glass; E-mobility solutions; Ruggedizing; Wire bonding; Wire tacking
Color: Light yellow translucent; Light yellow translucent
Glass Transition Temp (Tg) (°C): 51
Light Refractive Index (RI) (): 1.5000
Coefficient of Thermal Expansion (CTE): 107 (µm/m/°C); 192 (µm/m/°C)
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Loctite Eccobond EO 1062

Encapsulant; 1-Part; Liquid; Epoxy; Heat cure
• One-component • High performance • Low flow • Epoxy • Heat cure • Encapsulant • Chip-on-board
Manufacturer: Henkel
Industry: Chip-on-board; Glob-top; Semiconductor encapsulant
Color: Black
Glass Transition Temp (Tg) (°C): 125
Coefficient of Thermal Expansion (CTE): 40 (ppm/°C)
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9615

Casting; 1-Part; Liquid; Acrylate resins; UV
Self-leveling viscosity for casting or potting, cures through UV transparent molds for consistent lens profile, potting without air entrapment
Manufacturer: Dymax
Industry: Protect COB LED wire bonds; Brighter LEDs over time; Consistent lens profile; Designed for higher powered LEDs; High performance; Increased transmittance; Lower reject rates; Protect COB LED wire bonds
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Loctite Eccobond EO1061

Encapsulation; 1-Part; Liquid; Epoxy; Heat cure
One-component, high performance, medium flow, heat cure, encapsulation, chip-on-board and low profile divices.
Manufacturer: Henkel
Industry: Chip-on-board; Electrical; Semiconductor encapsulant
Color: Black
Glass Transition Temp (Tg) (°C): 125
Coefficient of Thermal Expansion (CTE): 40 (ppm/°C)
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Multi-Cure 9001-E-V3.7

Encapsulant; 1-Part; Liquid; Modified Urethane; UV/Visible light-curable
UV/Visible light-curable encapsulant, this material is environmentally resistant with good ionic and electrical properties, excellent adhesion to printed circuit boards and electronic components.
Manufacturer: Dymax
Industry: Chip-on-board; Bare-die encapsulation; Chip-on-flex; Electronic Components; Multi-chip modules; Printed circuit boards
Color: Clear
Glass Transition Temp (Tg) (°C): 45
Coefficient of Thermal Expansion (CTE): 180e-6 (in/in/ºC); 95e-6 (in/in/ºC)
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KER-2500 A/B

Potting encapsulant; 2-Part; Liquid; Methyl-based; Heat
A dual component, heat cure LED potting encapsulant that is designed for use in conjunction with Shin-Etsu's KER-2000 DAM/KER-2020 DAM damming materials for LED and COB applications.
Manufacturer: Shinetsu
Industry: COB applications; LED applications
Color: Transparent
Light Refractive Index (RI) (): Excellent; 1.4100
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9006-V3.1

Encapsulate; 1-Part; Liquid; Modified urethane; UV/Visible Light
A toughened upgrade of the flexible “instant curing” Dymax 9006 UV/visible light curing encapsulant, specifically designed to provide protection for fine wires against mechanical force or pressure.
Manufacturer: Dymax
Industry: Chip on board; Chip on flex; Multichip modules; PC board and electronic components
Color: Black
Glass Transition Temp (Tg) (°C): 23
Coefficient of Thermal Expansion (CTE): 130e-6 (in/in/oC)

Package Sizes

Black 10 ml Manual Syringe
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Loctite Eccobond EN 3410

Coating; 1-Part; Liquid; Acrylate; Ultraviolet (UV) light, LED light
It is designed for COG/COF of LCD module or micro patterned FPC substrate of OLED module assembly applications. It is designed to improve crack/fracture resistance.
Manufacturer: Henkel
Industry: Chip-On-Board; Delamination for overall improvement of package reliability; Designed for COF of LCD module; Designed for COG of LCD module; OLED module assembly applications
Color: Light yellow
Glass Transition Temp (Tg) (°C): 67
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Epo-Tek EJ2189-LV

Adhesive; 2-Part; Paste; Epoxy; 2-Part Cure
An electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.
Manufacturer: Epoxy Technology
Industry: Chip on board; Cryogenic applications; Die-attach; Hybrids; IC packages; ITO interconnections in LCDs; Low temperature die-attach used in hybrids; RF shielding; SMD
Glass Transition Temp (Tg) (°C): >= 40 (°C)
Coefficient of Thermal Expansion (CTE): 52e-6 (in/in°C); 89e-6 (in/in°C)
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Loctite Eccobond DS 3318BL

