Thermal Liquid Adhesives

Gluespec provides deep data on adhesives & other niche materials. This curated thermal liquid adhesives catalog contains popular materials broken down by substrate. Compare materials or visit individual datasheet pages. Datasheets contain technical data, key specs, best practices, comparable materials, and test method information. Use Advanced Search to filter by data points that are important to you. You can also order samples to test.

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72 Materials

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Thermal Liquid Adhesives

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EP1200 Black

Resinlab

Bond; 2-Part; Liquid; Epoxy; Part A/Part B

A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.

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EP1200 Black

Resinlab

Thermal Conductivity (W/m°K): 1.04; High

Application Type: Bond; Casting Resin; Potting

Material Form: Liquid

Chemistry: Epoxy

Package Sizes

Part A Black Quart Request Quote
Part A Black Gal Request Quote
Part A Black 3.6 Gal Pail Request Quote
Part B Black Quart Request Quote
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Dowsil 1-4173 Thermally Conductive Adhesive

Dow

Bond; 1-Part; Liquid; Aluminum Oxide; Heat cure

A one-part gray, flowable thermally conductive adhesive with high tensile strength.

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Dowsil 1-4173 Thermally Conductive Adhesive

Dow

Thermal Conductivity (W/m°K): 1.80; Thermally Conductive

Application Type: Bond

Material Form: Liquid; Silicone elastomer

Chemistry: Aluminum Oxide; No added solvents; Polydimethylsiloxane; Silicone elastomer; Versatile

Package Sizes

30cc EFD Syringe w/ Foil Bag Request Quote
30 ml Request Quote
1.5 kg Cartridge Request Quote
1.5 kg Cartridge to Spec Request Quote
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Dowsil 1-4174 Thermally Conductive Adhesive

Dow

Bond; 1-Part; Liquid; 7 mil glass beads ; Heat cure

One-part gray, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads

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Dowsil 1-4174 Thermally Conductive Adhesive

Dow

Thermal Conductivity (W/m°K): 1.78; Thermally Conductive

Application Type: Bond

Material Form: Liquid; Silicone elastomer

Chemistry: 7 mil glass beads ; No added solvents; Silicone elastomer; Versatile

Package Sizes

30 ml Request Quote
1.5 kg Cartridge Request Quote
10 kg Pail Request Quote
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Loctite Ablestik CT 5047-2

Henkel

Bond; 2-Part; Liquid (Comp. B); Epoxy; Heat

Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive

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Loctite Ablestik CT 5047-2

Henkel

Thermal Conductivity (W/m°K): 2.00

Application Type: Bond

Material Form: Liquid (Comp. B); Paste (Comp. A)

Chemistry: Epoxy

Package Sizes

Part A 500 g Request Quote
Part B 10 g Request Quote
Part B 25 g Request Quote
Part B 50 g Request Quote
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Loctite Ablestik 64C

Henkel

Bond; 2-Part; Liquid (Component B); Epoxy; 2-Part Cure

A low cost, two component, non-silver, electrically conductive epoxy adhesive.

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Loctite Ablestik 64C

Henkel

Thermal Conductivity (W/m°K): 1.44

Application Type: Bond

Material Form: Liquid (Component B); Paste (Component A)

Chemistry: Epoxy

Package Sizes

Part A 400 g Request Quote
Part B 20 g Request Quote
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Loctite 3875

Henkel

Bond; 2-Part; Liquid; Acrylic; Room Temperature Cure

Two-component, Bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components.

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Loctite 3875

Henkel

Thermal Conductivity (W/m°K): 1.75; 2.00; Thermally conductive

Application Type: Bond

Material Form: Liquid

Chemistry: Acrylic

Package Sizes

Part B 30 cc EFD Request Quote
Part A 30 cc EFD Request Quote
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Dowsil 3-6751 Thermally Conductive Adhesive

Dow

Bond; 2-Part; Liquid; Silicone; Heat

Two-part gray, thermally conductive adhesive with low viscosity and flame resistance

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Dowsil 3-6751 Thermally Conductive Adhesive

Dow

Thermal Conductivity (W/m°K): 1.00; High

Application Type: Bond

Material Form: Liquid

Chemistry: Silicone

Package Sizes

1 kg Kit Request Quote
12 kg Request Quote
12 kg Kit Request Quote
54 kg Request Quote
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3-6752 Thermally ConDuctive Adhesive

