Browse below to source the right specialty material solution for your energy storage projects. Discover materials that help handle heat and current isolation with battery modules and packs, and that offer physical and chemical protection for sensitive assemblies in any environment. Review the data and test methods for the materials that adhere and protect the critical components in your power supply devices – devices that handle the important tasks of converting power and regulating voltage.
*See Terms of Use BelowChoose from a variety of specialty materials for your power supply applications. Featured materials may be found that have excellent thermal stability, a wide operating temperature range, and reliable performance under harsh conditions – resistance to thermal shock, oxidation, moisture and chemicals.
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| Industry | Application Type | 1 Part or 2 Part | High Temperature Resistance (°C) | Viscosity (cPs) | |
|---|---|---|---|---|---|
|
Power Supplies |
Bond ,Gaskets ,Seal |
1 Part |
200 |
Non-flow |
|
|
Power Supplies |
Bond ,Gaskets ,Seal |
1 Part |
200 |
Non-flow |
|
|
Power Supplies |
Adhesive ,Encapsulate ,Pot |
2 Part |
200 |
Flowable ,3,500 |
|
|
Housing and Assembly |
Gap Filler ,Potting |
2 Part |
|
Flowable ,40,000 |
|
|
Battery Systems |
Conformal Coat |
1 Part |
175 |
Moderate low ,150 |
|
|
Elastoplastic toughened coating |
Conformal Coat |
1 Part |
200 |
Medium ,950 |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
Pre-treating anodes and cathodes with functional coatings allows for better conductivity at the cell level. Positive temperature coefficient (PTC) inks provide a self-regulating, thin, light solution to elevate cell temperature in freezing conditions. Both of these are particularly important in Lithium-Ion cells, to combat lithium plating and ensure top performance and increased battery life. A variety of structural adhesives are also available for cell construction, as well as low-pressure molding compounds for encasing cells and/or assemblies in a single unit.
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| Thermal Conductivity (W/m°K) | Application Type | Industry | 1 Part or 2 Part | Material Form | |
|---|---|---|---|---|---|
|
Conductive |
Conductive carbon coating |
Battery Cells |
1 Part |
Liquid |
|
|
Conductive |
Conductive carbon coating |
Battery electrodes |
1 Part |
Liquid |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Substrate | Industry | Application Method | Cure Time (min) | Cure Temperature (°C) | |
|---|---|---|---|---|---|
|
Polyester film |
Battery Cells ,Housing and Assembly |
Screen printable |
15 min @ 93°C |
93°C |
|
|
Polyester ,Stainless steel |
Battery Cells |
High speed reel-to-reel ,Manual ,Semi-automatic |
15 min @ 120°C |
120°C |
|
|
Most common substrates ,PET substrates |
Self regulating heating elements |
Screen printable |
10 min @ 120°C |
120°C |
|
|
PET substrates |
Battery Cells ,Housing and Assembly |
Screen printable |
2.00 min @ 150°C ,15 min @ 120°C |
120°C ,150°C |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
Materials for assembly including bonding and thread locking, as well as for environmental protection of the module and any circuitry components. Ruggedizing can be accomplished with specialty materials as well. Thermally conductive materials are included for helping with heat generated during charging and discharging. Dielectric materials can help insulate in high-voltage applications. Epoxy, urethane, silicone, polyamide and other chemistries are available depending on design and operation needs. Low-pressure molding is an option for entire assemblies or individual components.
