Thermal Adhesives

View popular materials for thermal adhesives. All of these materials and their data have been gathered by us to help you browse, compare, quote and test based on your requirements! The sections have been broken down by chemistry for ease of search. If you would rather do-it-yourself, you can always customize your own grid by clicking on Advanced Search.

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Thermal Adhesives

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EP1200 Black

Resinlab

Bond; 2-Part; Liquid; Epoxy; Part A/Part B

A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.

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EP1200 Black

Resinlab

Thermal Conductivity (W/m°K): 1.04; High

Application Type: Bond; Casting Resin; Potting

Chemistry: Epoxy

Cure Method: Part A/Part B

Package Sizes

Part A Black Quart Request Quote
Part A Black Gal Request Quote
Part A Black 3.6 Gal Pail Request Quote
Part B Black Quart Request Quote
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Dowsil 1-4173 Thermally Conductive Adhesive

Dow

Bond; 1-Part; Liquid; Aluminum Oxide; Heat cure

A one-part gray, flowable thermally conductive adhesive with high tensile strength.

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Dowsil 1-4173 Thermally Conductive Adhesive

Dow

Thermal Conductivity (W/m°K): 1.80; Thermally Conductive

Application Type: Bond

Chemistry: Aluminum Oxide; No added solvents; Polydimethylsiloxane; Silicone elastomer; Versatile

Cure Method: Heat cure

Package Sizes

30cc EFD Syringe w/ Foil Bag Request Quote
30 ml Request Quote
1.5 kg Cartridge Request Quote
1.5 kg Cartridge to Spec Request Quote
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Loctite Ablestik 56C w/ Cat 11

Henkel

Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure

Two component, high temperature, general purpose. Adhesive - Electrically Conductive

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Loctite Ablestik 56C w/ Cat 11

Henkel

Thermal Conductivity (W/m°K): 3.00; Ultimate

Application Type: Bond

Chemistry: Epoxy

Cure Method: 2-Part Cure; Heat Cure

Package Sizes

Resin 113 g Request Quote
Resin 454 g Request Quote
Catalyst Brown 4 oz Request Quote
Catalyst Brown 1 lb Request Quote
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Dowsil 1-4174 Thermally Conductive Adhesive

Dow

Bond; 1-Part; Liquid; 7 mil glass beads ; Heat cure

One-part gray, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads

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Dowsil 1-4174 Thermally Conductive Adhesive

Dow

Thermal Conductivity (W/m°K): 1.78; Thermally Conductive

Application Type: Bond

Chemistry: 7 mil glass beads ; No added solvents; Silicone elastomer; Versatile

Cure Method: Heat cure

Package Sizes

30 ml Request Quote
1.5 kg Cartridge Request Quote
10 kg Pail Request Quote
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EccoBond 285

Henkel

Bond; 2-Part; Thixotropic Paste; Epoxy; 2 Parts

Highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive. Low coefficient of thermal expansion and good bond strength.

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EccoBond 285

Henkel

Thermal Conductivity (W/m°K): 1.22; 1.44; 1.44

Application Type: Bond

Chemistry: Epoxy

Cure Method: 2 Parts

Package Sizes

Black 2 lb Request Quote
Black 18 lb Request Quote
Black 60 lb Request Quote
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Loctite Ablestik CT 5047-2

Henkel

Bond; 2-Part; Paste (Comp. A); Epoxy; Heat

Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive

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Loctite Ablestik CT 5047-2

Henkel

Thermal Conductivity (W/m°K): 2.00

Application Type: Bond

Chemistry: Epoxy

Cure Method: Heat; Part A/Part B

Package Sizes

Part A 500 g Request Quote
Part B 10 g Request Quote
Part B 25 g Request Quote
Part B 50 g Request Quote
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SEC1233

Resinlab

Bond; 2-Part; Paste; Epoxy; Part A/Part B

A silver filled, two component, room temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications.

