Browse below to source the right specialty material solution for your energy storage projects. Discover materials that help handle heat and current isolation with battery modules and packs, and that offer physical and chemical protection for sensitive assemblies in any environment. Review the data and test methods for the materials that adhere and protect the critical components in your power supply devices – devices that handle the important tasks of converting power and regulating voltage.
Choose from a variety of specialty materials for your power supply applications. Featured materials may be found that have excellent thermal stability, a wide operating temperature range, and reliable performance under harsh conditions – resistance to thermal shock, oxidation, moisture and chemicals.
| Industry | Application Type | 1 Part or 2 Part | High Temperature Resistance (°C) | Viscosity (cPs) | |
|---|---|---|---|---|---|
|
Master Control Module |
Conformal Coat |
1 Part |
200 |
Medium ,350 |
|
|
Power Supplies |
Bond ,Seal |
1 Part |
200 |
Non-flow |
|
|
Housing and Assembly |
Gap Filler ,Potting |
2 Part |
|
Flowable ,40,000 |
|
|
Power Supplies |
Bond ,Seal |
1 Part |
200 |
Non-flow |
|
|
Elastoplastic toughened coating |
Conformal Coat |
1 Part |
200 |
Medium ,950 |
|
|
Master Control Module ,UV Cured |
Conformal Coating |
1 Part |
130 |
120 |
Pre-treating anodes and cathodes with functional coatings allows for better conductivity at the cell level. Positive temperature coefficient (PTC) inks provide a self-regulating, thin, light solution to elevate cell temperature in freezing conditions. Both of these are particularly important in Lithium-Ion cells, to combat lithium plating and ensure top performance and increased battery life. A variety of structural adhesives are also available for cell construction, as well as low-pressure molding compounds for encasing cells and/or assemblies in a single unit.
| Substrate | Industry | Application Type | Chemistry | Viscosity (cPs) | |
|---|---|---|---|---|---|
|
Aluminum ,Copper |
Battery electrodes |
Conductive carbon coating |
Water based |
50 to 200 |
|
|
Aluminum |
Battery Cells |
Conductive carbon coating |
Thermosetting resin system ,Water based |
600 |
| Substrate | Industry | Application Method | Cure Time (min) | Cure Temperature (°C) | |
|---|---|---|---|---|---|
|
Copper laminated substrates ,Epoxy paper ,Glass epoxy ,Phenolic paper ,Plain substrates |
Battery Cells |
Screen printable |
30 min @ 150 to 160°C |
150 to 160°C |
|
|
Polyester ,Stainless steel |
Battery Cells |
High speed reel-to-reel ,Manual ,Semi-automatic |
15 min @ 120°C |
120°C |
|
|
Polyester film |
Battery Cells ,Housing and Assembly |
Screen printable |
15 min @ 93°C |
93°C |
|
|
Most common substrates ,PET substrates |
Self regulating heating elements |
Screen printable |
10 min @ 120°C |
120°C |
|
|
PET substrates |
Battery Cells ,Housing and Assembly |
Screen printable |
2.00 min @ 150°C ,15 min @ 120°C |
120°C ,150°C |
Materials for assembly including bonding and thread locking, as well as for environmental protection of the module and any circuitry components. Ruggedizing can be accomplished with specialty materials as well. Thermally conductive materials are included for helping with heat generated during charging and discharging. Dielectric materials can help insulate in high-voltage applications. Epoxy, urethane, silicone, polyamide and other chemistries are available depending on design and operation needs. Low-pressure molding is an option for entire assemblies or individual components.
