
Chip on Board
Below is a curated list of chip on board materials. Feel free to browse by application type or jump over to the Gluespec Grids in Advanced Search. Our goal is to help you find the right material to test for your application.
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All Chip on Board
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Pottant / Encapsulant
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Adhesive
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Sealant
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Coating
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Casting / Moldmaking
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Conformal Coating
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EMI Shielding
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Repair & Maintenance
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Thermal Adhesive
Chip on Board
Ultra Light-Weld 9-20557
Dymax
Conformal Coating; 1-Part; Liquid; Low VOCs; Heat
UV/Visible Light cure, Flexible, Conformal Coating and Medium Viscosity

Ultra Light-Weld 9-20557
Dymax
Industry: Chip-on-Board; Avionics; Bare die; Battery Systems; E-Mobility Solutions; Infotainment systems; Lead Frame; PCB
Application Type: Conformal Coating
Color: Clear; Colorless Transparent ; Light Yellow
1 Part or 2 Part: 1-Part
Package Sizes
10 ml Machine-Ready Syringe | Request Quote |
30 ml Machine-Ready Syringe | Request Quote |
Liter Bottle | Request Quote |
15 L Pail | Request Quote |

E-Max 10024
Dymax
Bond; 1-Part; Liquid; Modified urethane; UV/Visible Light
A flexible UV/visible light curing encapsulant, with improved moisture, thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to long wave UV and visible light, E-max 10024 is environmentally resistant with good ionic and electrical properties.

E-Max 10024
Dymax
Industry: Chip on board; Chip on flex; Electronic components; Multi chip modules; PC boards
Application Type: Bond; Encapsulate; Instant Adhesives
Color: Clear
1 Part or 2 Part: 1-Part
Package Sizes
15 L Pail | Request Quote |
300 ml Cartridge | Request Quote |
30 ml Machine-Ready Syringe | Request Quote |

Multi-Cure 9001-E-V3.0
Dymax
Encapsulant ; 1-Part; Liquid; Isocyanate Content: None; UV/Visible light-curable
UV/Visible light-curable encapsulant, with improved moisture and thermal cycle resistance, and adhesion to various component substrates. Excellent adhesion to printed circuit boards and electronic components and is especially well suited for chip-on-board, chip-on-flex, and multi-chip modules.

Multi-Cure 9001-E-V3.0
Dymax
Industry: Especially well suited for chip-on-board; Bare die; Especially well suited for chip-on-flex; Especially well suited for multi-chip module; Excellent adhesion to electronic components; Excellent adhesion to printed circuit boards; Flex circuits
Application Type: Encapsulant
Color: Clear; Colorless
1 Part or 2 Part: 1-Part
Package Sizes
Clear 10 ml Manual Syringe | Request Quote |
Clear 10 ml Machine-Ready Syringe | Request Quote |
Clear 30 ml Manual Syringe | Request Quote |

Ultra Light-Weld 9008
Dymax
Encapsulate; 1-Part; Liquid; Acrylated Urethane; UV/Visible Light Cure
A general purpose product for encapsulating and sealing electronic components in chip-on-Board or Chip-on-Flex (COF) applications. Forms flexible, highly moisture resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal and PET.

Ultra Light-Weld 9008
Dymax
Industry: Chip on Board; Avionics; Bare die; Battery Systems; Camera Module; Chip on Flex; E-Mobility Solutions; Ideal for COF Applications; Wire Bonding
Application Type: Encapsulate
Color: Clear; Light Straw; Lt. Yellow
1 Part or 2 Part: 1-Part
Package Sizes
30 ml Manual Syringe | Request Quote |
30 ml Machine-Ready Syringe | Request Quote |
170 ml Cartridge | Request Quote |
550 ml Cartridge | Request Quote |

Light Cap 9624 Conformal Coating for LEDs
Dymax
Conformal Coating; 1-Part; Liquid; Solvent Free; UV Light Cure
It is designed for rapid, room-temperature coating of LED arrays. Dymax Light Cap materials contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs.