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SEC1233

Resinlab

Thermal Conductivity (W/m°K): 1.35; Very high

Application Type: Bond

Chemistry: Epoxy

Cure Method: Part A/Part B

Package Sizes

Part A 30 cc Manual Syringe Request Quote
Part B 30 cc Manual Syringe Request Quote
3 cc Air Syringe Request Quote
3cc Air Syringe (2 cc Fill) Request Quote
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Loctite Ablestik 64C

Henkel

Bond; 2-Part; Liquid (Component B); Epoxy; 2-Part Cure

A low cost, two component, non-silver, electrically conductive epoxy adhesive.

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Loctite Ablestik 64C

Henkel

Thermal Conductivity (W/m°K): 1.44

Application Type: Bond

Chemistry: Epoxy

Cure Method: 2-Part Cure; Heat; Room temperature cure

Package Sizes

Part A 400 g Request Quote
Part B 20 g Request Quote
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Scotch-Weld Epoxy Adhesive DP190 Gray

3M

Bond; 2-Part; Liquid; 2-part cure

• Two-component • Good shear strength • Good peel strength • Flexible • White • Gray • Flow equipment • Two-part meter/mixing/proportioning/dispensing equipment • Solvent resistance • Construction • Electronics • Metalworking • Woodworking • General industrial.

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Scotch-Weld Epoxy Adhesive DP190 Gray

3M

Thermal Conductivity (W/m°K): 38.10

Application Type: Bond

Chemistry:

Cure Method: 2-part cure; Heat cure; Room temperature cure

Package Sizes

Gray 400 ml Duo-Pak Request Quote
Gray 1.7 oz w/ Test Request Quote
Gray 1.7 oz Duo-Pak Request Quote
Gray 200 ml Duo-Pak Request Quote
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SEC1222

Resinlab

Bond; 2-Part; Paste; Epoxy; 2-Part Cure

A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.

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SEC1222

Resinlab

Thermal Conductivity (W/m°K): 1.60; 3.90; Very high

Application Type: Bond

Chemistry: Epoxy

Cure Method: 2-Part Cure

Package Sizes

4 g Twinpak Request Quote
3cc w/ 1cc Fill Request Quote
2.5 g Twinpak Request Quote
100 Gram Jar Kit Request Quote
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Loctite Ablestik 286

Henkel

Bond; 2-Part; Paste; 2-Part Cure

A two component, thermally conductive, room temperature curing, epoxy adhesive. The proper amount of thixotropy is built in to assure minimum flow without sacrificing wetting.

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Loctite Ablestik 286

Henkel

Thermal Conductivity (W/m°K): 1.04; Good

Application Type: Bond

Chemistry:

Cure Method: 2-Part Cure; Heat

Package Sizes

Part A White 12 oz Request Quote
Part A White 4 lb Gal Request Quote
Part A White 20 lb Pail Request Quote
Part B 1 lb 5 oz Request Quote
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Loctite 3875

Henkel

Bond; 2-Part; Liquid; Acrylic; Room Temperature Cure

Two-component, Bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components.

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Loctite 3875

Henkel

Thermal Conductivity (W/m°K): 1.75; 2.00; Thermally conductive

Application Type: Bond

Chemistry: Acrylic

Cure Method: 2-Part Cure; Room Temperature Cure

Package Sizes

Part B 30 cc EFD Request Quote
Part A 30 cc EFD Request Quote
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EP1200 Black

Bond; 2-Part; Liquid; Epoxy; Part A/Part B
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.
Manufacturer: Resinlab
Thermal Conductivity (W/m°K): 1.04; High
Substrate: Ceramic; Aluminum; Copper; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood

