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Epoxy Adhesives

View popular materials for epoxy adhesives. All of these materials and their data have been gathered by us to help you browse, compare, quote and test based on your requirements! The sections have been broken down by substrate for ease of search. If you would rather do-it-yourself, you can always customize your own grid by clicking on Advanced Search.

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Epoxy Adhesives

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Axis M-20HP

Resin Designs

Bond; 2-Part; Liquid; Epoxy; Resin/Hardener

A two part medical grade epoxy and low viscosity industrial adhesive. It provides high strength bonds to a wide variety of substrates. It is resistant to a wide range of chemicals and is stable over a wide temperature range.

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Axis M-20HP

Resin Designs

Application Type: Bond

Industry: Assembly of disposable medical materials; Industrial

Chemistry: Epoxy; Amine

Color: Off White

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Loctite EA M-121HP

Henkel

Bond; 2-Part; Liquid; Epoxy; 2 Part Cure

A medium viscosity, non-sag epoxy for applications that require high impact resistance and high peel strength. Bonds dissimilar materials including aluminum, steel, and other metals, as well as a variety of plastics and ceramics.

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Loctite EA M-121HP

Henkel

Application Type: Bond

Industry: Assembly of disposable medical devices.; Endoscopes; Electrical; Low stress applications; Mechanical

Chemistry: Epoxy

Color: Amber-Beige; Amber-Beige

Package Sizes

50 ml Cartridge Request Quote
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Loctite M-31CL

Henkel

Bond; 2-Part; Liquid; Epoxy; Resin/Hardener

A low viscosity epoxy that bonds glass, ceramic, metal, and many rigid plastics. Ideal for applications where optical clarity and excellent structural and mechanical properties are required.

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Loctite M-31CL

Henkel

Application Type: Bond; Laminate; Small potting

Industry: Disposable medical devices; Endoscopes; Electrical; Mechanical

Chemistry: Epoxy

Color: Ultra clear

Package Sizes

50 ml Cartridge Request Quote
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Loctite EA 3982

Henkel

Bond; 1-Part; Liquid; Epoxy; Heat cure

A one component, suitable for a wide range of applications that require fast cure, excellent environmental resistance and high adhesion.

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Loctite EA 3982

Henkel

Application Type: Bond

Industry: Disposable medical devices; Syringes and lancets for needle assemblies; A wide range of applications; Stainless steel cannulae into hubs

Chemistry: Epoxy

Color: Off White

Package Sizes

30 ml Syringe Request Quote
5 Gal Pail Request Quote
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Loctite EA M-21HP

Henkel

Bond; 2-Part; Liquid; Epoxy; Resin/Hardener

An off white, toughened epoxy that provides high peel resistance and high shear strength on a wide variety of plastics and metals.

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Loctite EA M-21HP

Henkel

Application Type: Bond

Industry: Endoscopes; Medical devices

Chemistry: Epoxy

Color: Off White

Package Sizes

50 ml Cartridge Request Quote
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4E98

Henkel

Bond; 1-Part; Liquid; Epoxy; Heat

A single component fast heat curing epoxy. It offers a fast low temperature cure which makes it ideal for bonding heat sensitive substrates used within the medical device industry. This product passes USP Cytotoxicity tests when cured.

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4E98

Henkel

Application Type: Bond

Industry: Medical device industry; Industrial; Medical device industry

Chemistry: Epoxy

Color: Cream; Light Green

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PX821C/BL

Resinlab

Bonding; 1-Part; Liquid; Epoxy resin; Heat

Is a one-part thixotropic epoxy resin, Long shelf life, Fast cure and Excellent electrical insulation characteristics.

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PX821C/BL

Resinlab

Application Type: Bonding; Sealing

Industry: Syringes Packs; Bulk Packs

Chemistry: Epoxy resin; Non-toxic

Color: Blue

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Epo-Tek 310M

Epoxy Technology

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure

A two component, flexible, optically clear epoxy adhesive designed for optical, semiconductor, and medical applications. It has a low viscosity, water-like appearance.

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Epo-Tek 310M

Epoxy Technology

Application Type: Bond; Potting

Industry: Designed for medical applications; Designed for optical applications; Designed for semiconductor; Excellent material for low-stress potting applications; Suitable for glob top encapsulant or underfill; Suitable for glob top encapsulant or underfill

Chemistry: Epoxy

Color:

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Loctite E-1962

Henkel

Bond; 1-Part; Liquid; Epoxy; Heat

A one component, heat curing, medium viscosity, epoxy adhesive targeted at medical applications. The material complies with USP Class VI toxicity requirements and is resistant to gamma sterilization.

