Thermal Gap Fillers for Power Supplies

Gluespec provides deep data on adhesives & other niche materials. This curated thermal gap fillers for power supplies catalog contains popular materials broken down by cure method. Compare materials or visit individual datasheet pages. Datasheets contain technical data, key specs, best practices, comparable materials, and test method information. Use Advanced Search to filter by data points that are important to you. You can also order samples to test.

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9 Materials

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  • All Thermal Gap Fillers for Power Supplies

  • 2-Part Cure

  • Heat

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  • Pressure Sensitive

Thermal Gap Fillers for Power Supplies

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Dowsil TC-4525 GB Thermally Conductive Gap Filler

Dow

Gap Filler ; 2-Part; Liquid; Silicone; Accelerated heat curing

Two parts, 2.6 W/m·K thermally conductive silicone gap filler, room temperature curing with accelerated heat curing option. UL 94 V0 recognition.

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Dowsil TC-4525 GB Thermally Conductive Gap Filler

Dow

Application Type: Gap Filler

Industry: Master Control Module; Automotive applications; Designed to dissipate the heat from components mounted on printed circuit board to heat sink; Designed to dissipate the heat from components mounted on printed circuit board to heat sink; E-Mobility Solutions; Engine; Suitable for the protection of electrical applications where heat dissipation is critical; Suitable for the protection of electronic applications where heat dissipation is critical; Transmission control unit

Chemical Resistance:

1 Part or 2 Part: 2-Part

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Bergquist Gap Filler TGF 3010APS

Henkel

Gap Filler; 2-Part; Liquid; Non-silicone; Room temperature curable

A non-silicone, two-part, room temperature curable gap filler suitable for use in high-throughput assembly applications. This material is an exceptional choice for use in auto and consumer applications.

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Bergquist Gap Filler TGF 3010APS

Henkel

Application Type: Gap Filler

Industry: Housing and Assembly; Applications requiring high thermal transfer; Applications requiring low compressive stress; Auto applications; Automotive power storage; Consumer applications; High-throughput assembly applications; Processes requiring high dispense rate; Silicone-sensitive applications

Chemical Resistance:

1 Part or 2 Part: 2-Part

Package Sizes

200 cc Cartridge Request Quote
400 cc Cartridge Request Quote
1200 cc Cartridge Request Quote
6 gallon Pail Kit Request Quote
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Gap Pad 1000SF

Henkel

Thermally Conductive Gap Filling Material; 1-Part; Pad; Polymer; Pressure-Sensitive

A thermally conductive, Gap Filling Material, electrically insulating, silicone-free polymer.

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Gap Pad 1000SF

Henkel

Application Type: Thermally Conductive Gap Filling Material

Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive modules; CD-ROM; Digital disk drives ; Fiber optics modules

Chemical Resistance:

1 Part or 2 Part: 1-Part

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Gap Filler TGF 1450

Henkel

Gap Filler; 2-Part; Liquid; No cure by-products; 2-Part Cure

A two-part, high performance, thermally conductive liquid gap filling material.

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Gap Filler TGF 1450

Henkel

Application Type: Gap Filler

Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive electronics; Batteries; Filling unique and intricate air voids and gaps; Fragile assemblies; HEV; Lighting; NEV; Weight sensitive application

Chemical Resistance: Excellent low and high temperature chemical stability

1 Part or 2 Part: 2-Part

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TC-4529

Dow

Gap Fill; 1-Part; Paste; Low volatility; None

High thermal conductivity, Good heat stability at 150°C, Thixotropic nature, Oven free process, Designed for use in gap fill applications, Low volatility

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TC-4529

Dow

Application Type: Gap Fill

Industry: Master Control Module; Designed for use in gap fill applications

Chemical Resistance:

1 Part or 2 Part: 1-Part

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Bergquist Gap Pad TGP HC5000

Henkel

Gap filling material; 1-Part; Pad; Silicone; None

Highly Conformable, Thermally Conductive, Low Modulus Material. A soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The enhanced material is ideal for applications requiring low stress on components and boards during assembly

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Bergquist Gap Pad TGP HC5000

Henkel

Application Type: Gap filling material; Gap Pad; Thermal Interface Material

Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; ASICs; Consumer electronics; DSPs; Guidance Systems; Radar; Telecommunications; Thermal modules to heat sinks

Chemical Resistance:

1 Part or 2 Part: 1-Part

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Bergquist Gap Pad TGP HC3000

Henkel

Gap filling material; 1-Part; Die-cut parts; Silicone; Pressure Sensitive

High-Compliance, Thermally Conductive, Low Modulus Material, Fiberglass reinforced for shear and tear resistance.