Package Sizes

Part A Black Quart Part A Black Gal Part A Black 3.6 Gal Pail Part B Black Quart Part B Black Gal Part B Black 3.6 Gal Pail Black 3 cc Pre-Mixed & Frozen Syringe Black 5 cc Manual Syringe Black 10 cc Manual Pre-Mixed & Frozen Syringe Black 15 g Twinpak Black 20 ml Dual Syringe Black 30 ml Cartridge Black 50 ml Cartridge Black 50 ml Cartridge w/ Cert Black 50 ml Tah Cartridge Black 150 x 150 ml Ratio Park Cartridge Black 200 ml Cartridge Black 300 x 300 ml Ratio Pak Cartridge Black 400 ml Cartridge Blue 400 ml Cartridge White 400 ml Cartridge Black 600 ml Cartridge Black 750 x 750 ml Cartridge Black 750 x 750 ml Ratio Pak Cartridge
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Dowsil 1-4173 Thermally Conductive Adhesive

Bond; 1-Part; Liquid; Aluminum Oxide; Heat cure
A one-part gray, flowable thermally conductive adhesive with high tensile strength.
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.80; Thermally Conductive
Substrate: A variety of common substrates; Al; Ceramics; Filled plastic; Metals; Reactive materials; Wet most surfaces

Package Sizes

30cc EFD Syringe w/ Foil Bag 30 ml 1.5 kg Cartridge 1.5 kg Cartridge to Spec 10 kg Pail
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Loctite Ablestik 56C w/ Cat 11

Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure
Two component, high temperature, general purpose. Adhesive - Electrically Conductive
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 3.00; Ultimate
Substrate: Aluminum; Ceramics; Glass; Metals; Plastics

Package Sizes

Resin 113 g Resin 454 g Catalyst Brown 4 oz Catalyst Brown 1 lb Catalyst 1 lb Mil-Spec Catalyst 40 lb
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Dowsil 1-4174 Thermally Conductive Adhesive

Bond; 1-Part; Liquid; 7 mil glass beads ; Heat cure
One-part gray, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.78; Thermally Conductive
Substrate: A variety of common substrates; Al; Ceramics; Filled plastics; Metals; Reactive materials

Package Sizes

30 ml 1.5 kg Cartridge 10 kg Pail
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EccoBond 285

Bond; 2-Part; Thixotropic Paste; Epoxy; 2 Parts
Highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive. Low coefficient of thermal expansion and good bond strength.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.22; 1.44; 1.44
Substrate: Aluminum; Ceramics; Crystallization; Metals; Prone

Package Sizes

Black 2 lb Black 18 lb Black 60 lb
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Loctite Ablestik CT 5047-2

Bond; 2-Part; Paste (Comp. A); Epoxy; Heat
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 2.00
Substrate: Aluminum

Package Sizes

Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
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SEC1233

Bond; 2-Part; Paste; Epoxy; Part A/Part B
A silver filled, two component, room temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications.
Manufacturer: Resinlab
Thermal Conductivity (W/m°K): 1.35; Very high
Substrate: 2024 T3 Al Abraded; Electrical contacts and components; Metals

Package Sizes

Part A 30 cc Manual Syringe Part B 30 cc Manual Syringe 3 cc Air Syringe 3cc Air Syringe (2 cc Fill) 3 cc Manual Syringe 10 cc Pre-Mixed & Frozen Syringe (5 cc Fill) 4 ml Dual Syringe 2.5 g Twinpak 4 g Twinpak 20 g Jar Kit 40 g Twinpak 100 g Jar Kit 50 ml Cartridge
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Loctite Ablestik 64C

Bond; 2-Part; Liquid (Component B); Epoxy; 2-Part Cure
A low cost, two component, non-silver, electrically conductive epoxy adhesive.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.44

Package Sizes

Part A 400 g Part B 20 g
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Scotch-Weld Epoxy Adhesive DP190 Gray

Bond; 2-Part; Liquid; 2-part cure
• Two-component • Good shear strength • Good peel strength • Flexible • White • Gray • Flow equipment • Two-part meter/mixing/proportioning/dispensing equipment • Solvent resistance • Construction • Electronics • Metalworking • Woodworking • General industrial.
Manufacturer: 3M
Thermal Conductivity (W/m°K): 38.10
Substrate: Acrylic; Borosilicate; Cold rolled Steel; Etched Aluminum; Fiber Glass; Fir; Glass; Plastic; Polycarbonate; Polypropylene; PVC; Rubber; Sanded Aluminum; Steel; Wood