Encapsulation; 1-Part; Liquid; Acrylic; UV LED Cure
A one-part, fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules.
Manufacturer: Henkel
Industry: Chip-On-Board; Glob top; Protection of COF (Chip-on-Film) in LCD modules.; Use in applications requiring lower energy cure
Color: Blue
Glass Transition Temp (Tg) (°C): 58
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Loctite Eccobond DS 3318LV

Coating; 1-Part; Liquid; Acrylic; UV LED
Suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly.
Manufacturer: Henkel
Industry: Chip-on-Board; A wide variety of coating applications; ITO/COG overcoat in LCD module assembly
Color: Light yellow; Transparent
Glass Transition Temp (Tg) (°C): 64
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Epo-Tek H70E-4

Bond; 2-Part; Paste; Epoxy; 2-Part Cure
A two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level.
Manufacturer: Epoxy Technology
Industry: COB attach; Active and passive SMT packages; Adhesive for opto-electronic packaging; Adhesive for opto-electronic packaging; Bonding ferrites and magnets for electronic sub-assemblies; Bonding ferrites and magnets for electronic sub-assemblies; Bonding SMDs to PCB; Die attach onto substrates; Direct-chip attach; Fiber optic components; Heat sinks; May be used for heat sinking power devices in the form of hybrid circuits; May be used in aluminum heat sinking power devices at PCB level; May be used in aluminum heat sinking power devices at PCB level; May be used in aluminum heat sinking power devices at the SMD level; May be used in aluminum heat sinking power devices at the SMD level; Micro-electronic; PCB; Semiconductor; Staking SMDs to PCB for double sided circuits
Glass Transition Temp (Tg) (°C): >80
Coefficient of Thermal Expansion (CTE): 17e-6 (in/in°C); 77e-6 (in/in/°C)
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9309-SC

Adhesive; 1-Part; Gel; Acrylated Urethane; UV/Visible Light
The blue color disappears when fully cured. The optimum balance of UV and visible light for the fastest, deepest cures.
Manufacturer: Dymax
Industry: Chip-on-Board; Avionics; Bare die; Battery Systems; BGA Reinforcement; Camera Module; CSP Reinforcement; E-Mobility Solutions; Leadframe; Printed Circuit Boards (PCB); Ruggedizing; Wire Tacking
Color: Blue; Clear
Glass Transition Temp (Tg) (°C): 65
Light Refractive Index (RI) (): 1.5000
Coefficient of Thermal Expansion (CTE): 162 (µm/m°C); 204 (µm/m°C)
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Emax Dual-Cure 99004

Encapsulant; 1-Part; Gel; Contain no nonreactive solvents; UV Light Cure
Blue Fluorescing Encapsulant/Wire Bond Adhesive with Secondary Moisture Cure.
Manufacturer: Dymax
Industry: Chip-on-Board; Chip-on-Flex; Wire Bond
Color: Light Yellow Translucent; Light Yellow Translucent
Glass Transition Temp (Tg) (°C): 51
Light Refractive Index (RI) (): 1.5000
Coefficient of Thermal Expansion (CTE): 107 (?m/m/°C); 192 (?m/m/°C)
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Loctite Eccobond EN 3839

Encapsulant; 1-Part; Liquid; Acrylic; UV curable
• One component • UV/ heat curable • Thixotropic • Low Tg • Low modulus • Reworkable • Halogen-free • Acrylic • Transparent light blue liquid • Encapsulant, Glob top.
Manufacturer: Henkel
Industry: Chip-on-Board; BGA; CSP; Designed for encapsulating components on PCB applications; Glob top; Stable electrical performance in temperature humidity bias
Color: Light blue; Transparent
Glass Transition Temp (Tg) (°C): Low Tg; 26
Coefficient of Thermal Expansion (CTE): 108 (ppm/°C); 211 (ppm/°C)
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Epo-Tek 353ND-T4