Click below to view materials for each application
Low Pressure Molding Conformal Coating Thermal Interface Materials Structural Adhesive Electrically Conductive Adhesive or Solder Thread Locking Adhesive Electrically Conductive Adhesive
| Color | High Temperature Resistance (°C) | Shore A Hardness () | Softening Point (°C) | Industry | |
|---|---|---|---|---|---|
|
Black |
140 |
88 ,90 |
182 to 192 ,187 |
Housing and Assembly |
|
|
|
|
|
175 to 190 |
Housing and Assembly |
|
|
Amber |
|
|
197 to 204 |
Housing and Assembly |
|
|
Black |
125 |
92 |
170 to 180 |
Housing and Assembly ,Increased Hardness |
|
|
Amber |
High temperature ,140 |
88 ,90 |
182 to 192 |
Housing and Assembly |
|
|
Black |
140 |
|
190 |
Housing and Assembly |
| Viscosity (cPs) | High Temperature Resistance (°C) | Cure Time (min) | Color | Volume Resistivity (O) | |
|---|---|---|---|---|---|
|
Medium ,350 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
5.5 E15 (ohms/cm) |
|
|
Medium ,950 |
200 |
10 min @ 20 to 25°C ,4,320 min @ 25°C |
Clear ,Transparent |
5E+13 (ohms/cm) |
|
|
Low ,115 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
8.7 E14 (ohms/cm) |
|
|
120 |
130 |
Rapid ,<0.08 min ,3,000 min @ 25°C ,6,000 min @ 25°C |
Translucent yellow |
2.2e16 (ohms/cm) |
|
|
Medium ,1,050 |
200 |
10 min @ 25°C ,10 min @ 80°C ,10 min @ 60°C ,4,320 min @ 25°C |
Transparent |
1.9e14 (ohms/cm) |
|
|
38,000 |
150 |
|
Blue Transparent ,Clear |
1.48e15 (ohm-cm) |
| Color | Glass Transition Temp (Tg) (°C) | Dielectric Strength (V/mil) | Thermal Conductivity (W/m°K) | Chemistry | |
|---|---|---|---|---|---|
|
White |
|
Durable ,210 |
High ,0.67 |
Polydimethylsiloxane ,Silicone Paste ,Zinc Oxide |
|
|
Cream |
60 ,100 |
750 |
0.80 to 1.40 |
Epoxy |
|
|
Black |
110 to 120 |
650 (VAC/mil) |
Thermally conductive ,0.60 |
Aluminum |
| Thermal Conductivity (W/m°K) | Viscosity (cPs) | Dielectric Strength (V/mil) | Key Specifications - Old | Cure Time (min) | |
|---|---|---|---|---|---|
|
Thermally conductive ,0.90 |
|
Electrically isolating |
|
|
|
|
Thermally Conductive ,1.80 |
20 (Pa-s) |
400 |
|
10 min @ 100°C ,480 min @ 25°C |
|
|
Thermally Conductive ,>3.40 |
Flowable ,40,000 |
360 |
|
<5.00 min @ 125°C ,120 min @ 20 to 25°C RT |
|
|
High ,3.50 |
45 (Pa-s) ,Excellent wet-out for low stress interfaces on applications |
275 |
|
30 min @ 25°C ,1,440 min @ 25°C |
|
|
Thermally conductive ,1.50 |
200 (Pa-s) ,30 (Pa-s) ,Excellent wet-out for near zero interface stress ,High shear thinning characteristics |
275 |
|
10 min @ 25°C ,30 min @ 25°C ,300 min @ 25°C |
| Thermal Conductivity (W/m°K) | Modulus (psi) | Dielectric Strength (V/mil) | Key Specifications - Old | Application Type | |
|---|---|---|---|---|---|
|
Thermally conductive ,2.00 |
33 |
Electrically isolating |
|
Thermally Conductive Gap Filling Material |
|
|
Thermally conductive ,>3.40 |
2.2 (MPa) |
280 |
|
Gap Pad |
|
|
Thermally conductive |
110 (kPa) ,Low |
|
|
Gap filling material |
|
|
Thermally Conductive ,1.30 |
16 |
|
|
Gap Filler |
|
|
Thermally Conductive ,5.00 |
Low ,18 |
5000 (Vac) |
|
Gap filling material |
|
|
Thermally conductive ,1.00 |
60 |
|
|
Gap Filler |
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications - Old | High Temperature Resistance (°C) | Chemistry | |
|---|---|---|---|---|---|