Package Sizes

Gray 400 ml Duo-Pak Gray 1.7 oz w/ Test Gray 1.7 oz Duo-Pak Gray 200 ml Duo-Pak
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SEC1222

Bond; 2-Part; Paste; Epoxy; 2-Part Cure
A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.
Manufacturer: Resinlab
Thermal Conductivity (W/m°K): 1.60; 3.90; Very high
Substrate: 2024 T3 Al Abraded; Other common assembly materials; Various metals

Package Sizes

4 g Twinpak 3cc w/ 1cc Fill 2.5 g Twinpak 100 Gram Jar Kit 10 cc Manual Syringe 1 lb Kit 3 cc Air Syringe (2 cc Fill) 3 cc Manual Syringe Kit
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Loctite Ablestik 286

Bond; 2-Part; Paste; 2-Part Cure
A two component, thermally conductive, room temperature curing, epoxy adhesive. The proper amount of thixotropy is built in to assure minimum flow without sacrificing wetting.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.04; Good
Substrate: Aluminum; Metals; Most metals; Most plastics; Plastics

Package Sizes

Part A White 12 oz Part A White 4 lb Gal Part A White 20 lb Pail Part B 1 lb 5 oz Part B 7 lb Gal Part B 35 lb Pail
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Loctite 3875

Bond; 2-Part; Liquid; Acrylic; Room Temperature Cure
Two-component, Bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.75; 2.00; Thermally conductive
Substrate: Aluminum; Ceramic; Contaminated Mold Compound; Grit Blasted Steel; Mold Compound; NiCu Leadframe; NiCu Leadframe; Silicon

