Thermal Film Adhesives

Below is a curated list of thermal film adhesives materials. Feel free to browse by substrate or jump over to the Gluespec Grids in Advanced Search. Our goal is to help you find the right material to test for your application.

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12 Materials

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Thermal Film Adhesives

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Loctite Ablestik 5025E

Henkel

Bond; 1-Part; Film; Epoxy; Heat

It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.

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Loctite Ablestik 5025E

Henkel

Thermal Conductivity (W/m°K): 6.50; Excellent

Material Form: Film

Application Type: Bond

Chemistry: Epoxy

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TF T2781F

Resin Designs

Bond; 1-Part; Film; Epoxy; Heat

A high performance, highly thermally conductive\electrically insulating, B-staged film adhesive that features a fast cure time, high thermal conductivity and good adhesion to various substrates and good chemical, heat, and moisture resistance.

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TF T2781F

Resin Designs

Thermal Conductivity (W/m°K): 2.63; High

Material Form: Film

Application Type: Bond

Chemistry: Epoxy

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Loctite Ablestik CF 3350

Henkel

Bond; 1-Part; Film; Epoxy; Heat cure

● Epoxy film adhesive ● High electrical conductivity ● High thermal conductivity ● Heat cure ● Gray Tan color ● Formulated for electrical, thermal and mechanical assembly applications.

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Loctite Ablestik CF 3350

Henkel

Thermal Conductivity (W/m°K): 7.00; High

Material Form: Film

Application Type: Bond

Chemistry: Epoxy

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Bergquist Bond Ply TBP 1400LMS-HD

Henkel

Adhesive; 1-Part; Die-cut parts; Silicone; Heat

A thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films.

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Bergquist Bond Ply TBP 1400LMS-HD

Henkel

Thermal Conductivity (W/m°K): 1.40; Thermally Conductive

Material Form: Die-cut parts; Roll form; Sheet form

Application Type: Adhesive

Chemistry: Acrylic; Silicone

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Loctite Ablestik 563K

Henkel

Bond; 1-Part; Film; Epoxy; Heat

A epoxy adhesive film is suitable for bonding"hot" devices, heat cure, thermally conductive, thin bondline, uniform bondline control, good heat transfer provides high strength over a wider temperature range.

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Loctite Ablestik 563K

Henkel

Thermal Conductivity (W/m°K): 1.10 Thermally conductive

Material Form: Film

Application Type: Bond

Chemistry: Epoxy

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TF E2713F

Resin Designs

Bond; 1-Part; Film; Epoxy; Heat

A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.

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TF E2713F

Resin Designs

Thermal Conductivity (W/m°K): 1.30

Material Form: Film

Application Type: Bond; EMI/RFI grounding; EMI/RFI grounding

Chemistry: Epoxy

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TF T2381F

Resin Designs

Bond; 1-Part; B-Staged Film; Epoxy; Heat

A thermally conductive B-staged film adhesive specially formulated for high temperature applications. It good chemical, heat, and moisture resistance and high thermal conductivity.

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TF T2381F

Resin Designs

Thermal Conductivity (W/m°K): 1.20; High Thermally Conductive

Material Form: B-Staged Film

Application Type: Bond

Chemistry: Epoxy

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Loctite Ablestik ECF 561E

Henkel

Bonding; 1-Part; Film; Glass fabric (Carrier), 1mil; Heat cure

An electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion, heat cure.

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Loctite Ablestik ECF 561E

Henkel

Thermal Conductivity (W/m°K): 1.60

Material Form: Film

Application Type: Bonding

Chemistry: Glass fabric (Carrier), 1mil; Rubberized Epoxy

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TF T2581F

Resin Designs

Bond; 2-Part; Film; Epoxy; Heat

A high performance, highly thermally conductive\electrically insulating, B-stated film adhesive. It features a high thermal conductivity, excellent room temperature stability and good adhesion to various substrates and very good chemical, heat, and moisture resistance.

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TF T2581F

Resin Designs

Thermal Conductivity (W/m°K): 1.70

Material Form: Film

Application Type: Bond

Chemistry: Epoxy

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Loctite Ablestik ECF 563

Henkel

Bond; 1-Part; Film; Epoxy; Heat cure

● One part ● Electrically conductive ● Thermally conductive ● Passes NASA outgassing ● Assembly ● Microwave and Heat sink applications ● Heat cure ● Epoxy Film ● Gray ● This adhesive provides RF/EMI shielding in bonding microwave substrates into packages

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Loctite Ablestik ECF 563

Henkel

Thermal Conductivity (W/m°K): 1.73; Thermally conductive

Material Form: Film

Application Type: Bond; EMI shielding; RF shielding

Chemistry: Epoxy

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Loctite Ablestik CDF 200

Henkel

Bond; 1-Part; Film; Hybrid; Heat cure

A highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.

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Loctite Ablestik CDF 200

Henkel

Thermal Conductivity (W/m°K): 2.30; High

Material Form: Film

Application Type: Bond

Chemistry: Hybrid

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Loctite Ablestik CDF 600

Henkel

Bond; 1-Part; Film; Hybrid; Heat cure

A one-part, silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.