|
Thermally conductive ,1.50 |
Electrically insulating ,High |
|
150 |
Polyimide |
|
|
Thermally conductive ,3.00 |
|
|
125 |
Aluminium |
|
|
Outstanding thermal performance ,1.60 |
Electrically Insulating ,Excellent Dielectric Performance |
|
|
Aluminum oxide |
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications - Old | Industry | Material Form | |
|---|---|---|---|---|---|
|
1.30 |
|
|
Control Module ,Housing and Assembly ,Master Control Module |
Die-cut parts ,Roll form ,Sheet form |
|
|
High thermal conductivity ,1.60 |
Electrical isolation |
|
Control Module ,Housing and Assembly ,Master Control Module |
Die-cut parts ,Roll Form ,Sheet Form |
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications - Old | Cure Time (min) | High Temperature Resistance (°C) | |
|---|---|---|---|---|---|
|
Thermal management ,2.00 |
275 |
|
60 min @ 85°C |
180 |
|
|
Thermally Conductive ,1.40 |
Exceptional ,High Durability |
|
6 min @ 160°C ,30 min @ 125°C |
180 |
|
|
Thermally Conductive ,0.80 |
Electrically isolating |
|
|
125 |
| Color | Viscosity (cPs) | Cure Time (min) | Fixture or Handling Strength Time (min) | Industry | |
|---|---|---|---|---|---|
|
|
Creamy gel ,Non-sag ,280,000 |
|
Fast ,9 to 10 |
Housing and Assembly |
|
|
Light Yellow |
Non-sag ,9,846 |
|
Fast ,18 to 20 |
Housing and Assembly |
| Chemistry | Industry | Electrical Conductivity (mhos/cm) | Application Type | Substrate | |
|---|---|---|---|---|---|
|
Acrylate |
Control Module ,Master Control Module |
Electrical Conductivity ,Electrically conductive |
Adhesive |
Noble metals |
|
|
Epoxy |
Control Module |
Excellent |
Bond |
2024 T3 Al Abraded ,Various metals |
|
|
Halogen free |
Control Module ,Master Control Module |
Electrical Conductivity |
Solder flux |
Bare copper ,Common plastics ,Immersion tin ,Nickel-gold |
|
|
Halogen-free ,Pb-free |
Control Module ,Master Control Module |
Electrically Conductive |
Soldering |
|
| Viscosity (cPs) | Cure Time (min) | Cure Temperature (°C) | Chemistry | 1 Part or 2 Part | |
|---|---|---|---|---|---|
|
Medium ,350 ,1,300 to 3,000 |
1,440 min @ 22°C ,10,080 min @ 22°C |
22°C |
Acrylic ,Dimethacrylate ester |
1 Part |
|
|
1,400 |
480 min @ 25°C |
25°C |
Solvent-free |
1 Part |
| Volume Resistivity (O) | Glass Transition Temp (Tg) (°C) | Modulus (psi) | Cure Temperature (°C) | Chemistry | |
|---|---|---|---|---|---|
|
0.00089 (ohms/cm) ,0.0014 (ohms/cm) ,0.003 (ohms/cm) |
17 ,34 |
50,000 ,65,000 |
20 to 25°C Room Temperature ,25°C ,60°C |
Epoxy |
|
|
0.0025 (ohm.cm) |
-30 |
650 (MPa) |
Low ,110°C ,130°C ,150°C |
Acrylate |
Issues around thermal management and dielectric strength become even more important in battery packs where multiple batteries are included. Here, thermally conductive pottants and encapsulants help manage and distribute heat evenly across the pack. Gap fillers can likewise provide good thermal conductivity and in some cases provide physical and vibration resistance, along with appropriate encapsulants. Epoxy, urethane, silicone, polyamide and other chemistries are available depending on design and operation needs. Materials for bonding and thread locking in assembly are also used, as well as gasketing and other sealant material to protect the pack from environmental factors and tampering.