Dow

Bond; 1-Part; Liquid; Polydimethylsiloxane; Heat

One-part; rapid heat cure and primerless adhesion to common substrates used in the electronics industry

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3-6752 Thermally ConDuctive Adhesive

Dow

Thermal Conductivity (W/m°K): 1.70

Application Type: Bond

Material Form: Liquid; Silicone elastomer

Chemistry: Polydimethylsiloxane; Silicone elastomer

Package Sizes

75 g Request Quote
10 kg Request Quote
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3-1818 Thermally Conductive Adhesive

Dow

Bond; 1-Part; Liquid; Aluminum Oxide; Heat

One-part gray, thixotropic thermally conductive adhesive with good flame resistance.

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3-1818 Thermally Conductive Adhesive

Dow

Thermal Conductivity (W/m°K): 1.70

Application Type: Bond

Material Form: Liquid; Silicone elastomer

Chemistry: Aluminum Oxide; Silicone elastomer

Package Sizes

1.5 kg Request Quote
10 kg Pail Request Quote
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Bergquist Liqui Bond TLB SA1000

Henkel

Adhesive; 1-Part; Liquid; Silicone; Heat cure

Thermally Conductive, One-Part, Liquid Silicone Adhesive

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Bergquist Liqui Bond TLB SA1000

Henkel

Thermal Conductivity (W/m°K): 1.00; High

Application Type: Adhesive; TIM (Thermal Interface Material)

Material Form: Liquid

Chemistry: Silicone

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TC-2810

3M

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure

A thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion.

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TC-2810

3M

Thermal Conductivity (W/m°K): 0.80 to 1.40

Application Type: Bond; Coating

Material Form: Liquid

Chemistry: Epoxy

Package Sizes

37 ml Duo-Pak Request Quote
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SE 4486 CV Thermally ConDuctive Adhesive

Dow

Bond; 1-Part; Liquid; Polydimethylsiloxane; Moisture cure

One part, white, moisture cure, thermally conductive silicone adhesive. Is designed to provide efficient thermal transfer for the cooling of modules, including home appliance devices.

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SE 4486 CV Thermally ConDuctive Adhesive

Dow

Thermal Conductivity (W/m°K): 1.53; Thermally conductive

Application Type: Bond

Material Form: Liquid

Chemistry: Polydimethylsiloxane

Package Sizes

330 ml Cartridge Request Quote
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EP1200 Black

Bond; 2-Part; Liquid; Epoxy; Part A/Part B
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.
Manufacturer: Resinlab
Thermal Conductivity (W/m°K): 1.04; High
Substrate: Ceramic; Aluminum; Copper; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood

Package Sizes

Part A Black Quart Part A Black Gal Part A Black 3.6 Gal Pail Part B Black Quart Part B Black Gal Part B Black 3.6 Gal Pail Black 3 cc Pre-Mixed & Frozen Syringe Black 5 cc Manual Syringe Black 10 cc Manual Pre-Mixed & Frozen Syringe Black 15 g Twinpak Black 20 ml Dual Syringe Black 30 ml Cartridge Black 50 ml Cartridge Black 50 ml Cartridge w/ Cert Black 50 ml Tah Cartridge Black 150 x 150 ml Ratio Park Cartridge Black 200 ml Cartridge Black 300 x 300 ml Ratio Pak Cartridge Black 400 ml Cartridge Blue 400 ml Cartridge White 400 ml Cartridge Black 600 ml Cartridge Black 750 x 750 ml Cartridge Black 750 x 750 ml Ratio Pak Cartridge
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Dowsil 1-4173 Thermally Conductive Adhesive

Bond; 1-Part; Liquid; Aluminum Oxide; Heat cure
A one-part gray, flowable thermally conductive adhesive with high tensile strength.
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.80; Thermally Conductive
Substrate: A variety of common substrates; Al; Ceramics; Filled plastic; Metals; Reactive materials; Wet most surfaces
Primerless: Primerless adhesion

Package Sizes

30cc EFD Syringe w/ Foil Bag 30 ml 1.5 kg Cartridge 1.5 kg Cartridge to Spec 10 kg Pail
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Dowsil 1-4174 Thermally Conductive Adhesive

Bond; 1-Part; Liquid; 7 mil glass beads ; Heat cure
One-part gray, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.78; Thermally Conductive
Substrate: A variety of common substrates; Al; Ceramics; Filled plastics; Metals; Reactive materials
Primerless: Primerless adhesion