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Loctite E-1962

Henkel

Application Type: Bond

Industry: Medical

Chemistry: Epoxy

Color: Cream

Package Sizes

Gallon Request Quote
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Loctite Ablestik CE 3103WLV

Henkel

Bond; 1-Part; Paste; Epoxy; Heat cure

• One component • Epoxy • Heat cure • Electrically conductive • Pb-free alternative to solder • Low cure temperature • SMD component attach

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Loctite Ablestik CE 3103WLV

Henkel

Application Type: Bond

Industry: Continous Measuring Patch On Skin; Smart Health Patch; Guidance Systems; OSP Copper circuits; Printed circuit board; Radar; SMD component attach

Chemistry: Epoxy; Lead-free; Pb-free

Color: Silver

Package Sizes

10 cc EFD Syringe Request Quote
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Loctite EA 3984

Henkel

Bond; 1-Part; Liquid; Epoxy; Heat

Highly fluorescent, one-part, heat cure epoxy adhesives offering superior physical, environmental and performance properties.

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Loctite EA 3984

Henkel

Application Type: Bond

Industry: Assembly of disposable medical devices; Endoscopes; Lancets for needle assembles; Medical devices; Syringes; Hubs; Stainless steel cannulae

Chemistry: Epoxy; Polyurethane

Color: Light gray

Package Sizes

30 ml Syringe Request Quote
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MD 250-CTH

Dymax

Bond; 1-Part; Gel; Epoxy; UV/Visible Light Cure

One component cationic epoxy is designed for rapid assembly of medical devices with flexible curing options using light only, heat only, or any combination of the two.

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MD 250-CTH

Dymax

Application Type: Bond

Industry: Catheter Assembly; Endoscope Assembly; Medical Device; Tube Set Bonding; Lens Positioning; Printed circuit board

Chemistry: Epoxy; Cationic; Contain no nonreactive solvents

Color: Off White Opaque; Off White Opaque

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Epo-Tek TD1001

Epoxy Technology

Bond; 1-Part; Paste; Epoxy; Heat

A single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.

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Epo-Tek TD1001

Epoxy Technology

Application Type: Bond; Encapsulation; Molding compound

Industry: X-ray scintillator; Bonding Al heat sinks; Bonding Cu heat sinks; Ferrite cores in power device plastic packaging; Fiber optic component assembly; Fiber optic component packaging; Heat sink; Heat sinking laser diode packages; IC packaging on FR4 PCB; IC packaging on lead frame; LED die attach; LED die attach; Low stress electronics packaging; Low stress semiconductor packaging; Optics; Opto-coupler circuits; Semiconductor

Chemistry: Epoxy

Color: White

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Epo-Tek MED-OD2002

Epoxy Technology

Bond; 2-Part; Paste; Epoxy; 2-Part cure

A biocompatible, high Tg, low modulus, high temperature epoxy, used primarily for fiber optics and endoscopes. It is highly autoclave resistant.

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Epo-Tek MED-OD2002

Epoxy Technology

Application Type: Bond; Potting

Industry: 3D imaging catheters; 3D mapping catheters; Adhesive for catheter delivered surgical mapping; Adhesive for musculoskeletal implants; Adhesive for orthopedic implants; Broncho-scopes; Catheter ultrasound; Dental device adhesive; Electro-surgical tool for tissue removal; Endoscopes; Endoscopy with camera; Endoscopy with video interface; Fabrication of Rf Ablation catheters; Gastroscopes; Hand instrument; Healthcare optics for colonoscopy; Healthcare optics for otolaryngology; Healthcare optics for urology; High power laser optics for cosmetic surgery; High power laser optics for general surgery; High power laser optics for reconstructive surgery; Imaging technologies; Implantable devices; Laryngoscopes; Life sciences; Lighting instrument; Micro fluidics; Micro ophthalmoscopes; Spinal and joint repair devices using ceramics; Spinal and joint repair devices using composite plastics; Spinal and joint repair devices using precious metals; Surgical tools; Ultrasonic; Ultrasound; Amplification circuits; Electro-optics; Fiber optics; Fitness style wrist watches; High power laser optics for cosmetic surgery; High power laser optics for general surgery; High power laser optics for reconstructive surgery; Impregnating fiber optic image bundles and light guides; Near hermetic sealing of glass; Readers circuits; Structural hermetic sealing of glass; Terminating fiber optic image bundles and light guides; Wearable devices

Chemistry: Epoxy

Color:

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Cyberpoxy 5895

HB Fuller

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure

A two part filled epoxy designed for bonding metals and plastics.

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Cyberpoxy 5895

HB Fuller

Application Type: Bond

Industry: Medical device applications

Chemistry: Epoxy

Color: Gray

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Epo-Tek 354-T

Epoxy Technology

Bond; 2-Part; Smooth thixotropic paste; Epoxy; Part A/Part B

A two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies.