Click below to view materials for each application
Solder Thermal Interface Material Electrically Conductive Adhesive Conformal Coating Sealant Low Pressure Molding Structural Adhesive Thread Locking Adhesive
| Industry | Application Type | 1 Part or 2 Part | Material Form | Substrate | |
|---|---|---|---|---|---|
|
Master Control Module |
Soldering - Cored wire |
1 Part |
Wire |
Brass ,Copper ,Nickel |
|
|
Master Control Module |
Solder wire - Cored |
1 Part |
Wire |
Brass ,Copper ,Nickel |
|
|
Control Module ,Master Control Module |
Soldering |
1 Part |
Paste |
|
| Color | Glass Transition Temp (Tg) (°C) | Dielectric Strength (V/mil) | Thermal Conductivity (W/m°K) | Chemistry | |
|---|---|---|---|---|---|
|
White |
|
Durable ,210 |
High ,0.67 |
Polydimethylsiloxane ,Silicone Paste ,Zinc Oxide |
|
|
Cream |
60 ,100 |
750 |
0.80 to 1.40 |
Epoxy |
|
|
Black |
110 to 120 |
650 (VAC/mil) |
Thermally conductive ,0.60 |
Aluminum |
| Thermal Conductivity (W/m°K) | Viscosity (cPs) | Dielectric Strength (V/mil) | Key Specifications - Old | Cure Time (min) | |
|---|---|---|---|---|---|
|
Thermally conductive ,0.90 |
|
Electrically isolating |
|
|
|
|
Thermally Conductive ,1.80 |
20 (Pa-s) |
400 |
|
10 min @ 100°C ,480 min @ 25°C |
|
|
Thermally Conductive ,>3.40 |
Flowable ,40,000 |
360 |
|
<5.00 min @ 125°C ,120 min @ 20 to 25°C RT |
|
|
Provides durable dielectric insulation ,Thermally Conductive ,2.50 ,2.60 |
217 (Pa.s) |
18 (kV/mm) |
|
10 min @ 80°C ,20 min @ 50°C ,120 min @ 25°C Room Temperature |
|
|
Provides durable dielectric insulation ,Thermally Conductive ,2.50 ,2.60 |
217 (Pa.s) |
18 (kV/mm) |
|
10 min @ 80°C ,20 min @ 50°C ,120 min @ 25°C Room Temperature |
|
|
High ,3.50 |
45 (Pa-s) ,Excellent wet-out for low stress interfaces on applications |
275 |
|
30 min @ 25°C ,1,440 min @ 25°C |
| Thermal Conductivity (W/m°K) | Modulus (psi) | Dielectric Strength (V/mil) | Key Specifications - Old | Application Type | |
|---|---|---|---|---|---|
|
Thermally conductive ,2.00 |
33 |
Electrically isolating |
|
Thermally Conductive Gap Filling Material |
|
|
Thermally conductive |
110 (kPa) ,Low |
|
|
Gap filling material |
|
|
Thermally Conductive ,1.30 |
16 |
|
|
Gap Filler |
|
|
Thermally Conductive ,5.00 |
Low ,18 |
5000 (Vac) |
|
Gap filling material |
|
|
Thermally conductive ,1.00 |
60 |
|
|
Gap Filler |
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications - Old | High Temperature Resistance (°C) | Chemistry | |
|---|---|---|---|---|---|
|
Thermally conductive ,1.50 |
Electrically insulating ,High |
|
150 |
Polyimide |
|
|
Thermally conductive ,3.00 |
|
|
125 |
Aluminium |
|
|
Outstanding thermal performance ,1.60 |
Electrically Insulating ,Excellent Dielectric Performance |
|
|
Aluminum oxide |
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications - Old | Industry | Material Form | |
|---|---|---|---|---|---|
|
1.30 |
|
|
Control Module ,Housing and Assembly ,Master Control Module |
Die-cut parts ,Roll form ,Sheet form |
|
|
High thermal conductivity ,1.60 |
Electrical isolation |
|
Control Module ,Housing and Assembly ,Master Control Module |
Die-cut parts ,Roll Form ,Sheet Form |
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications - Old | Cure Time (min) | High Temperature Resistance (°C) | |
|---|---|---|---|---|---|
|
Thermal management ,2.00 |
275 |
|
60 min @ 85°C |
180 |
|
|