Package Sizes

30 ml 1.5 kg Cartridge 10 kg Pail
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Loctite Ablestik CT 5047-2

Bond; 2-Part; Liquid (Comp. B); Epoxy; Heat
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 2.00
Substrate: Aluminum

Package Sizes

Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
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Loctite Ablestik 64C

Bond; 2-Part; Liquid (Component B); Epoxy; 2-Part Cure
A low cost, two component, non-silver, electrically conductive epoxy adhesive.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.44

Package Sizes

Part A 400 g Part B 20 g
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Loctite 3875

Bond; 2-Part; Liquid; Acrylic; Room Temperature Cure
Two-component, Bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components.
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.75; 2.00; Thermally conductive
Substrate: Aluminum; Ceramic; Contaminated Mold Compound; Grit Blasted Steel; Mold Compound; NiCu Leadframe; NiCu Leadframe; Silicon

Package Sizes

Part B 30 cc EFD Part A 30 cc EFD
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Dowsil 3-6751 Thermally Conductive Adhesive

Bond; 2-Part; Liquid; Silicone; Heat
Two-part gray, thermally conductive adhesive with low viscosity and flame resistance
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.00; High
Substrate: A variety of common substrates; Al; Ceramics; Filled plastics; Metals; Reactive materials

Package Sizes

1 kg Kit 12 kg 12 kg Kit 54 kg
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3-6752 Thermally ConDuctive Adhesive

Bond; 1-Part; Liquid; Polydimethylsiloxane; Heat
One-part; rapid heat cure and primerless adhesion to common substrates used in the electronics industry
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.70
Substrate: Al
Primerless: Primerless adhesion to common substrates

Package Sizes

75 g 10 kg
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3-1818 Thermally Conductive Adhesive

Bond; 1-Part; Liquid; Aluminum Oxide; Heat
One-part gray, thixotropic thermally conductive adhesive with good flame resistance.
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.70
Substrate: Al; Ceramic; Filled plastic; Metal ; Reactive Materials

Package Sizes

1.5 kg 10 kg Pail
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Bergquist Liqui Bond TLB SA1000

Adhesive; 1-Part; Liquid; Silicone; Heat cure
Thermally Conductive, One-Part, Liquid Silicone Adhesive
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.00; High
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TC-2810

Bond; 2-Part; Liquid; Epoxy; 2-Part Cure
A thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion.
Manufacturer: 3M
Thermal Conductivity (W/m°K): 0.80 to 1.40
Substrate: rigid parts

Package Sizes

37 ml Duo-Pak
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SE 4486 CV Thermally ConDuctive Adhesive

Bond; 1-Part; Liquid; Polydimethylsiloxane; Moisture cure
One part, white, moisture cure, thermally conductive silicone adhesive. Is designed to provide efficient thermal transfer for the cooling of modules, including home appliance devices.
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.53; Thermally conductive