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Bergquist Gap Pad TGP HC3000

Henkel

Application Type: Gap filling material; Gap Pad; TIM (Thermal Interface Material)

Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; ASICs; Consumer electronics; DSPs; Guidance Systems; Radar; Telecommunications; Thermal management; Thermal modules to heat sinks; Thermal modules to heat sinks

Chemical Resistance:

1 Part or 2 Part: 1-Part

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Silcool TIA208R

Momentive

Gap filling; 2-Part; Liquid; Silicone; 2-Part Cure

A two-component, good thermally conductive silicone material used for potting and gap filling. It gives primerless adhesion to most metals and plastics.

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Silcool TIA208R

Momentive

Application Type: Gap filling; Potting

Industry: Thermal potting for power supplies; Ballasts; Drivers in LED light bulbs; Electronic devices

Chemical Resistance:

1 Part or 2 Part: 2-Part

Package Sizes

1.5kg Can Request Quote
25kg Pail Request Quote
1.5kg Can Request Quote
25kg Pail Request Quote
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Bergquist Gap Filler TGF 1500LVO

Henkel

Thermally Conductive Gap Filler Material; 2-Part; Liquid; Silicone; Heat

A two-part, high performance, thermally conductive, liquid gap filling material and low modulus

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Bergquist Gap Filler TGF 1500LVO

Henkel

Application Type: Thermally Conductive Gap Filler Material

Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive electronics; Batteries; Fragile assemblies; HEV; Lighting; NEV; Silicone-sensitive electronics

Chemical Resistance: Excellent chemical and mechanical stability

1 Part or 2 Part: 2-Part

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Dowsil TC-4525 GB Thermally Conductive Gap Filler

Gap Filler ; 2-Part; Liquid; Silicone; Accelerated heat curing
Two parts, 2.6 W/m·K thermally conductive silicone gap filler, room temperature curing with accelerated heat curing option. UL 94 V0 recognition.
Manufacturer: Dow
Industry: Master Control Module; Automotive applications; Designed to dissipate the heat from components mounted on printed circuit board to heat sink; Designed to dissipate the heat from components mounted on printed circuit board to heat sink; E-Mobility Solutions; Engine; Suitable for the protection of electrical applications where heat dissipation is critical; Suitable for the protection of electronic applications where heat dissipation is critical; Transmission control unit
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Bergquist Gap Filler TGF 3010APS

Gap Filler; 2-Part; Liquid; Non-silicone; Room temperature curable
A non-silicone, two-part, room temperature curable gap filler suitable for use in high-throughput assembly applications. This material is an exceptional choice for use in auto and consumer applications.
Manufacturer: Henkel
Industry: Housing and Assembly; Applications requiring high thermal transfer; Applications requiring low compressive stress; Auto applications; Automotive power storage; Consumer applications; High-throughput assembly applications; Processes requiring high dispense rate; Silicone-sensitive applications

Package Sizes

200 cc Cartridge 400 cc Cartridge 1200 cc Cartridge 6 gallon Pail Kit 10 gallon Pail Kit 120 liters Drum Kit
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Gap Pad 1000SF

Thermally Conductive Gap Filling Material; 1-Part; Pad; Polymer; Pressure-Sensitive
A thermally conductive, Gap Filling Material, electrically insulating, silicone-free polymer.
Manufacturer: Henkel
Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive modules; CD-ROM; Digital disk drives ; Fiber optics modules
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Gap Filler TGF 1450

Gap Filler; 2-Part; Liquid; No cure by-products; 2-Part Cure
A two-part, high performance, thermally conductive liquid gap filling material.
Manufacturer: Henkel
Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive electronics; Batteries; Filling unique and intricate air voids and gaps; Fragile assemblies; HEV; Lighting; NEV; Weight sensitive application
Chemical Resistance: Excellent low and high temperature chemical stability
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TC-4529

Gap Fill; 1-Part; Paste; Low volatility; None
High thermal conductivity, Good heat stability at 150°C, Thixotropic nature, Oven free process, Designed for use in gap fill applications, Low volatility
Manufacturer: Dow
Industry: Master Control Module; Designed for use in gap fill applications
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Bergquist Gap Pad TGP HC5000

Gap filling material; 1-Part; Pad; Silicone; None
Highly Conformable, Thermally Conductive, Low Modulus Material. A soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The enhanced material is ideal for applications requiring low stress on components and boards during assembly
Manufacturer: Henkel
Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; ASICs; Consumer electronics; DSPs; Guidance Systems; Radar; Telecommunications; Thermal modules to heat sinks
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Bergquist Gap Pad TGP HC3000

Gap filling material; 1-Part; Die-cut parts; Silicone; Pressure Sensitive
High-Compliance, Thermally Conductive, Low Modulus Material, Fiberglass reinforced for shear and tear resistance.
Manufacturer: Henkel
Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; ASICs; Consumer electronics; DSPs; Guidance Systems; Radar; Telecommunications; Thermal management; Thermal modules to heat sinks; Thermal modules to heat sinks
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Silcool TIA208R