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Epo-Tek 354-T

Epoxy Technology

Application Type: Bond; Encapsulation; Potting; Sealing

Industry: Medical; Fiber optic; Optoelectronic assemblies

Chemistry: Epoxy

Color:

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Epo-Tek 323LP-LH Ultra

Epoxy Technology

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure

A longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard -disk drive and medical applications.

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Epo-Tek 323LP-LH Ultra

Epoxy Technology

Application Type: Bond; Potting; Seal

Industry: Medical applications; Active alignment of optics; Bonding ferrite cores; Bonding ferrite magnets; Dielectric layer in the fabrication of capacitors; Down-hole petrochemical fiber optic sensors; Electronic assembly; Environmental seal of opto-packages; Fabrications of MEMs devices; Fiber component packaging; Fiber-optic applications; Flip chip underfill; Hard -disk drive applications; Hybrid applications; Impregnating copper coil windings; Laminating PZT piezoelectric; Optical; Provides near hermetic sealing in sensor devices; Sealing fiber into ferrules; Semiconductor applications; Semiconductor wafer to wafer bonding of CSP; Semiconductor wafer to wafer bonding of CSP; Transmitting light in the optical pathways from 800-1550 nm; V-groove arrays

Chemistry: Epoxy; Meets halogen - free requirements

Color:

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Loctite Ablestik FDA 2T

Henkel

Bond; 2-Part; Liquid; Epoxy; Low temperature cure

Designed for medical device applications, heat cure or room temperature cure, medium viscosity, electrically Insulating, low permeability to gases and vapors, low temperature cure

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Loctite Ablestik FDA 2T

Henkel

Application Type: Bond

Industry: Catheters; Dental products; Hearing aids; Medical device applications; Other biomedical devices; Other biomedical instruments; Food packaging; Food preparation processing

Chemistry: Epoxy

Color: Amber

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Stycast T 640

Henkel

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure

A clear, general purpose two component system with long pot life and low viscosity. It has proven useful in biomedical applications, qualify able to BS 6920 for drinking water applications (filters).

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Stycast T 640

Henkel

Application Type: Bond; Encapsulant; Gap filling

Industry: Biomedical applications; drinking water applications (filters).; General purpose

Chemistry: Epoxy; Low toxicity

Color: Clear

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Epo-Tek 730-110

Epoxy Technology

Bond; 2-Part; Pourable liquid; Epoxy; Room temperature-curing

A two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices.

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Epo-Tek 730-110

Epoxy Technology

Application Type: Bond; Encapsulation; Potting; Sealing

Industry: Medical Devices; Automotive; Electronics; General purpose; Industrial; Metal working applications; Optical; Outdoor applications; Semiconductor

Chemistry: Epoxy

Color:

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Epo-Tek 353ND-T4

Epoxy Technology

Bond; 2-Part; Paste; Epoxy; 2-Part Cure

A two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance .This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow.

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Epo-Tek 353ND-T4

Epoxy Technology

Application Type: Bond

Industry: Medical devices; Bonding ferrite cores together in copper coil windings; Circuit Assembly Applications; Fiber optic; Fiber optic; Hybrid devices; Inductor coils; Power devices; Staking SMD's to PCB; Suitable for COB glob top DAM material; Suitable for COB glob top DAM material

Chemistry: Epoxy

Color:

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Epo-Tek 323LP-LH Premium

Epoxy Technology

Bond; 2-Part; Pourable liquid; Epoxy; Part A/Part B

Longer pot life version of EPO-TEK®353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.

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Epo-Tek 323LP-LH Premium

Epoxy Technology

Application Type: Bond; Potting; Seal

Industry: Medical; Fiber-optic; Hard-disk drive; Hybrid; Semiconductor

Chemistry: Epoxy

Color:

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Epo-Tek 375

Epoxy Technology

Adhesive; 2-Part; Pourable liquid; Epoxy; PartA/PartB

A two component, high-temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications.

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Epo-Tek 375

Epoxy Technology

Application Type: Adhesive

Industry: Medical applications; Fiber optic; Hybrid; Semiconductor

Chemistry: Epoxy

Color:

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Loctite EA 3981

Henkel

Bond; 1-Part; Liquid; Epoxy; Heat cure

Suitable for a wide range of applications that require fast cure, excellent environmental resistance and high adhesion.