Bond; 2-Part; Paste; Epoxy; 2-Part Cure
A two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance .This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow.
Manufacturer: Epoxy Technology
Industry: Suitable for COB glob top DAM material; Bonding ferrite cores together in copper coil windings; Circuit Assembly Applications; Fiber optic; Fiber optic; Hybrid devices; Inductor coils; Medical devices; Power devices; Staking SMD's to PCB; Suitable for COB glob top DAM material
Glass Transition Temp (Tg) (°C): >90
Coefficient of Thermal Expansion (CTE): 43e-6 in/in°C; 231e-6 in/in°C
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47 results
Industry
Application Type
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1 Part or 2 Part
Glass Transition Temp (Tg) (°C)
Light Refractive Index (RI) ()
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Chemistry
Description
Ultra Light-Weld 9-20557
Dymax
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Chip-on-Board; Avionics; Bare die; Battery Systems; E-Mobility Solutions; Infotainment systems; Lead Frame; PCB
Conformal Coating
Clear; Colorless Transparent ; Light Yellow
1-Part
49
1.5100
Acrylated Urethane; Acrylated Urethane; Acrylated Urethane; Low VOCs
UV/Visible Light cure, Flexible, Conformal Coating and Medium Viscosity
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10 ml Machine-Ready Syringe 30 ml Machine-Ready Syringe Liter Bottle 15 L Pail
E-Max 10024
Dymax
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Chip on board; Chip on flex; Electronic components; Multi chip modules; PC boards
Bond; Encapsulate; Instant Adhesives
Clear
1-Part
25
100e-6 (in/in/oC); 250e-6 (in/in/oC)
Modified urethane
A flexible UV/visible light curing encapsulant, with improved moisture, thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to long wave UV and visible light, E-max 10024 is environmentally resistant with good ionic and electrical properties.
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15 L Pail 300 ml Cartridge 30 ml Machine-Ready Syringe
Multi-Cure 9001-E-V3.0
Dymax
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Especially well suited for chip-on-board; Bare die; Especially well suited for chip-on-flex; Especially well suited for multi-chip module; Excellent adhesion to electronic components; Excellent adhesion to printed circuit boards; Flex circuits
Encapsulant
Clear; Colorless
1-Part
41
180 (mm/m/°C); 95 (mm/m/°C)
Isocyanate Content: None; Modified Urethane; Solvent Content: None
UV/Visible light-curable encapsulant, with improved moisture and thermal cycle resistance, and adhesion to various component substrates. Excellent adhesion to printed circuit boards and electronic components and is especially well suited for chip-on-board, chip-on-flex, and multi-chip modules.
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Clear 10 ml Manual Syringe Clear 10 ml Machine-Ready Syringe Clear 30 ml Manual Syringe
Ultra Light-Weld 9008
Dymax
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Chip on Board; Avionics; Bare die; Battery Systems; Camera Module; Chip on Flex; E-Mobility Solutions; Ideal for COF Applications; Wire Bonding
Encapsulate
Clear; Light Straw; Lt. Yellow
1-Part
55
1.5000
131 µm/m/°C; 230 µm/m/°C
Acrylated Urethane; Acrylated Urethane; Acrylated Urethane; No Nonreactive Solvents
A general purpose product for encapsulating and sealing electronic components in chip-on-Board or Chip-on-Flex (COF) applications. Forms flexible, highly moisture resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal and PET.
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30 ml Manual Syringe 30 ml Machine-Ready Syringe 170 ml Cartridge 550 ml Cartridge 10 ml Manual Syringe 10 ml Machine-Ready Syringe
Light Cap 9624 Conformal Coating for LEDs
Dymax
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Colorless encapsulation of COB LEDs; Colorless encapsulation of COB LEDs; Conformal coating for LED arrays; Electronic assembly; Leadframe; Protective lens for high intensity LEDs
Colorless Encapsulation ; Conformal Coating
Colorless ; Transparent
1-Part
1.5100
Acrylated Urethane; Acrylated Urethane; Acrylated Urethane; Isocyanate-free; Low VOCs; Solvent Free
It is designed for rapid, room-temperature coating of LED arrays. Dymax Light Cap materials contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs.
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30 ml Machine-Ready Syringe
EO1059R
Henkel
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Snap Cure Encapsulant for Chip-On-Board
Pot/Encapsulate
Black
1-Part
125
27 (ppm/ºC); 80 (ppm/ºC)
Epoxy
A medium viscosity, liquid encapsulant for chip-on-board (plastic substrate). This product is designed to cure in less than five minutes @ 140°C.
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10 cc 30 cc
Multi-Cure 9037-F
Dymax