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Click below to view materials for each application
Low Pressure Molding Conformal Coating Thermal Interface Materials Structural Adhesive Electrically Conductive Adhesive or Solder Thread Locking Adhesive Electrically Conductive Adhesive
| Color | High Temperature Resistance (°C) | Shore A Hardness () | Softening Point (°C) | Industry | |
|---|---|---|---|---|---|
|
|
|
|
175 to 190 |
Housing and Assembly |
|
|
Amber |
|
|
197 to 204 |
Housing and Assembly |
|
|
Amber |
High temperature ,140 |
88 ,90 |
182 to 192 |
Housing and Assembly |
|
|
Black |
140 |
|
190 |
Housing and Assembly |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Viscosity (cPs) | High Temperature Resistance (°C) | Cure Time (min) | Color | Volume Resistivity (O) | |
|---|---|---|---|---|---|
|
Medium ,950 |
200 |
10 min @ 20 to 25°C ,4,320 min @ 25°C |
Clear ,Transparent |
5E+13 (ohms/cm) |
|
|
Medium ,350 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
5.5 E15 (ohms/cm) |
|
|
Moderate low ,150 |
175 |
Rapid @ 25°C ,0.02 min ,0.50 min ,15 min @ 150°C ,30 min @ 120°C ,60 min @ 110°C |
Clear flourescing liquid |
35.8e12 (ohm-cm) |
|
|
Medium ,1,050 |
200 |
10 min @ 25°C ,10 min @ 80°C ,10 min @ 60°C ,4,320 min @ 25°C |
Transparent |
1.9e14 (ohms/cm) |
|
|
120 |
130 |
Rapid ,<0.08 min ,3,000 min @ 25°C Room Temperature ,6,000 min @ 25°C Room Temperature |
Translucent yellow |
2.2e16 (ohm-cm) |
|
|
Medium ,2,300 |
150 |
0.75 min |
Clear ,Colorless Transparent ,Light Yellow |
1.48e15 (ohm-cm) |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Application Type | Industry | 1 Part or 2 Part | Material Form | |
|---|---|---|---|---|---|
|
0.80 to 1.40 |
Coating |
Housing and Assembly |
2 Part |
Liquid |
|
|
0.41 |
Coat |
Housing and Assembly |
2 Part |
Liquid |
|
|
Conductive |
Conductive carbon coating |
Battery Cells |
1 Part |
Liquid |
|
|
Conductive |
Conductive carbon coating |
Battery electrodes |
1 Part |
Liquid |
|
|
Thermally conductive ,0.60 |
Coating |
Control Module ,Housing and Assembly ,Master Control Module |
1 Part |
Heat Plate |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Viscosity (cPs) | Dielectric Strength (V/mil) | Key Specifications | Cure Time (min) | |
|---|---|---|---|---|---|
|
Thermally conductive ,3.00 |
|
0.13 |
U.L. 94, V-O |
|
|
|
Thermally conductive ,0.90 |
|
Electrically isolating |
U.L. 94, V-1 |
|
|
|
Thermally Conductive ,1.80 |
20,000 |
400 |
U.L. 94, V-O |
10 min @ 100°C ,480 min @ 25°C |
|
|
Thermally Conductive ,>3.40 |
Flowable ,40,000 |
360 |
|
<5.00 min @ 125°C ,120 min @ 20 to 25°C RT |
|
|
Thermally conductive ,1.50 |
200 (Pa·s) ,30 (Pa·s) ,Excellent wet-out for near zero interface stress ,High shear thinning characteristics |
275 |
U.L. 94, V-O |
10 min @ 100°C ,30 min @ 100°C ,300 min @ 25°C |
|
|
High ,3.50 |
45000 (mPa·s) ,Excellent wet-out for low stress interfaces on applications |
275 |
Flammability, UL 94, V-0 |
30 min @ 100°C ,1,440 min @ 25°C Room Temperature |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Modulus (psi) | Dielectric Strength (V/mil) | Key Specifications | Application Type | |
|---|---|---|---|---|---|
|
Thermally conductive ,2.00 |
33 |
Electrically isolating |
|
Thermally Conductive Gap Filling Material |
|
|
Thermally Conductive ,5.00 |
Low ,18 |
5000 (Vac) |
Flammability, UL 94, V-0 |
Gap Pad |
|
|
Thermally conductive ,3.00 |
Low |
0.13 |
U.L. 94, V-O |
Gap Pad |
|
|
Thermally Conductive ,1.30 |
16 |
|
|
Gap Filler |
|
|
Thermally conductive ,1.00 |