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Loctite EA 3981

Henkel

Application Type: Bond

Industry: Assembly of disposable medical devices; Endoscopes; Lancets for needle assembles; Medical devices; Syringes; Bond basic structural elements; Bond sub-component assemblies; Hubs; Stainless steel cannulae

Chemistry: Epoxy

Color: Slight amber

Package Sizes

5 Gal Pail Request Quote
30 ml Syringe Request Quote

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Axis M-20HP

Bond; 2-Part; Liquid; Epoxy; Resin/Hardener
A two part medical grade epoxy and low viscosity industrial adhesive. It provides high strength bonds to a wide variety of substrates. It is resistant to a wide range of chemicals and is stable over a wide temperature range.
Manufacturer: Resin Designs
Industry: Assembly of disposable medical materials; Industrial
Color: Off White
Viscosity (cPs): Medium
Mix Ratio: 100:55 (by weight); 2:1 (by volume)
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Loctite EA M-121HP

Bond; 2-Part; Liquid; Epoxy; 2 Part Cure
A medium viscosity, non-sag epoxy for applications that require high impact resistance and high peel strength. Bonds dissimilar materials including aluminum, steel, and other metals, as well as a variety of plastics and ceramics.
Manufacturer: Henkel
Industry: Assembly of disposable medical devices.; Endoscopes; Electrical; Low stress applications; Mechanical
Color: Amber-Beige; Amber-Beige
Viscosity (cPs): Medium; Non-sagging
Mix Ratio: 100:46 (by weight); 2:1 (by volume)

Package Sizes

50 ml Cartridge
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Loctite M-31CL

Bond; 2-Part; Liquid; Epoxy; Resin/Hardener
A low viscosity epoxy that bonds glass, ceramic, metal, and many rigid plastics. Ideal for applications where optical clarity and excellent structural and mechanical properties are required.
Manufacturer: Henkel
Industry: Disposable medical devices; Endoscopes; Electrical; Mechanical
Color: Ultra clear
Viscosity (cPs): Low
Mix Ratio: 100:46 (by weight); 2:1 (by volume)

Package Sizes

50 ml Cartridge
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Loctite EA 3982

Bond; 1-Part; Liquid; Epoxy; Heat cure
A one component, suitable for a wide range of applications that require fast cure, excellent environmental resistance and high adhesion.
Manufacturer: Henkel
Industry: Disposable medical devices; Syringes and lancets for needle assemblies; A wide range of applications; Stainless steel cannulae into hubs
Color: Off White
Viscosity (cPs): 6,000 to 10,000

Package Sizes

30 ml Syringe 5 Gal Pail
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Loctite EA M-21HP

Bond; 2-Part; Liquid; Epoxy; Resin/Hardener
An off white, toughened epoxy that provides high peel resistance and high shear strength on a wide variety of plastics and metals.
Manufacturer: Henkel
Industry: Endoscopes; Medical devices
Color: Off White
Viscosity (cPs): Medium
Mix Ratio: 100:55 (by weight); 2:1 (by volume)

Package Sizes

50 ml Cartridge
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4E98

Bond; 1-Part; Liquid; Epoxy; Heat
A single component fast heat curing epoxy. It offers a fast low temperature cure which makes it ideal for bonding heat sensitive substrates used within the medical device industry. This product passes USP Cytotoxicity tests when cured.
Manufacturer: Henkel
Industry: Medical device industry; Industrial; Medical device industry
Color: Cream; Light Green
Viscosity (cPs): 40,000
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PX821C/BL

Bonding; 1-Part; Liquid; Epoxy resin; Heat
Is a one-part thixotropic epoxy resin, Long shelf life, Fast cure and Excellent electrical insulation characteristics.
Manufacturer: Resinlab
Industry: Syringes Packs; Bulk Packs
Color: Blue
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Epo-Tek 310M

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure
A two component, flexible, optically clear epoxy adhesive designed for optical, semiconductor, and medical applications. It has a low viscosity, water-like appearance.
Manufacturer: Epoxy Technology
Industry: Designed for medical applications; Designed for optical applications; Designed for semiconductor; Excellent material for low-stress potting applications; Suitable for glob top encapsulant or underfill; Suitable for glob top encapsulant or underfill
Viscosity (cPs): Low; Pourable; 450 to 850
Mix Ratio: 10:5.5 (by weight)
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Loctite E-1962

Bond; 1-Part; Liquid; Epoxy; Heat
A one component, heat curing, medium viscosity, epoxy adhesive targeted at medical applications. The material complies with USP Class VI toxicity requirements and is resistant to gamma sterilization.
Manufacturer: Henkel
Industry: Medical
Color: Cream
Viscosity (cPs): Medium; 29,000

Package Sizes

Gallon
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Loctite Ablestik CE 3103WLV

Bond; 1-Part; Paste; Epoxy; Heat cure
• One component • Epoxy • Heat cure • Electrically conductive • Pb-free alternative to solder • Low cure temperature • SMD component attach
Manufacturer: Henkel
Industry: Continous Measuring Patch On Skin; Smart Health Patch; Guidance Systems; OSP Copper circuits; Printed circuit board; Radar; SMD component attach
Color: Silver
Viscosity (cPs): Low; 20,000

Package Sizes

10 cc EFD Syringe
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Loctite EA 3984