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Chip on Board; Advanced Driver-Assistance Systems (ADAS); Avionics; Bare die; Battery Systems; Chip on Flex; Chip on Glass; E-Mobility Solutions; Infotainment systems; PCB Board; Power Tools; Wire Bonding
Bond; Encapsulant
Clear; Translucent
1-Part
31
1.5000
126 (µm/m/°C); 171 (µm/m/°C)
Acrylated Urethane; Acrylated Urethane; Acrylated Urethane; No nonreactive solvents
An improved, resilient, chip-encapsulant material designed with a UV/Visible light and secondary heat-cure system, making it ideal for encapsulation applications where shadow areas are present.
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MD 1040-M
Dymax
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Chip-on-Board; Assemblies Requiring Repeat Sterilization; Bare die; Housing Assemblies; Medical PCB Coating; Medical PCB Coating; Reservoirs; RFID; Sensor; Single use plastic components; Survives Repeated Autoclave Cycles
Bond; Encapsulation; Potting
Colorless to Light-Yellow; Colorless to Light-Yellow
1-Part
115
1.4900
121 (µm/m/°C); 194 (µm/m/°C )
Acrylated Urethane; Acrylated Urethane; Acrylated Urethane; Contain no nonreactive solvents
It is designed for rapid bonding, potting, or encapsulation on devices that require multiple autoclave cycles and is also compatible with many commonly used plastics for single use devices or housing assemblies. It contain no nonreactive solvents and cure upon exposure to light.
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Dual-Cure 9014
Dymax
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Chip on board; Bare die; Battery systems; Chip on flex; Chip on glass; E-mobility solutions; Ruggedizing; Wire bonding; Wire tacking
Encapsulant
Light yellow translucent; Light yellow translucent
1-Part
51
1.5000
107 (µm/m/°C); 192 (µm/m/°C)
Acrylated Urethane; Acrylated Urethane; Acrylated Urethane; Contain no nonreactive solvents
• UV light cure • Secondary moisture cure capability • Flexible encapsulant • Blue fluorescing • Contain no nonreactive solvents • In full compliance with RoHS directives 2015/863/EU.
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Loctite Eccobond EO 1062
Henkel
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Chip-on-board; Glob-top; Semiconductor encapsulant
Encapsulant
Black
1-Part
125
40 (ppm/°C)
Epoxy
• One-component • High performance • Low flow • Epoxy • Heat cure • Encapsulant • Chip-on-board
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9615
Dymax
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Protect COB LED wire bonds; Brighter LEDs over time; Consistent lens profile; Designed for higher powered LEDs; High performance; Increased transmittance; Lower reject rates; Protect COB LED wire bonds
Casting; Potting
1-Part
Acrylate resins
Self-leveling viscosity for casting or potting, cures through UV transparent molds for consistent lens profile, potting without air entrapment
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Loctite Eccobond EO1061
Henkel
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Chip-on-board; Electrical; Semiconductor encapsulant
Encapsulation; Pot
Black
1-Part
125
40 (ppm/°C)
Epoxy
One-component, high performance, medium flow, heat cure, encapsulation, chip-on-board and low profile divices.
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Multi-Cure 9001-E-V3.7
Dymax
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Chip-on-board; Bare-die encapsulation; Chip-on-flex; Electronic Components; Multi-chip modules; Printed circuit boards
Encapsulant
Clear
1-Part
45
180e-6 (in/in/ºC); 95e-6 (in/in/ºC)
Modified Urethane; Solvent-Free
UV/Visible light-curable encapsulant, this material is environmentally resistant with good ionic and electrical properties, excellent adhesion to printed circuit boards and electronic components.
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KER-2500 A/B
Shinetsu
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COB applications; LED applications
Potting encapsulant
Transparent
2-Part
Excellent; 1.4100
Methyl-based; Silicone
A dual component, heat cure LED potting encapsulant that is designed for use in conjunction with Shin-Etsu's KER-2000 DAM/KER-2020 DAM damming materials for LED and COB applications.
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9006-V3.1
Dymax
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Chip on board; Chip on flex; Multichip modules; PC board and electronic components
Encapsulate
Black
1-Part
23
130e-6 (in/in/oC)
Modified urethane; Modified urethane; Modified urethane
A toughened upgrade of the flexible “instant curing” Dymax 9006 UV/visible light curing encapsulant, specifically designed to provide protection for fine wires against mechanical force or pressure.
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Black 10 ml Manual Syringe
Loctite Eccobond EN 3410
Henkel