Light Cap 9624 Conformal Coating for LEDs
Dymax
Industry: Colorless encapsulation of COB LEDs; Colorless encapsulation of COB LEDs; Conformal coating for LED arrays; Electronic assembly; Leadframe; Protective lens for high intensity LEDs
Application Type: Colorless Encapsulation ; Conformal Coating
Color: Colorless ; Transparent
1 Part or 2 Part: 1-Part
Package Sizes
30 ml Machine-Ready Syringe | Request Quote |

EO1059R
Henkel
Pot/Encapsulate; 1-Part; Liquid; Epoxy; Snap Cure
A medium viscosity, liquid encapsulant for chip-on-board (plastic substrate). This product is designed to cure in less than five minutes @ 140°C.

EO1059R
Henkel
Industry: Snap Cure Encapsulant for Chip-On-Board
Application Type: Pot/Encapsulate
Color: Black
1 Part or 2 Part: 1-Part
Package Sizes
10 cc | Request Quote |
30 cc | Request Quote |

Multi-Cure 9037-F
Dymax
Encapsulant; 1-Part; Gel; Acrylated Urethane; UV/Visible Light Cure
An improved, resilient, chip-encapsulant material designed with a UV/Visible light and secondary heat-cure system, making it ideal for encapsulation applications where shadow areas are present.

Multi-Cure 9037-F
Dymax
Industry: Chip on Board; Advanced Driver-Assistance Systems (ADAS); Avionics; Bare die; Battery Systems; Chip on Flex; Chip on Glass; E-Mobility Solutions; Infotainment systems; PCB Board; Power Tools; Wire Bonding
Application Type: Bond; Encapsulant
Color: Clear; Translucent
1 Part or 2 Part: 1-Part

MD 1040-M
Dymax
Bond; 1-Part; Liquid; Contain no nonreactive solvents; UV/Visible Light Cure
It is designed for rapid bonding, potting, or encapsulation on devices that require multiple autoclave cycles and is also compatible with many commonly used plastics for single use devices or housing assemblies. It contain no nonreactive solvents and cure upon exposure to light.

MD 1040-M
Dymax
Industry: Chip-on-Board; Assemblies Requiring Repeat Sterilization; Bare die; Housing Assemblies; Medical PCB Coating; Medical PCB Coating; Reservoirs; RFID; Sensor; Single use plastic components; Survives Repeated Autoclave Cycles
Application Type: Bond; Encapsulation; Potting
Color: Colorless to Light-Yellow; Colorless to Light-Yellow
1 Part or 2 Part: 1-Part

Dual-Cure 9014
Dymax
Encapsulant; 1-Part; Gel; Contain no nonreactive solvents; UV light cure
• UV light cure • Secondary moisture cure capability • Flexible encapsulant • Blue fluorescing • Contain no nonreactive solvents • In full compliance with RoHS directives 2015/863/EU.

Dual-Cure 9014
Dymax
Industry: Chip on board; Bare die; Battery systems; Chip on flex; Chip on glass; E-mobility solutions; Ruggedizing; Wire bonding; Wire tacking
Application Type: Encapsulant
Color: Light yellow translucent; Light yellow translucent
1 Part or 2 Part: 1-Part

Loctite Eccobond EO 1062
Henkel
Encapsulant; 1-Part; Liquid; Epoxy; Heat cure
• One-component • High performance • Low flow • Epoxy • Heat cure • Encapsulant • Chip-on-board

Loctite Eccobond EO 1062
Henkel
Industry: Chip-on-board; Glob-top; Semiconductor encapsulant
Application Type: Encapsulant
Color: Black
1 Part or 2 Part: 1-Part

9615
Dymax
Casting; 1-Part; Liquid; Acrylate resins; UV
Self-leveling viscosity for casting or potting, cures through UV transparent molds for consistent lens profile, potting without air entrapment

9615
Dymax
Industry: Protect COB LED wire bonds; Brighter LEDs over time; Consistent lens profile; Designed for higher powered LEDs; High performance; Increased transmittance; Lower reject rates; Protect COB LED wire bonds
Application Type: Casting; Potting
Color:
1 Part or 2 Part: 1-Part

Loctite Eccobond EO1061
Henkel
Encapsulation; 1-Part; Liquid; Epoxy; Heat cure
One-component, high performance, medium flow, heat cure, encapsulation, chip-on-board and low profile divices.