Bond; 1-Part; Liquid; Epoxy; Heat
Highly fluorescent, one-part, heat cure epoxy adhesives offering superior physical, environmental and performance properties.
Manufacturer: Henkel
Industry: Assembly of disposable medical devices; Endoscopes; Lancets for needle assembles; Medical devices; Syringes; Hubs; Stainless steel cannulae
Color: Light gray
Viscosity (cPs): 22,000 to 28,000

Package Sizes

30 ml Syringe
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MD 250-CTH

Bond; 1-Part; Gel; Epoxy; UV/Visible Light Cure
One component cationic epoxy is designed for rapid assembly of medical devices with flexible curing options using light only, heat only, or any combination of the two.
Manufacturer: Dymax
Industry: Catheter Assembly; Endoscope Assembly; Medical Device; Tube Set Bonding; Lens Positioning; Printed circuit board
Color: Off White Opaque; Off White Opaque
Viscosity (cPs): 52,500
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Epo-Tek TD1001

Bond; 1-Part; Paste; Epoxy; Heat
A single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.
Manufacturer: Epoxy Technology
Industry: X-ray scintillator; Bonding Al heat sinks; Bonding Cu heat sinks; Ferrite cores in power device plastic packaging; Fiber optic component assembly; Fiber optic component packaging; Heat sink; Heat sinking laser diode packages; IC packaging on FR4 PCB; IC packaging on lead frame; LED die attach; LED die attach; Low stress electronics packaging; Low stress semiconductor packaging; Optics; Opto-coupler circuits; Semiconductor
Color: White
Viscosity (cPs): Creamy ; Smooth; 10,000 to 22,000
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Epo-Tek MED-OD2002

Bond; 2-Part; Paste; Epoxy; 2-Part cure
A biocompatible, high Tg, low modulus, high temperature epoxy, used primarily for fiber optics and endoscopes. It is highly autoclave resistant.
Manufacturer: Epoxy Technology
Industry: 3D imaging catheters; 3D mapping catheters; Adhesive for catheter delivered surgical mapping; Adhesive for musculoskeletal implants; Adhesive for orthopedic implants; Broncho-scopes; Catheter ultrasound; Dental device adhesive; Electro-surgical tool for tissue removal; Endoscopes; Endoscopy with camera; Endoscopy with video interface; Fabrication of Rf Ablation catheters; Gastroscopes; Hand instrument; Healthcare optics for colonoscopy; Healthcare optics for otolaryngology; Healthcare optics for urology; High power laser optics for cosmetic surgery; High power laser optics for general surgery; High power laser optics for reconstructive surgery; Imaging technologies; Implantable devices; Laryngoscopes; Life sciences; Lighting instrument; Micro fluidics; Micro ophthalmoscopes; Spinal and joint repair devices using ceramics; Spinal and joint repair devices using composite plastics; Spinal and joint repair devices using precious metals; Surgical tools; Ultrasonic; Ultrasound; Amplification circuits; Electro-optics; Fiber optics; Fitness style wrist watches; High power laser optics for cosmetic surgery; High power laser optics for general surgery; High power laser optics for reconstructive surgery; Impregnating fiber optic image bundles and light guides; Near hermetic sealing of glass; Readers circuits; Structural hermetic sealing of glass; Terminating fiber optic image bundles and light guides; Wearable devices
Viscosity (cPs): Pourable; 24,000 to 42,000
Mix Ratio: 20:1 (by weight)
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Cyberpoxy 5895

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure
A two part filled epoxy designed for bonding metals and plastics.
Manufacturer: HB Fuller
Industry: Medical device applications
Color: Gray
Viscosity (cPs): 100,000
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Epo-Tek 354-T

Bond; 2-Part; Smooth thixotropic paste; Epoxy; Part A/Part B
A two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies.
Manufacturer: Epoxy Technology
Industry: Medical; Fiber optic; Optoelectronic assemblies
Viscosity (cPs): 11,000 to 20,000
Mix Ratio: 10:1 (by weight)
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Epo-Tek 323LP-LH Ultra

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure
A longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard -disk drive and medical applications.
Manufacturer: Epoxy Technology
Industry: Medical applications; Active alignment of optics; Bonding ferrite cores; Bonding ferrite magnets; Dielectric layer in the fabrication of capacitors; Down-hole petrochemical fiber optic sensors; Electronic assembly; Environmental seal of opto-packages; Fabrications of MEMs devices; Fiber component packaging; Fiber-optic applications; Flip chip underfill; Hard -disk drive applications; Hybrid applications; Impregnating copper coil windings; Laminating PZT piezoelectric; Optical; Provides near hermetic sealing in sensor devices; Sealing fiber into ferrules; Semiconductor applications; Semiconductor wafer to wafer bonding of CSP; Semiconductor wafer to wafer bonding of CSP; Transmitting light in the optical pathways from 800-1550 nm; V-groove arrays
Viscosity (cPs): Pourable; 3,500 to 5,000
Mix Ratio: 10:1 (by weight)
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Loctite Ablestik FDA 2T