60 |
|
|
Gap Filler |
|
|
Thermally conductive ,>3.40 |
2.2 (MPa) |
280 |
RoHS Compliant ,V0 |
Gap Pad |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications | High Temperature Resistance (°C) | Chemistry | |
|---|---|---|---|---|---|
|
High ,3.00 |
|
U.L. 94, V-0 |
125 |
Aluminium |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications | Industry | Material Form | |
|---|---|---|---|---|---|
|
Thermally conductive ,1.30 |
6000 (VAC, min) |
U.L.94, VTM-O |
Control Module ,Housing and Assembly ,Master Control Module |
Die-cut parts ,Roll form ,Sheet form |
|
|
High thermal conductivity ,1.60 |
Electrical isolation |
U.L. 94, V-O |
Control Module ,Housing and Assembly ,Housing and Assembly, Housing and Assembly, Housing and Assembly ,Master Control Module |
Die-cut parts ,Roll Form ,Sheet Form |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications | Cure Time (min) | High Temperature Resistance (°C) | |
|---|---|---|---|---|---|
|
Thermal management ,2.00 |
275 |
UL 94 V-0 |
60 min @ 85°C |
180 |
|
|
Thermally Conductive ,0.80 |
Electrically isolating |
U.L. 94, V-O |
|
125 |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Color | Viscosity (cPs) | Cure Time (min) | Fixture or Handling Strength Time (min) | Industry | |
|---|---|---|---|---|---|
|
|
Creamy gel ,Non-sag ,280,000 |
|
Fast ,9 to 10 |
Housing and Assembly |
|
|
Light Yellow |
Non-sag ,9,846 |
1,440 min @ 22°C |
Fast ,18 to 20 |
Housing and Assembly |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Chemistry | Industry | Electrical Conductivity (mhos/cm) | Application Type | Substrate | |
|---|---|---|---|---|---|
|
Acrylate |
Control Module ,Master Control Module |
Electrical Conductivity ,Electrically conductive |
Adhesive |
Noble metals |
|
|
Epoxy |
Control Module |
Excellent |
Bond |
2024 T3 Al Abraded ,Various metals |
|
|
Halogen free |
Control Module ,Master Control Module |
Electrical Conductivity |
Solder flux |
Bare copper ,Common plastics ,Immersion tin ,Nickel-gold |
|
|
Halogen-free ,Pb-free |
Control Module ,Master Control Module |
Electrically Conductive |
Soldering |
CuNiZn ,ENIG ,Immersion Ag ,OSP-Cu |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Viscosity (cPs) | Cure Time (min) | Cure Temperature (°C) | Chemistry | 1 Part or 2 Part | |
|---|---|---|---|---|---|
|
1,400 |
480 min @ 25°C |
25°C |
Solvent-free |
1 Part |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Volume Resistivity (O) | Glass Transition Temp (Tg) (°C) | Modulus (psi) | Cure Temperature (°C) | Chemistry | |
|---|---|---|---|---|---|
|
0.00089 (ohms/cm) ,0.0014 (ohms/cm) ,0.003 (ohms/cm) |
17 ,34 |
50,000 ,65,000 |
20 to 25°C Room Temperature ,25°C ,60°C |
Epoxy |
|
|
0.0025 (ohm.cm) |
-30 |
650 (MPa) |
Low ,110°C ,130°C ,150°C |
Acrylate |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
Issues around thermal management and dielectric strength become even more important in battery packs where multiple batteries are included. Here, thermally conductive pottants and encapsulants help manage and distribute heat evenly across the pack. Gap fillers can likewise provide good thermal conductivity and in some cases provide physical and vibration resistance, along with appropriate encapsulants. Epoxy, urethane, silicone, polyamide and other chemistries are available depending on design and operation needs. Materials for bonding and thread locking in assembly are also used, as well as gasketing and other sealant material to protect the pack from environmental factors and tampering.