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Loctite Ablestik CDF 600

Henkel

Thermal Conductivity (W/m°K): 1.00; Thermally conductive

Material Form: Film

Application Type: Bond

Chemistry: Hybrid

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Loctite Ablestik 5025E

Bond; 1-Part; Film; Epoxy; Heat
It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 6.50; Excellent
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TF T2781F

Bond; 1-Part; Film; Epoxy; Heat
A high performance, highly thermally conductive\electrically insulating, B-staged film adhesive that features a fast cure time, high thermal conductivity and good adhesion to various substrates and good chemical, heat, and moisture resistance.
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): 2.63; High
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Loctite Ablestik CF 3350

Bond; 1-Part; Film; Epoxy; Heat cure
● Epoxy film adhesive ● High electrical conductivity ● High thermal conductivity ● Heat cure ● Gray Tan color ● Formulated for electrical, thermal and mechanical assembly applications.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 7.00; High
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Bergquist Bond Ply TBP 1400LMS-HD

Adhesive; 1-Part; Die-cut parts; Silicone; Heat
A thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.40; Thermally Conductive
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Loctite Ablestik 563K

Bond; 1-Part; Film; Epoxy; Heat
A epoxy adhesive film is suitable for bonding"hot" devices, heat cure, thermally conductive, thin bondline, uniform bondline control, good heat transfer provides high strength over a wider temperature range.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.10 Thermally conductive
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TF E2713F

Bond; 1-Part; Film; Epoxy; Heat
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): 1.30
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TF T2381F

Bond; 1-Part; B-Staged Film; Epoxy; Heat
A thermally conductive B-staged film adhesive specially formulated for high temperature applications. It good chemical, heat, and moisture resistance and high thermal conductivity.
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): 1.20; High Thermally Conductive
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Loctite Ablestik ECF 561E

Bonding; 1-Part; Film; Glass fabric (Carrier), 1mil; Heat cure
An electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion, heat cure.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.60
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TF T2581F

Bond; 2-Part; Film; Epoxy; Heat
A high performance, highly thermally conductive\electrically insulating, B-stated film adhesive. It features a high thermal conductivity, excellent room temperature stability and good adhesion to various substrates and very good chemical, heat, and moisture resistance.
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): 1.70
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Loctite Ablestik ECF 563

Bond; 1-Part; Film; Epoxy; Heat cure
● One part ● Electrically conductive ● Thermally conductive ● Passes NASA outgassing ● Assembly ● Microwave and Heat sink applications ● Heat cure ● Epoxy Film ● Gray ● This adhesive provides RF/EMI shielding in bonding microwave substrates into packages
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.73; Thermally conductive
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Loctite Ablestik CDF 200

Bond; 1-Part; Film; Hybrid; Heat cure
A highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 2.30; High
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Loctite Ablestik CDF 600

Bond; 1-Part; Film; Hybrid; Heat cure
A one-part, silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.00; Thermally conductive
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12 results
Thermal Conductivity (W/m°K)
Material Form
Application Type
Chemistry
Cure Method
Primerless
Description
Loctite Ablestik 5025E
Henkel
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6.50; Excellent
Film
Bond
Epoxy
Heat
It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.
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TF T2781F
Resin Designs
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2.63; High
Film
Bond
Epoxy
Heat
A high performance, highly thermally conductive\electrically insulating, B-staged film adhesive that features a fast cure time, high thermal conductivity and good adhesion to various substrates and good chemical, heat, and moisture resistance.
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Loctite Ablestik CF 3350
Henkel
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7.00; High
Film
Bond
Epoxy
Heat cure; Pressure Sensitive
● Epoxy film adhesive ● High electrical conductivity ● High thermal conductivity ● Heat cure ● Gray Tan color ● Formulated for electrical, thermal and mechanical assembly applications.
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Bergquist Bond Ply TBP 1400LMS-HD
Henkel
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1.40; Thermally Conductive
Die-cut parts; Roll form; Sheet form
Adhesive
Acrylic; Silicone
Heat
A thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films.
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Loctite Ablestik 563K
Henkel
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1.10 Thermally conductive
Film
Bond
Epoxy
Heat
A epoxy adhesive film is suitable for bonding"hot" devices, heat cure, thermally conductive, thin bondline, uniform bondline control, good heat transfer provides high strength over a wider temperature range.
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TF E2713F
Resin Designs
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1.30
Film
Bond; EMI/RFI grounding; EMI/RFI grounding
Epoxy
Heat
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.
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TF T2381F
Resin Designs
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1.20; High Thermally Conductive
B-Staged Film
Bond
Epoxy
Heat
A thermally conductive B-staged film adhesive specially formulated for high temperature applications. It good chemical, heat, and moisture resistance and high thermal conductivity.
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Loctite Ablestik ECF 561E
Henkel
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1.60
Film
Bonding
Glass fabric (Carrier), 1mil; Rubberized Epoxy
Heat cure
An electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion, heat cure.
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TF T2581F
Resin Designs
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1.70
Film
Bond
Epoxy
Heat
A high performance, highly thermally conductive\electrically insulating, B-stated film adhesive. It features a high thermal conductivity, excellent room temperature stability and good adhesion to various substrates and very good chemical, heat, and moisture resistance.
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Loctite Ablestik ECF 563
Henkel
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1.73; Thermally conductive
Film
Bond; EMI shielding; RF shielding
Epoxy
Heat cure
● One part ● Electrically conductive ● Thermally conductive ● Passes NASA outgassing ● Assembly ● Microwave and Heat sink applications ● Heat cure ● Epoxy Film ● Gray ● This adhesive provides RF/EMI shielding in bonding microwave substrates into packages
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Loctite Ablestik CDF 200
Henkel
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2.30; High
Film
Bond
Hybrid
Heat cure
A highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.
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Loctite Ablestik CDF 600
Henkel
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1.00; Thermally conductive
Film
Bond
Hybrid
Heat cure
A one-part, silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.
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