Bond; 2-Part; Liquid; Epoxy; Low temperature cure
Designed for medical device applications, heat cure or room temperature cure, medium viscosity, electrically Insulating, low permeability to gases and vapors, low temperature cure
Manufacturer: Henkel
Industry: Catheters; Dental products; Hearing aids; Medical device applications; Other biomedical devices; Other biomedical instruments; Food packaging; Food preparation processing
Color: Amber
Viscosity (cPs): Medium; 26,000
Mix Ratio: 100 : 93 (by weight)
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Stycast T 640

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure
A clear, general purpose two component system with long pot life and low viscosity. It has proven useful in biomedical applications, qualify able to BS 6920 for drinking water applications (filters).
Manufacturer: Henkel
Industry: Biomedical applications; drinking water applications (filters).; General purpose
Color: Clear
Viscosity (cPs): Low
Mix Ratio: 100:35 (by weight)
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Epo-Tek 730-110

Bond; 2-Part; Pourable liquid; Epoxy; Room temperature-curing
A two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices.
Manufacturer: Epoxy Technology
Industry: Medical Devices; Automotive; Electronics; General purpose; Industrial; Metal working applications; Optical; Outdoor applications; Semiconductor
Viscosity (cPs): Flowing; Medium; Pourable; 8,000 to 12,000
Mix Ratio: 1:1 (by weight)
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Epo-Tek 353ND-T4

Bond; 2-Part; Paste; Epoxy; 2-Part Cure
A two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance .This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow.
Manufacturer: Epoxy Technology
Industry: Medical devices; Bonding ferrite cores together in copper coil windings; Circuit Assembly Applications; Fiber optic; Fiber optic; Hybrid devices; Inductor coils; Power devices; Staking SMD's to PCB; Suitable for COB glob top DAM material; Suitable for COB glob top DAM material
Viscosity (cPs): Non flowing properties; Smooth; 11,000 to 17,000
Mix Ratio: 10:1 (by weight)
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Epo-Tek 323LP-LH Premium

Bond; 2-Part; Pourable liquid; Epoxy; Part A/Part B
Longer pot life version of EPO-TEK®353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.
Manufacturer: Epoxy Technology
Industry: Medical; Fiber-optic; Hard-disk drive; Hybrid; Semiconductor
Viscosity (cPs): 4,142
Mix Ratio: 10:1 (by weight)
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Epo-Tek 375

Adhesive; 2-Part; Pourable liquid; Epoxy; PartA/PartB
A two component, high-temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications.
Manufacturer: Epoxy Technology
Industry: Medical applications; Fiber optic; Hybrid; Semiconductor
Viscosity (cPs): 3,000 to 5,000
Mix Ratio: 10:1 (by weight)
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Loctite EA 3981

Bond; 1-Part; Liquid; Epoxy; Heat cure
Suitable for a wide range of applications that require fast cure, excellent environmental resistance and high adhesion.
Manufacturer: Henkel
Industry: Assembly of disposable medical devices; Endoscopes; Lancets for needle assembles; Medical devices; Syringes; Bond basic structural elements; Bond sub-component assemblies; Hubs; Stainless steel cannulae
Color: Slight amber
Viscosity (cPs): 4,000 to 6,000