Expand Content
Click below to view materials for each application
Solder Thermal Interface Material Electrically Conductive Adhesive Conformal Coating Sealant Low Pressure Molding Structural Adhesive Thread Locking Adhesive
| Industry | Application Type | 1 Part or 2 Part | Material Form | Substrate | |
|---|---|---|---|---|---|
|
Control Module ,Master Control Module |
Soldering |
1 Part |
Paste |
CuNiZn ,ENIG ,Immersion Ag ,OSP-Cu |
|
|
Master Control Module |
Soldering - Cored wire |
1 Part |
Wire |
Brass ,Copper ,Nickel |
|
|
Master Control Module |
Solder wire - Cored |
1 Part |
Wire |
Brass ,Copper ,Nickel |
|
|
Control Module ,Master Control Module |
Solder flux |
1 Part |
Liquid |
Bare copper ,Common plastics ,Immersion tin ,Nickel-gold |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Application Type | Industry | 1 Part or 2 Part | Material Form | |
|---|---|---|---|---|---|
|
0.80 to 1.40 |
Coating |
Housing and Assembly |
2 Part |
Liquid |
|
|
0.41 |
Coat |
Housing and Assembly |
2 Part |
Liquid |
|
|
Conductive |
Conductive carbon coating |
Battery Cells |
1 Part |
Liquid |
|
|
Conductive |
Conductive carbon coating |
Battery electrodes |
1 Part |
Liquid |
|
|
Thermally conductive ,0.60 |
Coating |
Control Module ,Housing and Assembly ,Master Control Module |
1 Part |
Heat Plate |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Viscosity (cPs) | Dielectric Strength (V/mil) | Key Specifications | Cure Time (min) | |
|---|---|---|---|---|---|
|
Thermally conductive ,3.00 |
|
0.13 |
U.L. 94, V-O |
|
|
|
Thermally conductive ,0.90 |
|
Electrically isolating |
U.L. 94, V-1 |
|
|
|
Thermally Conductive ,1.80 |
20,000 |
400 |
U.L. 94, V-O |
10 min @ 100°C ,480 min @ 25°C |
|
|
Thermally Conductive ,>3.40 |
Flowable ,40,000 |
360 |
|
<5.00 min @ 125°C ,120 min @ 20 to 25°C RT |
|
|
Provides durable dielectric insulation ,Thermally Conductive ,2.50 ,2.60 |
217 (Pa.s) |
18 (kV/mm) |
UL 94 V-0 certification |
10 min @ 80°C ,20 min @ 50°C ,120 min @ 25°C Room Temperature |
|
|
Provides durable dielectric insulation ,Thermally Conductive ,2.50 ,2.60 |
217 (Pa.s) |
18 (kV/mm) |
|
10 min @ 80°C ,20 min @ 50°C ,120 min @ 25°C Room Temperature |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Modulus (psi) | Dielectric Strength (V/mil) | Key Specifications | Application Type | |
|---|---|---|---|---|---|
|
Thermally conductive ,2.00 |
33 |
Electrically isolating |
|
Thermally Conductive Gap Filling Material |
|
|
Thermally Conductive ,5.00 |
Low ,18 |
5000 (Vac) |
Flammability, UL 94, V-0 |
Gap Pad |
|
|
Thermally conductive ,3.00 |
Low |
0.13 |
U.L. 94, V-O |
Gap Pad |
|
|
Thermally Conductive ,1.30 |
16 |
|
|
Gap Filler |
|
|
Thermally conductive ,1.00 |
60 |
|
|
Gap Filler |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications | High Temperature Resistance (°C) | Chemistry | |
|---|---|---|---|---|---|
|
High ,3.00 |
|
U.L. 94, V-0 |
125 |
Aluminium |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications | Industry | Material Form | |
|---|---|---|---|---|---|
|
Thermally conductive ,1.30 |
6000 (VAC, min) |
U.L.94, VTM-O |
Control Module ,Housing and Assembly ,Master Control Module |
Die-cut parts ,Roll form ,Sheet form |
|
|
High thermal conductivity ,1.60 |
Electrical isolation |
U.L. 94, V-O |
Control Module ,Housing and Assembly ,Housing and Assembly, Housing and Assembly, Housing and Assembly ,Master Control Module |
Die-cut parts ,Roll Form ,Sheet Form |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Thermal Conductivity (W/m°K) | Dielectric Strength (V/mil) | Key Specifications | Cure Time (min) | High Temperature Resistance (°C) | |