Thermally Conductive ,1.40 |
Exceptional ,High Durability |
|
6 min @ 160°C ,30 min @ 125°C |
180 |
|
|
Thermally Conductive ,0.80 |
Electrically isolating |
|
|
125 |
| Volume Resistivity (O) | Glass Transition Temp (Tg) (°C) | Modulus (psi) | Cure Temperature (°C) | Chemistry | |
|---|---|---|---|---|---|
|
0.0025 (ohm.cm) |
-30 |
650 (MPa) |
Low ,110°C ,130°C ,150°C |
Acrylate |
| Viscosity (cPs) | High Temperature Resistance (°C) | Cure Time (min) | Color | Volume Resistivity (O) | |
|---|---|---|---|---|---|
|
Medium ,350 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
5.5 E15 (ohms/cm) |
|
|
Low ,115 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
8.7 E14 (ohms/cm) |
|
|
120 |
130 |
Rapid ,<0.08 min ,3,000 min @ 25°C ,6,000 min @ 25°C |
Translucent yellow |
2.2e16 (ohms/cm) |
|
|
Medium ,1,050 |
200 |
10 min @ 25°C ,10 min @ 80°C ,10 min @ 60°C ,4,320 min @ 25°C |
Transparent |
1.9e14 (ohms/cm) |
|
|
400 to 800 (LMS) |
|
60 (Seconds), 7 (days) @ 22°C ,0.33 to 0.67 min ,1.00 min ,4,320 min ,10,080 min @ 22°C |
Transparent amber ,Yellow |
1e14 (ohms/cm) |
|
|
250 |
135 |
0.17 min ,2,880 to 4,320 min @ 20 to 25°C |
Clear |
3.5e16 (ohm/cm) |
| Volume Resistivity (O) | Coefficient of Thermal Expansion (CTE) | Cure Temperature (°C) | Cure Time (min) | Color | |
|---|---|---|---|---|---|
|
2.24e15 (ohms/cm) |
1.78e-4 (in./ in/°F) |
20 to 25°C |
|
Dark gray-black |
|
|
2.0E +16 (ohm*cm) |
|
Lower temperature ,20 to 25°C |
Faster @ Lower temperature ,2,880 min @ 20 to 25°C |
Translucent ,White |
|
|
6.7e14 (ohms/cm) |
324e-6 (K-1) |
23°C |
0.50 min ,1.00 min ,1.00 min @ 23°C ,1.50 min |
Light yellow ,Translucent |
|
|
|
|
150°C |
4.00 min ,10 min @ 150°C ,60 min @ 150°C |
|
|
|
|
|
|
|
Translucent |
|
|
10e12 (Ohm-meter) |
|
Cure rate is greatly accelerated at elevated temperatures ,25 to 180°C ,25°C ,50°C ,85°C |
Fast and adaptable @ Cure rate is greatly accelerated at elevated temperatures ,15 min @ 85°C ,30 min @ 50°C ,60 min @ 50°C ,240 min @ 50°C ,720 min @ 50°C ,720 min @ 25°C ,1,440 min @ 25°C ,4,320 min @ 25°C ,10,080 min @ 25°C |
Black |
| Glass Transition Temp (Tg) (°C) | Density (g/cm³) | Shore A Hardness () | High Temperature Resistance (°C) | Industry | |
|---|---|---|---|---|---|
|
-50 ,-45 |
0.98 |
88 ,90 |
140 |
Housing and Assembly |
|
|
-50 |
~1 |
|
|
Housing and Assembly |
|
|
-30 |
~ 1 |
|
|
Housing and Assembly |
|
|
-35 |
0.98 |
92 |
125 |
Housing and Assembly ,Increased Hardness |
|
|
-45 |
0.98 |
88 ,90 |
High temperature ,140 |
Housing and Assembly |
| Color | Viscosity (cPs) | Cure Time (min) | Fixture or Handling Strength Time (min) | Industry | |
|---|---|---|---|---|---|
|
|
Creamy gel ,Non-sag ,280,000 |
|
Fast ,9 to 10 |
Housing and Assembly |
|
|
Light Yellow |
Non-sag ,9,846 |
|
Fast ,18 to 20 |
Housing and Assembly |
| Viscosity (cPs) | Cure Time (min) | Cure Temperature (°C) | Chemistry | 1 Part or 2 Part | |
|---|---|---|---|---|---|
|
Medium ,350 ,1,300 to 3,000 |
1,440 min @ 22°C ,10,080 min @ 22°C |
22°C |
Acrylic ,Dimethacrylate ester |
1 Part |
|
|
1,400 |
480 min @ 25°C |
25°C |
Solvent-free |
1 Part |
Whether you are building batteries or building systems, sourcing specialty materials for the design of your power cells is vital. Materials for packs, junctions boxes, and control systems (PCBs) are only useful if they help deal with the load during charging and discharging.