Package Sizes

Part B 30 cc EFD Part A 30 cc EFD
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Thermal Conductivity (W/m°K)
Application Type
Chemistry
Cure Method
Substrate
Description
EP1200 Black
Resinlab
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1.04; High
Bond; Casting Resin; Potting
Epoxy
Part A/Part B
Ceramic; Aluminum; Copper; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.
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Part A Black Quart Part A Black Gal Part A Black 3.6 Gal Pail Part B Black Quart Part B Black Gal Part B Black 3.6 Gal Pail Black 3 cc Pre-Mixed & Frozen Syringe Black 5 cc Manual Syringe Black 10 cc Manual Pre-Mixed & Frozen Syringe Black 15 g Twinpak Black 20 ml Dual Syringe Black 30 ml Cartridge Black 50 ml Cartridge Black 50 ml Cartridge w/ Cert Black 50 ml Tah Cartridge Black 150 x 150 ml Ratio Park Cartridge Black 200 ml Cartridge Black 300 x 300 ml Ratio Pak Cartridge Black 400 ml Cartridge Blue 400 ml Cartridge White 400 ml Cartridge Black 600 ml Cartridge Black 750 x 750 ml Cartridge Black 750 x 750 ml Ratio Pak Cartridge
Dowsil 1-4173 Thermally Conductive Adhesive
Dow
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1.80; Thermally Conductive
Bond
Aluminum Oxide; No added solvents; Polydimethylsiloxane; Silicone elastomer; Versatile
Heat cure
A variety of common substrates; Al; Ceramics; Filled plastic; Metals; Reactive materials; Wet most surfaces
A one-part gray, flowable thermally conductive adhesive with high tensile strength.
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30cc EFD Syringe w/ Foil Bag 30 ml 1.5 kg Cartridge 1.5 kg Cartridge to Spec 10 kg Pail
Loctite Ablestik 56C w/ Cat 11
Henkel
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3.00; Ultimate
Bond
Epoxy
2-Part Cure; Heat Cure
Aluminum; Ceramics; Glass; Metals; Plastics
Two component, high temperature, general purpose. Adhesive - Electrically Conductive
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Resin 113 g Resin 454 g Catalyst Brown 4 oz Catalyst Brown 1 lb Catalyst 1 lb Mil-Spec Catalyst 40 lb
Dowsil 1-4174 Thermally Conductive Adhesive
Dow
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1.78; Thermally Conductive
Bond
7 mil glass beads ; No added solvents; Silicone elastomer; Versatile
Heat cure
A variety of common substrates; Al; Ceramics; Filled plastics; Metals; Reactive materials
One-part gray, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads
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30 ml 1.5 kg Cartridge 10 kg Pail
EccoBond 285
Henkel
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1.22; 1.44; 1.44
Bond
Epoxy
2 Parts
Aluminum; Ceramics; Crystallization; Metals; Prone
Highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive. Low coefficient of thermal expansion and good bond strength.
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Black 2 lb Black 18 lb Black 60 lb
Loctite Ablestik CT 5047-2
Henkel
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2.00
Bond
Epoxy
Heat; Part A/Part B
Aluminum
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
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Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
SEC1233
Resinlab
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1.35; Very high
Bond
Epoxy
Part A/Part B
2024 T3 Al Abraded; Electrical contacts and components; Metals
A silver filled, two component, room temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications.
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Part A 30 cc Manual Syringe Part B 30 cc Manual Syringe 3 cc Air Syringe 3cc Air Syringe (2 cc Fill) 3 cc Manual Syringe 10 cc Pre-Mixed & Frozen Syringe (5 cc Fill) 4 ml Dual Syringe 2.5 g Twinpak 4 g Twinpak 20 g Jar Kit 40 g Twinpak 100 g Jar Kit 50 ml Cartridge
Loctite Ablestik 64C
Henkel
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1.44
Bond
Epoxy
2-Part Cure; Heat; Room temperature cure
A low cost, two component, non-silver, electrically conductive epoxy adhesive.
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Part A 400 g Part B 20 g
Scotch-Weld Epoxy Adhesive DP190 Gray
3M
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38.10
Bond
2-part cure; Heat cure; Room temperature cure
Acrylic; Borosilicate; Cold rolled Steel; Etched Aluminum; Fiber Glass; Fir; Glass; Plastic; Polycarbonate; Polypropylene; PVC; Rubber; Sanded Aluminum; Steel; Wood
• Two-component • Good shear strength • Good peel strength • Flexible • White • Gray • Flow equipment • Two-part meter/mixing/proportioning/dispensing equipment • Solvent resistance • Construction • Electronics • Metalworking • Woodworking • General industrial.
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Gray 400 ml Duo-Pak Gray 1.7 oz w/ Test Gray 1.7 oz Duo-Pak Gray 200 ml Duo-Pak
SEC1222
Resinlab
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1.60; 3.90; Very high
Bond
Epoxy
2-Part Cure
2024 T3 Al Abraded; Other common assembly materials; Various metals
A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.
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4 g Twinpak 3cc w/ 1cc Fill 2.5 g Twinpak 100 Gram Jar Kit 10 cc Manual Syringe 1 lb Kit 3 cc Air Syringe (2 cc Fill) 3 cc Manual Syringe Kit
Loctite Ablestik 286
Henkel
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1.04; Good
Bond
2-Part Cure; Heat