Loctite Eccobond EO1061
Henkel
Industry: Chip-on-board; Electrical; Semiconductor encapsulant
Application Type: Encapsulation; Pot
Color: Black
1 Part or 2 Part: 1-Part

Multi-Cure 9001-E-V3.7
Dymax
Encapsulant; 1-Part; Liquid; Modified Urethane; UV/Visible light-curable
UV/Visible light-curable encapsulant, this material is environmentally resistant with good ionic and electrical properties, excellent adhesion to printed circuit boards and electronic components.

Multi-Cure 9001-E-V3.7
Dymax
Industry: Chip-on-board; Bare-die encapsulation; Chip-on-flex; Electronic Components; Multi-chip modules; Printed circuit boards
Application Type: Encapsulant
Color: Clear
1 Part or 2 Part: 1-Part

KER-2500 A/B
Shinetsu
Potting encapsulant; 2-Part; Liquid; Methyl-based; Heat
A dual component, heat cure LED potting encapsulant that is designed for use in conjunction with Shin-Etsu's KER-2000 DAM/KER-2020 DAM damming materials for LED and COB applications.

KER-2500 A/B
Shinetsu
Industry: COB applications; LED applications
Application Type: Potting encapsulant
Color: Transparent
1 Part or 2 Part: 2-Part

9006-V3.1
Dymax
Encapsulate; 1-Part; Liquid; Modified urethane; UV/Visible Light
A toughened upgrade of the flexible “instant curing” Dymax 9006 UV/visible light curing encapsulant, specifically designed to provide protection for fine wires against mechanical force or pressure.

9006-V3.1
Dymax
Industry: Chip on board; Chip on flex; Multichip modules; PC board and electronic components
Application Type: Encapsulate
Color: Black
1 Part or 2 Part: 1-Part
Package Sizes
Black 10 ml Manual Syringe | Request Quote |

Loctite Eccobond EN 3410
Henkel
Coating; 1-Part; Liquid; Acrylate; Ultraviolet (UV) light, LED light
It is designed for COG/COF of LCD module or micro patterned FPC substrate of OLED module assembly applications. It is designed to improve crack/fracture resistance.

Loctite Eccobond EN 3410
Henkel
Industry: Chip-On-Board; Delamination for overall improvement of package reliability; Designed for COF of LCD module; Designed for COG of LCD module; OLED module assembly applications
Application Type: Coating; Encapsulant
Color: Light yellow
1 Part or 2 Part: 1-Part

Epo-Tek EJ2189-LV
Epoxy Technology
Adhesive; 2-Part; Paste; Epoxy; 2-Part Cure
An electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.

Epo-Tek EJ2189-LV
Epoxy Technology
Industry: Chip on board; Cryogenic applications; Die-attach; Hybrids; IC packages; ITO interconnections in LCDs; Low temperature die-attach used in hybrids; RF shielding; SMD
Application Type: Adhesive; EMI shielding
Color:
1 Part or 2 Part: 2-Part

Loctite Eccobond DS 3318BL
Henkel
Encapsulation; 1-Part; Liquid; Acrylic; UV LED Cure
A one-part, fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules.

Loctite Eccobond DS 3318BL
Henkel
Industry: Chip-On-Board; Glob top; Protection of COF (Chip-on-Film) in LCD modules.; Use in applications requiring lower energy cure
Application Type: Encapsulation
Color: Blue
1 Part or 2 Part: 1-Part

Loctite Eccobond DS 3318LV
Henkel
Coating; 1-Part; Liquid; Acrylic; UV LED
Suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly.

Loctite Eccobond DS 3318LV
Henkel
Industry: Chip-on-Board; A wide variety of coating applications; ITO/COG overcoat in LCD module assembly
Application Type: Coating; Sealant
Color: Light yellow; Transparent
1 Part or 2 Part: 1-Part

Epo-Tek H70E-4
Epoxy Technology
Bond; 2-Part; Paste; Epoxy; 2-Part Cure
A two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level.