| Volume Resistivity (O) | Glass Transition Temp (Tg) (°C) | Coefficient of Thermal Expansion (CTE) | Modulus (psi) | Cure Temperature (°C) | |
|---|---|---|---|---|---|
|
1.61 E+15 (ohms/cm) |
|
325 (Linear (micron/m °C or ppm )) |
1,050 |
25°C ,100°C ,125°C ,150°C |
|
|
6.57e15 (ohms/cm) |
135 |
123 (ppm/°C) ,43 (ppm/°C) |
8,700 |
140 to 150°C |
|
|
|
Low ,2 |
217 (ppm/°C) ,57 (ppm/°C) |
Low ,67,589 |
Moderate temperatures ,130°C |
|
|
3.6 E16 (Ohm-Cm) |
|
79 ppm/°C |
2.2 (MPa) |
20 to 25°C Room temperature ,20 to 25°C RT ,125°C |
|
|
1e13 (ohm-cm) |
|
|
60 (MPa) |
|
|
|
1.6 x 10E12 (Ohm-Cm) |
|
|
|
20 to 25°C RT ,125°C |
| Color | Viscosity (cPs) | Cure Time (min) | High Temperature Resistance (°C) | Industry | |
|---|---|---|---|---|---|
|
Gray |
Non-flow |
2,880 min @ 20 to 25°C |
200 |
Power Supplies |
|
|
Clear |
Non-flow |
2,880 min @ 20 to 25°C |
200 |
Power Supplies |
|
|
Colorless |
Flowable ,3,500 |
10 min @ 150°C ,20 min @ 125°C ,35 min @ 100°C ,2,880 min @ 20 to 25°C |
200 |
Power Supplies |
|
|
Gray |
Non-flow |
1,440 min @ 20 to 25°C |
200 |
Power Supplies |
|
|
Black ,Dark Gray |
Flowable ,Low ,2,135 |
10 min @ 100°C ,15 min @ 85°C ,25 min @ 70°C ,1,440 min @ 25°C |
200 |
Housing and Assembly ,Power Supplies |
|
|
Blue ,Translucent |
Non-flow |
2,880 min @ 20 to 25°C |
200 |
Power Supplies |
| Volume Resistivity (O) | Shore A Hardness () | Tensile Strength (psi) | Coefficient of Thermal Expansion (CTE) | Cure Temperature (°C) | |
|---|---|---|---|---|---|
|
4.4E+14 (ohms/cm) |
46 |
High ,864 psi |
375 (Linear (micron/m °C or ppm )) |
Faster or lower ,20 to 25°C |
|
|
4.4E+14 (ohm-cm) |
51 |
High ,1,035 psi |
375 (Linear micron/m °C or ppm) |
Faster or lower ,20 to 25°C |
|
|
2.4E+15 (ohms/cm) |
35 |
125 psi |
250 (Linear (micron/m °C or ppm )) |
Faster or lower ,20 to 25°C |
|
|
2.5E+14 (ohms/cm) |
32 |
285 psi |
300 (Linear (micron/m °C or ppm )) |
20 to 25°C |
|
|
1.1E+15 (ohms/cm) |
37 |
395 psi |
|
20 to 25°C ,25°C |
|
|
1.6e15 (ohms/cm) |
36 |
325 psi |
|
Faster or lower ,20 to 25°C |
| Viscosity (cPs) | High Temperature Resistance (°C) | Cure Time (min) | Color | Volume Resistivity (O) | |
|---|---|---|---|---|---|
|
Medium ,350 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
5.5 E15 (ohms/cm) |
|
|
Medium ,950 |
200 |
10 min @ 20 to 25°C ,4,320 min @ 25°C |
Clear ,Transparent |
5E+13 (ohms/cm) |
|
|
Low ,115 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
8.7 E14 (ohms/cm) |
|
|
120 |
130 |
Rapid ,<0.08 min ,3,000 min @ 25°C ,6,000 min @ 25°C |
Translucent yellow |
2.2e16 (ohms/cm) |
|
|
Medium ,1,050 |
200 |
10 min @ 25°C ,10 min @ 80°C ,10 min @ 60°C ,4,320 min @ 25°C |
Transparent |
1.9e14 (ohms/cm) |
|
|
38,000 |
150 |
|
Blue Transparent ,Clear |
1.48e15 (ohm-cm) |
| Volume Resistivity (O) | Shore A Hardness () | Tensile Strength (psi) | Cure Time (min) | Viscosity (cPs) | |
|---|---|---|---|---|---|
|
5.5 E15 (ohms/cm) |
34 |
80 psi |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Medium ,350 |
|
|
4.4E+14 (ohms/cm) |
46 |
High ,864 psi |
2,880 min @ 20 to 25°C |
Non-flow |
|
|
2.9e14(ohms/cm) |
|
980 psi |
10 min @ 150°C ,20 min @ 125°C , |