Package Sizes

5 Gal Pail 30 ml Syringe
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70 results
Application Type
Industry
Chemistry
Color
Viscosity (cPs)
Mix Ratio
Description
Axis M-20HP
Resin Designs
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Bond
Assembly of disposable medical materials; Industrial
Epoxy; Amine
Off White
Medium
100:55 (by weight); 2:1 (by volume)
A two part medical grade epoxy and low viscosity industrial adhesive. It provides high strength bonds to a wide variety of substrates. It is resistant to a wide range of chemicals and is stable over a wide temperature range.
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Loctite EA M-121HP
Henkel
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Bond
Assembly of disposable medical devices.; Endoscopes; Electrical; Low stress applications; Mechanical
Epoxy
Amber-Beige; Amber-Beige
Medium; Non-sagging
100:46 (by weight); 2:1 (by volume)
A medium viscosity, non-sag epoxy for applications that require high impact resistance and high peel strength. Bonds dissimilar materials including aluminum, steel, and other metals, as well as a variety of plastics and ceramics.
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50 ml Cartridge
Loctite M-31CL
Henkel
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Bond; Laminate; Small potting
Disposable medical devices; Endoscopes; Electrical; Mechanical
Epoxy
Ultra clear
Low
100:46 (by weight); 2:1 (by volume)
A low viscosity epoxy that bonds glass, ceramic, metal, and many rigid plastics. Ideal for applications where optical clarity and excellent structural and mechanical properties are required.
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50 ml Cartridge
Loctite EA 3982
Henkel
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Bond
Disposable medical devices; Syringes and lancets for needle assemblies; A wide range of applications; Stainless steel cannulae into hubs
Epoxy
Off White
6,000 to 10,000
A one component, suitable for a wide range of applications that require fast cure, excellent environmental resistance and high adhesion.
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30 ml Syringe 5 Gal Pail
Loctite EA M-21HP
Henkel
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Bond
Endoscopes; Medical devices
Epoxy
Off White
Medium
100:55 (by weight); 2:1 (by volume)
An off white, toughened epoxy that provides high peel resistance and high shear strength on a wide variety of plastics and metals.
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50 ml Cartridge
4E98
Henkel
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Bond
Medical device industry; Industrial; Medical device industry
Epoxy
Cream; Light Green
40,000
A single component fast heat curing epoxy. It offers a fast low temperature cure which makes it ideal for bonding heat sensitive substrates used within the medical device industry. This product passes USP Cytotoxicity tests when cured.
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PX821C/BL
Resinlab
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Bonding; Sealing
Syringes Packs; Bulk Packs
Epoxy resin; Non-toxic
Blue
Is a one-part thixotropic epoxy resin, Long shelf life, Fast cure and Excellent electrical insulation characteristics.
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Epo-Tek 310M
Epoxy Technology
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Bond; Potting
Designed for medical applications; Designed for optical applications; Designed for semiconductor; Excellent material for low-stress potting applications; Suitable for glob top encapsulant or underfill; Suitable for glob top encapsulant or underfill
Epoxy
Low; Pourable; 450 to 850
10:5.5 (by weight)
A two component, flexible, optically clear epoxy adhesive designed for optical, semiconductor, and medical applications. It has a low viscosity, water-like appearance.
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Loctite E-1962
Henkel
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Bond
Medical
Epoxy
Cream
Medium; 29,000
A one component, heat curing, medium viscosity, epoxy adhesive targeted at medical applications. The material complies with USP Class VI toxicity requirements and is resistant to gamma sterilization.
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Gallon
Loctite Ablestik CE 3103WLV
Henkel
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Bond
Continous Measuring Patch On Skin; Smart Health Patch; Guidance Systems; OSP Copper circuits; Printed circuit board; Radar; SMD component attach
Epoxy; Lead-free; Pb-free
Silver
Low; 20,000
• One component • Epoxy • Heat cure • Electrically conductive • Pb-free alternative to solder • Low cure temperature • SMD component attach
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10 cc EFD Syringe
Loctite EA 3984
Henkel
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Bond
Assembly of disposable medical devices; Endoscopes; Lancets for needle assembles; Medical devices; Syringes; Hubs; Stainless steel cannulae
Epoxy; Polyurethane
Light gray
22,000 to 28,000
Highly fluorescent, one-part, heat cure epoxy adhesives offering superior physical, environmental and performance properties.
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30 ml Syringe
MD 250-CTH
Dymax
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Bond
Catheter Assembly; Endoscope Assembly; Medical Device; Tube Set Bonding; Lens Positioning; Printed circuit board
Epoxy; Cationic; Contain no nonreactive solvents
Off White Opaque; Off White Opaque
52,500
One component cationic epoxy is designed for rapid assembly of medical devices with flexible curing options using light only, heat only, or any combination of the two.
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Epo-Tek TD1001
Epoxy Technology
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Bond; Encapsulation; Molding compound
X-ray scintillator; Bonding Al heat sinks; Bonding Cu heat sinks; Ferrite cores in power device plastic packaging; Fiber optic component assembly; Fiber optic component packaging; Heat sink; Heat sinking laser diode packages; IC packaging on FR4 PCB; IC packaging on lead frame; LED die attach; LED die attach; Low stress electronics packaging; Low stress semiconductor packaging; Optics; Opto-coupler circuits; Semiconductor
Epoxy
White
Creamy ; Smooth; 10,000 to 22,000
A single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.
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Epo-Tek MED-OD2002
Epoxy Technology
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Bond; Potting