Package Sizes

330 ml Cartridge
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Thermal Conductivity (W/m°K)
Application Type
Material Form
Chemistry
Cure Method
Substrate
Primerless
Description
EP1200 Black
Resinlab
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1.04; High
Bond; Casting Resin; Potting
Liquid
Epoxy
Part A/Part B
Ceramic; Aluminum; Copper; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.
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Part A Black Quart Part A Black Gal Part A Black 3.6 Gal Pail Part B Black Quart Part B Black Gal Part B Black 3.6 Gal Pail Black 3 cc Pre-Mixed & Frozen Syringe Black 5 cc Manual Syringe Black 10 cc Manual Pre-Mixed & Frozen Syringe Black 15 g Twinpak Black 20 ml Dual Syringe Black 30 ml Cartridge Black 50 ml Cartridge Black 50 ml Cartridge w/ Cert Black 50 ml Tah Cartridge Black 150 x 150 ml Ratio Park Cartridge Black 200 ml Cartridge Black 300 x 300 ml Ratio Pak Cartridge Black 400 ml Cartridge Blue 400 ml Cartridge White 400 ml Cartridge Black 600 ml Cartridge Black 750 x 750 ml Cartridge Black 750 x 750 ml Ratio Pak Cartridge
Dowsil 1-4173 Thermally Conductive Adhesive
Dow
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1.80; Thermally Conductive
Bond
Liquid; Silicone elastomer
Aluminum Oxide; No added solvents; Polydimethylsiloxane; Silicone elastomer; Versatile
Heat cure
A variety of common substrates; Al; Ceramics; Filled plastic; Metals; Reactive materials; Wet most surfaces
Primerless adhesion
A one-part gray, flowable thermally conductive adhesive with high tensile strength.
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30cc EFD Syringe w/ Foil Bag 30 ml 1.5 kg Cartridge 1.5 kg Cartridge to Spec 10 kg Pail
Dowsil 1-4174 Thermally Conductive Adhesive
Dow
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1.78; Thermally Conductive
Bond
Liquid; Silicone elastomer
7 mil glass beads ; No added solvents; Silicone elastomer; Versatile
Heat cure
A variety of common substrates; Al; Ceramics; Filled plastics; Metals; Reactive materials
Primerless adhesion
One-part gray, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads
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30 ml 1.5 kg Cartridge 10 kg Pail
Loctite Ablestik CT 5047-2
Henkel
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2.00
Bond
Liquid (Comp. B); Paste (Comp. A)
Epoxy
Heat; Part A/Part B
Aluminum
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
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Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
Loctite Ablestik 64C
Henkel
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1.44
Bond
Liquid (Component B); Paste (Component A)
Epoxy
2-Part Cure; Heat; Room temperature cure
A low cost, two component, non-silver, electrically conductive epoxy adhesive.
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Part A 400 g Part B 20 g
Loctite 3875
Henkel
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1.75; 2.00; Thermally conductive
Bond
Liquid
Acrylic
2-Part Cure; Room Temperature Cure
Aluminum; Ceramic; Contaminated Mold Compound; Grit Blasted Steel; Mold Compound; NiCu Leadframe; NiCu Leadframe; Silicon
Two-component, Bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components.
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Part B 30 cc EFD Part A 30 cc EFD
Dowsil 3-6751 Thermally Conductive Adhesive
Dow
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1.00; High
Bond
Liquid
Silicone
2-Part Cure; Heat
A variety of common substrates; Al; Ceramics; Filled plastics; Metals; Reactive materials
Two-part gray, thermally conductive adhesive with low viscosity and flame resistance
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1 kg Kit 12 kg 12 kg Kit 54 kg
3-6752 Thermally ConDuctive Adhesive
Dow
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1.70
Bond
Liquid; Silicone elastomer
Polydimethylsiloxane; Silicone elastomer
Heat
Al
Primerless adhesion to common substrates
One-part; rapid heat cure and primerless adhesion to common substrates used in the electronics industry
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75 g 10 kg
3-1818 Thermally Conductive Adhesive
Dow
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1.70
Bond
Liquid; Silicone elastomer
Aluminum Oxide; Silicone elastomer
Heat
Al; Ceramic; Filled plastic; Metal ; Reactive Materials
One-part gray, thixotropic thermally conductive adhesive with good flame resistance.
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1.5 kg 10 kg Pail
Bergquist Liqui Bond TLB SA1000
Henkel
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1.00; High
Adhesive; TIM (Thermal Interface Material)
Liquid
Silicone
Heat cure
Thermally Conductive, One-Part, Liquid Silicone Adhesive
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TC-2810
3M
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0.80 to 1.40
Bond; Coating
Liquid
Epoxy
2-Part Cure
rigid parts
A thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion.
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37 ml Duo-Pak
SE 4486 CV Thermally ConDuctive Adhesive
Dow
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1.53; Thermally conductive
Bond
Liquid
Polydimethylsiloxane
Moisture cure; RTV-cure
One part, white, moisture cure, thermally conductive silicone adhesive. Is designed to provide efficient thermal transfer for the cooling of modules, including home appliance devices.