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Chip-On-Board; Delamination for overall improvement of package reliability; Designed for COF of LCD module; Designed for COG of LCD module; OLED module assembly applications
Coating; Encapsulant
Light yellow
1-Part
67
Acrylate
It is designed for COG/COF of LCD module or micro patterned FPC substrate of OLED module assembly applications. It is designed to improve crack/fracture resistance.
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Epo-Tek EJ2189-LV
Epoxy Technology
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Chip on board; Cryogenic applications; Die-attach; Hybrids; IC packages; ITO interconnections in LCDs; Low temperature die-attach used in hybrids; RF shielding; SMD
Adhesive; EMI shielding
2-Part
>= 40 (°C)
52e-6 (in/in°C); 89e-6 (in/in°C)
Epoxy
An electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.
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Loctite Eccobond DS 3318BL
Henkel
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Chip-On-Board; Glob top; Protection of COF (Chip-on-Film) in LCD modules.; Use in applications requiring lower energy cure
Encapsulation
Blue
1-Part
58
Acrylic
A one-part, fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules.
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Loctite Eccobond DS 3318LV
Henkel
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Chip-on-Board; A wide variety of coating applications; ITO/COG overcoat in LCD module assembly
Coating; Sealant
Light yellow; Transparent
1-Part
64
Acrylic
Suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly.
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Epo-Tek H70E-4
Epoxy Technology
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COB attach; Active and passive SMT packages; Adhesive for opto-electronic packaging; Adhesive for opto-electronic packaging; Bonding ferrites and magnets for electronic sub-assemblies; Bonding ferrites and magnets for electronic sub-assemblies; Bonding SMDs to PCB; Die attach onto substrates; Direct-chip attach; Fiber optic components; Heat sinks; May be used for heat sinking power devices in the form of hybrid circuits; May be used in aluminum heat sinking power devices at PCB level; May be used in aluminum heat sinking power devices at PCB level; May be used in aluminum heat sinking power devices at the SMD level; May be used in aluminum heat sinking power devices at the SMD level; Micro-electronic; PCB; Semiconductor; Staking SMDs to PCB for double sided circuits
Bond
2-Part
>80
17e-6 (in/in°C); 77e-6 (in/in/°C)
Epoxy
A two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level.
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9309-SC
Dymax
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Chip-on-Board; Avionics; Bare die; Battery Systems; BGA Reinforcement; Camera Module; CSP Reinforcement; E-Mobility Solutions; Leadframe; Printed Circuit Boards (PCB); Ruggedizing; Wire Tacking
Adhesive; Instant Adhesives
Blue; Clear
1-Part
65
1.5000
162 (µm/m°C); 204 (µm/m°C)
Acrylated Urethane; Acrylated Urethane; Acrylated Urethane; No Nonreactive Solvents; Organic Solvents
The blue color disappears when fully cured. The optimum balance of UV and visible light for the fastest, deepest cures.
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Emax Dual-Cure 99004
Dymax
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Chip-on-Board; Chip-on-Flex; Wire Bond
Bond; Encapsulant; Instant Adhesives
Light Yellow Translucent; Light Yellow Translucent
1-Part
51
1.5000
107 (?m/m/°C); 192 (?m/m/°C)
Acrylated Urethane; Acrylated Urethane; Acrylated Urethane; Contain no nonreactive solvents
Blue Fluorescing Encapsulant/Wire Bond Adhesive with Secondary Moisture Cure.
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Loctite Eccobond EN 3839
Henkel
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Chip-on-Board; BGA; CSP; Designed for encapsulating components on PCB applications; Glob top; Stable electrical performance in temperature humidity bias
Encapsulant
Light blue; Transparent
1-Part
Low Tg; 26
108 (ppm/°C); 211 (ppm/°C)
Acrylic; Halogen-free
• One component • UV/ heat curable • Thixotropic • Low Tg • Low modulus • Reworkable • Halogen-free • Acrylic • Transparent light blue liquid • Encapsulant, Glob top.
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Epo-Tek 353ND-T4
Epoxy Technology
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Suitable for COB glob top DAM material; Bonding ferrite cores together in copper coil windings; Circuit Assembly Applications; Fiber optic; Fiber optic; Hybrid devices; Inductor coils; Medical devices; Power devices; Staking SMD's to PCB; Suitable for COB glob top DAM material
Bond
2-Part
>90
43e-6 in/in°C; 231e-6 in/in°C
Epoxy
A two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance .This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow.
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