Epo-Tek H70E-4
Epoxy Technology
Industry: COB attach; Active and passive SMT packages; Adhesive for opto-electronic packaging; Adhesive for opto-electronic packaging; Bonding ferrites and magnets for electronic sub-assemblies; Bonding ferrites and magnets for electronic sub-assemblies; Bonding SMDs to PCB; Die attach onto substrates; Direct-chip attach; Fiber optic components; Heat sinks; May be used for heat sinking power devices in the form of hybrid circuits; May be used in aluminum heat sinking power devices at PCB level; May be used in aluminum heat sinking power devices at PCB level; May be used in aluminum heat sinking power devices at the SMD level; May be used in aluminum heat sinking power devices at the SMD level; Micro-electronic; PCB; Semiconductor; Staking SMDs to PCB for double sided circuits
Application Type: Bond
Color:
1 Part or 2 Part: 2-Part

9309-SC
Dymax
Adhesive; 1-Part; Gel; Acrylated Urethane; UV/Visible Light
The blue color disappears when fully cured. The optimum balance of UV and visible light for the fastest, deepest cures.

9309-SC
Dymax
Industry: Chip-on-Board; Avionics; Bare die; Battery Systems; BGA Reinforcement; Camera Module; CSP Reinforcement; E-Mobility Solutions; Leadframe; Printed Circuit Boards (PCB); Ruggedizing; Wire Tacking
Application Type: Adhesive; Instant Adhesives
Color: Blue; Clear
1 Part or 2 Part: 1-Part

Emax Dual-Cure 99004
Dymax
Encapsulant; 1-Part; Gel; Contain no nonreactive solvents; UV Light Cure
Blue Fluorescing Encapsulant/Wire Bond Adhesive with Secondary Moisture Cure.

Emax Dual-Cure 99004
Dymax
Industry: Chip-on-Board; Chip-on-Flex; Wire Bond
Application Type: Bond; Encapsulant; Instant Adhesives
Color: Light Yellow Translucent; Light Yellow Translucent
1 Part or 2 Part: 1-Part

Loctite Eccobond EN 3839
Henkel
Encapsulant; 1-Part; Liquid; Acrylic; UV curable
• One component • UV/ heat curable • Thixotropic • Low Tg • Low modulus • Reworkable • Halogen-free • Acrylic • Transparent light blue liquid • Encapsulant, Glob top.

Loctite Eccobond EN 3839
Henkel
Industry: Chip-on-Board; BGA; CSP; Designed for encapsulating components on PCB applications; Glob top; Stable electrical performance in temperature humidity bias
Application Type: Encapsulant
Color: Light blue; Transparent
1 Part or 2 Part: 1-Part

Epo-Tek 353ND-T4
Epoxy Technology
Bond; 2-Part; Paste; Epoxy; 2-Part Cure
A two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance .This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow.

Epo-Tek 353ND-T4
Epoxy Technology
Industry: Suitable for COB glob top DAM material; Bonding ferrite cores together in copper coil windings; Circuit Assembly Applications; Fiber optic; Fiber optic; Hybrid devices; Inductor coils; Medical devices; Power devices; Staking SMD's to PCB; Suitable for COB glob top DAM material
Application Type: Bond
Color:
1 Part or 2 Part: 2-Part

View with more filters in Advanced Search
Ultra Light-Weld 9-20557
E-Max 10024
Multi-Cure 9001-E-V3.0
Ultra Light-Weld 9008
Light Cap 9624 Conformal Coating for LEDs
Package Sizes
30 ml Machine-Ready SyringeEO1059R
Multi-Cure 9037-F
MD 1040-M
Dual-Cure 9014
Loctite Eccobond EO 1062
9615
Loctite Eccobond EO1061
Multi-Cure 9001-E-V3.7
KER-2500 A/B
9006-V3.1
Package Sizes
Black 10 ml Manual SyringeLoctite Eccobond EN 3410
Epo-Tek EJ2189-LV
Loctite Eccobond DS 3318BL
Loctite Eccobond DS 3318LV
Epo-Tek H70E-4
9309-SC
Emax Dual-Cure 99004
Loctite Eccobond EN 3839
Epo-Tek 353ND-T4
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