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330 ml Cartridge
3876
Henkel
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1.76
Bond
Liquid
Acrylate
2-Part Cure
Aluminum; Ceramic; Contaminated Mold Compound; Glass; Grit Blasted Steel; Mold Compound; NiCu Leadframe; NiCu Leadframe; Silicon
Self-shimming bead on bead thermally conductive adhesive, is a two-part filled acrylic thermally conductive adhesive designed for ease of use.
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Part B 30 cc Part A 30 cc
Loctite Ablestik XCE 3104XL
Henkel
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1.80
Bond; Coat; Encapsulate
Liquid
Epoxy
Heat cure
Copper; Lead; Nickel; Stainless Steel; Tin
● One component ● Thermosetting ● Controlled particle size ● Electrically conductive ●Pb-free alternative to solder ● Long stencil work life at high print speed ● Low temperature cure ● No post cure required ● Low CTE ● Intrinsically clean ●
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17 g/10 cc Syringe 35 g/10 cc Syringe .01 kg 3 cc Syringe 150 g/2 oz Jar
Product 3872
Henkel
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1.20
Bond; Instant Adhesives
Liquid
Acrylic; Acrylic Urethane; Acrylic Urethane
Heat; UV
Aluminum; Steel
A self-shimming, thermally conductive acrylic which cures to a low modulus thermoset adhesive.
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300 ml Cartridge
Loctite E-04
Henkel
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0.20 to 2.00
Bond
Liquid
Epoxy; Hardener
Part A/Part B
Acrylic; Aluminum; Epoxy-Coated Metal; Ferrite; Glass; Metals; Neoprene; Painted Metal; Plastics; Polycarbonate; PVC; Stainless Steel; Steel; Wood
A two-part, toughened epoxy adhesive that cures at room temperature. Resistant to a wide range of chemical and environmental conditions. Has excellent impact resistance and outstanding electrical insulation properties.
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200 ml Dual Cartridge
TSE3281G
Momentive
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1.68; Excellent; Thermally Conductive
Adhesive
Liquid
Silicone
Heat
Excellent adhesion to many substrates
Silicone adhesives are one component, medium viscosity, thermally conductive materials, which remain in an uncured state at room temperature and cure to an elastomer when heat is applied, Outstanding operating temperature performance.
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Loctite Ablestik 816H01
Henkel
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2.00; Thermally conductive
Bond
Liquid
8.12 (grams/l); Epoxy
2-Part Cure; Heat cure; Room Temperature Cure
Alumina; Glass; Many other materials; Metals; Other ceramics; Plastics; Sapphire; Silica
● Two components ● White Color ● Epoxy ● Thermally conductive ● Electrically Insulating ● Room Temperature or Heat Cure ● Thixotropic.
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Bergquist Liqui Bond TLB SA2000
Henkel
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2.00; HIgh
Adhesive; TIM (Thermal Interface Material)
Liquid
Silicone
Heat
Thermally Conductive, One-Part, Liquid Silicone Adhesive, Heat Cure
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50-3112
Epoxies Etc
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1.04; Thermally Conductive
Adhesive
Liquid
Epoxy
2-Part Cure
Al
A two component fast curing thermally conductive epoxy adhesive, Vibration and impact resistant.
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EP1289 Black
Resinlab
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1.20; Thermally conductive
Bonding
Liquid
Epoxy
2-Part Cure; Heat; Room Temperature Cure
Al-Al
A two part thermally conductive high strength epoxy adhesive designed for bonding battery assemblies. It also has good resistance to water, salt spray, inorganic acids and basis and most organic solvents.
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Loctite Ablestik 813J01 BIPAX
Henkel
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1.10; Excellent
Bond; Encapsulate
Liquid
Silicone
2-Part Cure; Heat Cure; Room Temperature Cure
Al to Al; Difficult substrates
• Silicone • Red • Room Temperature Cure • Heat Cure • Excellent thermal conductivity • Bonds well to difficult substrates • Low stress • Encapsulation • Transformers • Thermistors • Power supplies • Heat sinks
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AS1420
CHT
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1.38; Excellent
Bond; Encapsulant; Formed-in-place gaskets; Potting; Sealant
Liquid
Silicone; Solvent free
Addition cure; Heat cured; Neutral cure
Copper; Copper alloys; Many substrates
A one-part, heat cured, non-corrosive, neutral cure, silicone adhesive sealant and potting material, It is addition cure product which is solvent free, excellent thermal conductivity.
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310 ml Cartridge
Dowsil TC-2022
Dow
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1.70; Good
Bonding
Liquid
Aluminum Oxide; Polydimethylsiloxane
Heat
A variety of substrates; A very wide variety of plastic; Al; Bonding integrated circuit substrates; Ceramics; Many filled plastics; Metal surfaces; Reactive materials
• One-part gray • Thermally conductive adhesive • Bonding integrated circuit substrates • Adhering lids and housings • Heat sink attach, automated or manual dispensing
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