Gap filling; 2-Part; Liquid; Silicone; 2-Part Cure
A two-component, good thermally conductive silicone material used for potting and gap filling. It gives primerless adhesion to most metals and plastics.
Manufacturer: Momentive
Industry: Thermal potting for power supplies; Ballasts; Drivers in LED light bulbs; Electronic devices

Package Sizes

1.5kg Can 25kg Pail 1.5kg Can 25kg Pail
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Bergquist Gap Filler TGF 1500LVO

Thermally Conductive Gap Filler Material; 2-Part; Liquid; Silicone; Heat
A two-part, high performance, thermally conductive, liquid gap filling material and low modulus
Manufacturer: Henkel
Industry: Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive electronics; Batteries; Fragile assemblies; HEV; Lighting; NEV; Silicone-sensitive electronics
Chemical Resistance: Excellent chemical and mechanical stability
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9 results
Application Type
Industry
Chemical Resistance
1 Part or 2 Part
Material Form
Description
Dowsil TC-4525 GB Thermally Conductive Gap Filler
Dow
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Gap Filler
Master Control Module; Automotive applications; Designed to dissipate the heat from components mounted on printed circuit board to heat sink; Designed to dissipate the heat from components mounted on printed circuit board to heat sink; E-Mobility Solutions; Engine; Suitable for the protection of electrical applications where heat dissipation is critical; Suitable for the protection of electronic applications where heat dissipation is critical; Transmission control unit
2-Part
Liquid
Two parts, 2.6 W/m·K thermally conductive silicone gap filler, room temperature curing with accelerated heat curing option. UL 94 V0 recognition.
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Bergquist Gap Filler TGF 3010APS
Henkel
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Gap Filler
Housing and Assembly; Applications requiring high thermal transfer; Applications requiring low compressive stress; Auto applications; Automotive power storage; Consumer applications; High-throughput assembly applications; Processes requiring high dispense rate; Silicone-sensitive applications
2-Part
Liquid
A non-silicone, two-part, room temperature curable gap filler suitable for use in high-throughput assembly applications. This material is an exceptional choice for use in auto and consumer applications.
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Interested in Package Size:

200 cc Cartridge 400 cc Cartridge 1200 cc Cartridge 6 gallon Pail Kit 10 gallon Pail Kit 120 liters Drum Kit
Gap Pad 1000SF
Henkel
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Thermally Conductive Gap Filling Material
Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive modules; CD-ROM; Digital disk drives ; Fiber optics modules
1-Part
Pad
A thermally conductive, Gap Filling Material, electrically insulating, silicone-free polymer.
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Gap Filler TGF 1450
Henkel
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Gap Filler
Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive electronics; Batteries; Filling unique and intricate air voids and gaps; Fragile assemblies; HEV; Lighting; NEV; Weight sensitive application
Excellent low and high temperature chemical stability
2-Part
Liquid
A two-part, high performance, thermally conductive liquid gap filling material.
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TC-4529
Dow
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Gap Fill
Master Control Module; Designed for use in gap fill applications
1-Part
Paste
High thermal conductivity, Good heat stability at 150°C, Thixotropic nature, Oven free process, Designed for use in gap fill applications, Low volatility
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Bergquist Gap Pad TGP HC5000
Henkel
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Gap filling material; Gap Pad; Thermal Interface Material
Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; ASICs; Consumer electronics; DSPs; Guidance Systems; Radar; Telecommunications; Thermal modules to heat sinks
1-Part
Pad
Highly Conformable, Thermally Conductive, Low Modulus Material. A soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The enhanced material is ideal for applications requiring low stress on components and boards during assembly
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Bergquist Gap Pad TGP HC3000
Henkel
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Gap filling material; Gap Pad; TIM (Thermal Interface Material)
Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; ASICs; Consumer electronics; DSPs; Guidance Systems; Radar; Telecommunications; Thermal management; Thermal modules to heat sinks; Thermal modules to heat sinks
1-Part
Die-cut parts; Sheet form
High-Compliance, Thermally Conductive, Low Modulus Material, Fiberglass reinforced for shear and tear resistance.
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Silcool TIA208R
Momentive
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Gap filling; Potting
Thermal potting for power supplies; Ballasts; Drivers in LED light bulbs; Electronic devices
2-Part
Liquid
A two-component, good thermally conductive silicone material used for potting and gap filling. It gives primerless adhesion to most metals and plastics.
View Datasheet
Contact Rep

Interested in Package Size:

1.5kg Can 25kg Pail 1.5kg Can 25kg Pail
Bergquist Gap Filler TGF 1500LVO
Henkel
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Thermally Conductive Gap Filler Material
Control Module; Housing and Assembly; Housing and Assembly; Master Control Module; Automotive electronics; Batteries; Fragile assemblies; HEV; Lighting; NEV; Silicone-sensitive electronics
Excellent chemical and mechanical stability
2-Part
Liquid
A two-part, high performance, thermally conductive, liquid gap filling material and low modulus
View Datasheet
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