
Thermal Film Adhesives
Below is a curated list of thermal film adhesives materials. Feel free to browse by substrate or jump over to the Gluespec Grids in Advanced Search. Our goal is to help you find the right material to test for your application.
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All Thermal Film Adhesives
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Thermal Film Adhesives
Loctite Ablestik 5025E
Henkel
Bond; 1-Part; Film; Epoxy; Heat
It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.

Loctite Ablestik 5025E
Henkel
Thermal Conductivity (W/m°K): 6.50; Excellent
Material Form: Film
Application Type: Bond
Chemistry: Epoxy

TF T2781F
Resin Designs
Bond; 1-Part; Film; Epoxy; Heat
A high performance, highly thermally conductive\electrically insulating, B-staged film adhesive that features a fast cure time, high thermal conductivity and good adhesion to various substrates and good chemical, heat, and moisture resistance.

TF T2781F
Resin Designs
Thermal Conductivity (W/m°K): 2.63; High
Material Form: Film
Application Type: Bond
Chemistry: Epoxy

Loctite Ablestik CF 3350
Henkel
Bond; 1-Part; Film; Epoxy; Heat cure
● Epoxy film adhesive ● High electrical conductivity ● High thermal conductivity ● Heat cure ● Gray Tan color ● Formulated for electrical, thermal and mechanical assembly applications.

Loctite Ablestik CF 3350
Henkel
Thermal Conductivity (W/m°K): 7.00; High
Material Form: Film
Application Type: Bond
Chemistry: Epoxy

Bergquist Bond Ply TBP 1400LMS-HD
Henkel
Adhesive; 1-Part; Die-cut parts; Silicone; Heat
A thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films.

Bergquist Bond Ply TBP 1400LMS-HD
Henkel
Thermal Conductivity (W/m°K): 1.40; Thermally Conductive
Material Form: Die-cut parts; Roll form; Sheet form
Application Type: Adhesive
Chemistry: Acrylic; Silicone

Loctite Ablestik 563K
Henkel
Bond; 1-Part; Film; Epoxy; Heat
A epoxy adhesive film is suitable for bonding"hot" devices, heat cure, thermally conductive, thin bondline, uniform bondline control, good heat transfer provides high strength over a wider temperature range.

Loctite Ablestik 563K
Henkel
Thermal Conductivity (W/m°K): 1.10 Thermally conductive
Material Form: Film
Application Type: Bond
Chemistry: Epoxy

TF E2713F
Resin Designs
Bond; 1-Part; Film; Epoxy; Heat
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates.

TF E2713F
Resin Designs
Thermal Conductivity (W/m°K): 1.30
Material Form: Film
Application Type: Bond; EMI/RFI grounding; EMI/RFI grounding
Chemistry: Epoxy

TF T2381F
Resin Designs
Bond; 1-Part; B-Staged Film; Epoxy; Heat
A thermally conductive B-staged film adhesive specially formulated for high temperature applications. It good chemical, heat, and moisture resistance and high thermal conductivity.

TF T2381F
Resin Designs
Thermal Conductivity (W/m°K): 1.20; High Thermally Conductive
Material Form: B-Staged Film
Application Type: Bond
Chemistry: Epoxy

Loctite Ablestik ECF 561E
Henkel
Bonding; 1-Part; Film; Glass fabric (Carrier), 1mil; Heat cure
An electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion, heat cure.

Loctite Ablestik ECF 561E
Henkel
Thermal Conductivity (W/m°K): 1.60
Material Form: Film
Application Type: Bonding
Chemistry: Glass fabric (Carrier), 1mil; Rubberized Epoxy

TF T2581F
Resin Designs
Bond; 2-Part; Film; Epoxy; Heat
A high performance, highly thermally conductive\electrically insulating, B-stated film adhesive. It features a high thermal conductivity, excellent room temperature stability and good adhesion to various substrates and very good chemical, heat, and moisture resistance.

TF T2581F
Resin Designs
Thermal Conductivity (W/m°K): 1.70
Material Form: Film
Application Type: Bond
Chemistry: Epoxy

Loctite Ablestik ECF 563
Henkel
Bond; 1-Part; Film; Epoxy; Heat cure
● One part ● Electrically conductive ● Thermally conductive ● Passes NASA outgassing ● Assembly ● Microwave and Heat sink applications ● Heat cure ● Epoxy Film ● Gray ● This adhesive provides RF/EMI shielding in bonding microwave substrates into packages

Loctite Ablestik ECF 563
Henkel
Thermal Conductivity (W/m°K): 1.73; Thermally conductive
Material Form: Film
Application Type: Bond; EMI shielding; RF shielding
Chemistry: Epoxy

Loctite Ablestik CDF 200
Henkel
Bond; 1-Part; Film; Hybrid; Heat cure
A highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.

Loctite Ablestik CDF 200
Henkel
Thermal Conductivity (W/m°K): 2.30; High
Material Form: Film
Application Type: Bond
Chemistry: Hybrid

Loctite Ablestik CDF 600
Henkel
Bond; 1-Part; Film; Hybrid; Heat cure
A one-part, silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.

Loctite Ablestik CDF 600
Henkel
Thermal Conductivity (W/m°K): 1.00; Thermally conductive
Material Form: Film
Application Type: Bond
Chemistry: Hybrid

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Loctite Ablestik 5025E
TF T2781F
Loctite Ablestik CF 3350
Bergquist Bond Ply TBP 1400LMS-HD
Loctite Ablestik 563K
TF E2713F
TF T2381F
Loctite Ablestik ECF 561E
TF T2581F
Loctite Ablestik ECF 563
Loctite Ablestik CDF 200
Loctite Ablestik CDF 600
View with more filters in Advanced Search
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