3D imaging catheters; 3D mapping catheters; Adhesive for catheter delivered surgical mapping; Adhesive for musculoskeletal implants; Adhesive for orthopedic implants; Broncho-scopes; Catheter ultrasound; Dental device adhesive; Electro-surgical tool for tissue removal; Endoscopes; Endoscopy with camera; Endoscopy with video interface; Fabrication of Rf Ablation catheters; Gastroscopes; Hand instrument; Healthcare optics for colonoscopy; Healthcare optics for otolaryngology; Healthcare optics for urology; High power laser optics for cosmetic surgery; High power laser optics for general surgery; High power laser optics for reconstructive surgery; Imaging technologies; Implantable devices; Laryngoscopes; Life sciences; Lighting instrument; Micro fluidics; Micro ophthalmoscopes; Spinal and joint repair devices using ceramics; Spinal and joint repair devices using composite plastics; Spinal and joint repair devices using precious metals; Surgical tools; Ultrasonic; Ultrasound; Amplification circuits; Electro-optics; Fiber optics; Fitness style wrist watches; High power laser optics for cosmetic surgery; High power laser optics for general surgery; High power laser optics for reconstructive surgery; Impregnating fiber optic image bundles and light guides; Near hermetic sealing of glass; Readers circuits; Structural hermetic sealing of glass; Terminating fiber optic image bundles and light guides; Wearable devices
Epoxy
Pourable; 24,000 to 42,000
20:1 (by weight)
A biocompatible, high Tg, low modulus, high temperature epoxy, used primarily for fiber optics and endoscopes. It is highly autoclave resistant.
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Cyberpoxy 5895
HB Fuller
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Bond
Medical device applications
Epoxy
Gray
100,000
A two part filled epoxy designed for bonding metals and plastics.
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Epo-Tek 354-T
Epoxy Technology
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Bond; Encapsulation; Potting; Sealing
Medical; Fiber optic; Optoelectronic assemblies
Epoxy
11,000 to 20,000
10:1 (by weight)
A two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies.
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Epo-Tek 323LP-LH Ultra
Epoxy Technology
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Bond; Potting; Seal
Medical applications; Active alignment of optics; Bonding ferrite cores; Bonding ferrite magnets; Dielectric layer in the fabrication of capacitors; Down-hole petrochemical fiber optic sensors; Electronic assembly; Environmental seal of opto-packages; Fabrications of MEMs devices; Fiber component packaging; Fiber-optic applications; Flip chip underfill; Hard -disk drive applications; Hybrid applications; Impregnating copper coil windings; Laminating PZT piezoelectric; Optical; Provides near hermetic sealing in sensor devices; Sealing fiber into ferrules; Semiconductor applications; Semiconductor wafer to wafer bonding of CSP; Semiconductor wafer to wafer bonding of CSP; Transmitting light in the optical pathways from 800-1550 nm; V-groove arrays
Epoxy; Meets halogen - free requirements
Pourable; 3,500 to 5,000
10:1 (by weight)
A longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard -disk drive and medical applications.
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Loctite Ablestik FDA 2T
Henkel
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Bond
Catheters; Dental products; Hearing aids; Medical device applications; Other biomedical devices; Other biomedical instruments; Food packaging; Food preparation processing
Epoxy
Amber
Medium; 26,000
100 : 93 (by weight)
Designed for medical device applications, heat cure or room temperature cure, medium viscosity, electrically Insulating, low permeability to gases and vapors, low temperature cure
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Stycast T 640
Henkel
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Bond; Encapsulant; Gap filling
Biomedical applications; drinking water applications (filters).; General purpose
Epoxy; Low toxicity
Clear
Low
100:35 (by weight)
A clear, general purpose two component system with long pot life and low viscosity. It has proven useful in biomedical applications, qualify able to BS 6920 for drinking water applications (filters).
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Epo-Tek 730-110
Epoxy Technology
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Bond; Encapsulation; Potting; Sealing
Medical Devices; Automotive; Electronics; General purpose; Industrial; Metal working applications; Optical; Outdoor applications; Semiconductor
Epoxy
Flowing; Medium; Pourable; 8,000 to 12,000
1:1 (by weight)
A two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices.
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Epo-Tek 353ND-T4
Epoxy Technology
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Bond
Medical devices; Bonding ferrite cores together in copper coil windings; Circuit Assembly Applications; Fiber optic; Fiber optic; Hybrid devices; Inductor coils; Power devices; Staking SMD's to PCB; Suitable for COB glob top DAM material; Suitable for COB glob top DAM material
Epoxy
Non flowing properties; Smooth; 11,000 to 17,000
10:1 (by weight)
A two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance .This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow.
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Epo-Tek 323LP-LH Premium
Epoxy Technology
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Bond; Potting; Seal
Medical; Fiber-optic; Hard-disk drive; Hybrid; Semiconductor
Epoxy
4,142
10:1 (by weight)
Longer pot life version of EPO-TEK®353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.
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Epo-Tek 375
Epoxy Technology
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Adhesive
Medical applications; Fiber optic; Hybrid; Semiconductor
Epoxy
3,000 to 5,000
10:1 (by weight)
A two component, high-temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications.
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Loctite EA 3981
Henkel
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Bond
Assembly of disposable medical devices; Endoscopes; Lancets for needle assembles; Medical devices; Syringes; Bond basic structural elements; Bond sub-component assemblies; Hubs; Stainless steel cannulae
Epoxy
Slight amber
4,000 to 6,000
Suitable for a wide range of applications that require fast cure, excellent environmental resistance and high adhesion.
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Interested in Package Size:

5 Gal Pail 30 ml Syringe

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