Aluminum; Metals; Most metals; Most plastics; Plastics
A two component, thermally conductive, room temperature curing, epoxy adhesive. The proper amount of thixotropy is built in to assure minimum flow without sacrificing wetting.
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Part A White 12 oz Part A White 4 lb Gal Part A White 20 lb Pail Part B 1 lb 5 oz Part B 7 lb Gal Part B 35 lb Pail
Loctite 3875
Henkel
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1.75; 2.00; Thermally conductive
Bond
Acrylic
2-Part Cure; Room Temperature Cure
Aluminum; Ceramic; Contaminated Mold Compound; Grit Blasted Steel; Mold Compound; NiCu Leadframe; NiCu Leadframe; Silicon
Two-component, Bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components.
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Part B 30 cc EFD Part A 30 cc EFD
Loctite Stycast 99
Henkel
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1.44; High
Bond
Epoxy
Heat
Aluminum; Ceramics; Engineering plastics; Glass; Metal
A one component, heat cured, thixotropic non-sag paste, epoxy adhesive. It features excellent thermal conductivity and electrical insulation properties.
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Black 15 lb Quart
Dowsil 3-6751 Thermally Conductive Adhesive
Dow
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1.00; High
Bond
Silicone
2-Part Cure; Heat
A variety of common substrates; Al; Ceramics; Filled plastics; Metals; Reactive materials
Two-part gray, thermally conductive adhesive with low viscosity and flame resistance
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1 kg Kit 12 kg 12 kg Kit 54 kg
3-6752 Thermally ConDuctive Adhesive
Dow
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1.70
Bond
Polydimethylsiloxane; Silicone elastomer
Heat
Al
One-part; rapid heat cure and primerless adhesion to common substrates used in the electronics industry
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75 g 10 kg
3-1818 Thermally Conductive Adhesive
Dow
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1.70
Bond
Aluminum Oxide; Silicone elastomer
Heat
Al; Ceramic; Filled plastic; Metal ; Reactive Materials
One-part gray, thixotropic thermally conductive adhesive with good flame resistance.
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1.5 kg 10 kg Pail
XCE-3104MT
Henkel
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1.80
Bond; Mask stencil
Epoxy
Heat; Thermosetting
Aluminum Lead Frame; FR-4; Lead; Nickel; OSP-copper; Tin
A one component, thermosetting, electrically conductive adhesive that is a lead-free alternative to solder for surface mount device (SMD) interconnect formation.
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TC-2810
3M
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0.80 to 1.40
Bond; Coating
Epoxy
2-Part Cure
rigid parts
A thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion.
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37 ml Duo-Pak
Loctite Ablestik 57C
Henkel
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7.20; Good; Thermally Conductive; Ultimate
Adhesive
Epoxy
Heat; Part A/Part B
Aluminum
● Two component - requires mixing ● Electrically conductive ● Thermally conductive ● Thixotropic ● Ease of use ● Good bond strength ● Room temperature cure
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Catalyst 57 Gram Catalyst 454 Gram Resin 454 g Resin Resin 57 g
Loctite Ablestik 56C w/ Cat 9
Henkel
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3.00; Ultimate
Bond
Epoxy
2 Parts; Heat
Aluminum; Ceramics; Conductive plastics; Glass; Metals
Two component, general purpose. Adhesive - Electrically Conductive
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Resin 113 g Catalyst Amber 1 oz Catalyst Amber 4 oz Catalyst Amber 1 lb Catalyst Unpigmented 1 lb Catalyst Amber 8 lb Catalyst Amber 40 lb Pail
Loctite Ablestik 5025E
Henkel
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6.50; Excellent
Bond
Epoxy
Heat
Ag/Cu leadframe; Al
It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.
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SE 4486 CV Thermally ConDuctive Adhesive
Dow
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1.53; Thermally conductive
Bond
Polydimethylsiloxane
Moisture cure; RTV-cure
One part, white, moisture cure, thermally conductive silicone adhesive. Is designed to provide efficient thermal transfer for the cooling of modules, including home appliance devices.
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330 ml Cartridge
Loctite Ablestik 60L Parts AB
Henkel
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1.20
Bond
Epoxy
2-Part Cure; Heat
Aluminum
● Two component - requires mixing ● Electrically conductive ● Good thermal conductivity ● Bonds to a wide variety of substrates ● Room temperature cure and Heat cure
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Part B Gray 4 oz Part A Gray 12 oz
Loctite Ablestik 281 BK
Henkel
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1.20; 1.40; High
Bond
Epoxy
Heat
Aluminum; Glass; Metals; Plastics
● One component ● High thermal conductivity ● Non-sag paste ● Thixotropic ● Good chemical resistance ● High electrical insulation ● Low coefficient of thermal expansion
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Black 16 lb Black 2 lb Black 60 lb

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