|---|---|---|---|---|---|
|
Thermal management ,2.00 |
275 |
UL 94 V-0 |
60 min @ 85°C |
180 |
|
|
Thermally Conductive ,0.80 |
Electrically isolating |
U.L. 94, V-O |
|
125 |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Volume Resistivity (O) | Glass Transition Temp (Tg) (°C) | Modulus (psi) | Cure Temperature (°C) | Chemistry | |
|---|---|---|---|---|---|
|
0.0025 (ohm.cm) |
-30 |
650 (MPa) |
Low ,110°C ,130°C ,150°C |
Acrylate |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Viscosity (cPs) | High Temperature Resistance (°C) | Cure Time (min) | Color | Volume Resistivity (O) | |
|---|---|---|---|---|---|
|
Medium ,350 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
5.5 E15 (ohms/cm) |
|
|
Medium ,1,050 |
200 |
10 min @ 25°C ,10 min @ 80°C ,10 min @ 60°C ,4,320 min @ 25°C |
Transparent |
1.9e14 (ohms/cm) |
|
|
120 |
130 |
Rapid ,<0.08 min ,3,000 min @ 25°C Room Temperature ,6,000 min @ 25°C Room Temperature |
Translucent yellow |
2.2e16 (ohm-cm) |
|
|
Low ,115 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
8.7 E14 (ohms/cm) |
|
|
250 |
135 |
0.17 min ,2,880 to 4,320 min @ 20 to 25°C |
Clear |
3.5e16 (ohm/cm) |
|
|
400 to 800 |
|
0.33 to 0.67 min ,1.00 min ,4,320 min ,10,080 min @ 22°C |
Transparent amber ,Yellow |
1e14 (ohms/cm) |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Volume Resistivity (O) | Coefficient of Thermal Expansion (CTE) | Cure Temperature (°C) | Cure Time (min) | Color | |
|---|---|---|---|---|---|
|
2.24e15 (ohms/cm) |
1.78e-4 (in./ in/°F) |
20 to 25°C |
|
Dark gray-black |
|
|
|
|
|
|
Translucent |
|
|
10e12 (Ohm-meter) |
|
Cure rate is greatly accelerated at elevated temperatures ,25 to 180°C ,25°C ,50°C ,85°C |
Fast and adaptable @ Cure rate is greatly accelerated at elevated temperatures ,15 min @ 85°C ,30 min @ 50°C ,60 min @ 50°C ,240 min @ 50°C ,720 min @ 50°C ,720 min @ 25°C ,1,440 min @ 25°C ,4,320 min @ 25°C ,10,080 min @ 25°C |
Black |
|
|
|
|
150°C |
4.00 min ,10 min @ 150°C ,60 min @ 150°C |
|
|
|
6.7e14 (ohms/cm) |
324e-6 (K-1) |
23°C |
0.50 min ,1.00 min ,1.00 min @ 23°C ,1.50 min |
Light yellow ,Translucent |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Glass Transition Temp (Tg) (°C) | Density (g/cm³) | Shore A Hardness () | High Temperature Resistance (°C) | Industry | |
|---|---|---|---|---|---|
|
-50 |
~1 |
|
|
Housing and Assembly |
|
|
-30 |
~ 1 |
|
|
Housing and Assembly |
|
|
-45 |
0.980 |
88 ,90 |
High temperature ,140 |
Housing and Assembly |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Color | Viscosity (cPs) | Cure Time (min) | Fixture or Handling Strength Time (min) | Industry | |
|---|---|---|---|---|---|
|
|
Creamy gel ,Non-sag ,280,000 |
|
Fast ,9 to 10 |
Housing and Assembly |
|
|
Light Yellow |
Non-sag ,9,846 |
1,440 min @ 22°C |
Fast ,18 to 20 |
Housing and Assembly |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Viscosity (cPs) | Cure Time (min) | Cure Temperature (°C) | Chemistry | 1 Part or 2 Part | |
|---|---|---|---|---|---|
|
1,400 |
480 min @ 25°C |
25°C |
Solvent-free |
1 Part |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
Whether you are building batteries or building systems, sourcing specialty materials for the design of your power cells is vital. Materials for packs, junctions boxes, and control systems (PCBs) are only useful if they help deal with the load during charging and discharging.
Expand Content
| Volume Resistivity (O) | Glass Transition Temp (Tg) (°C) | Coefficient of Thermal Expansion (CTE) | Modulus (psi) | Cure Temperature (°C) | |
|---|---|---|---|---|---|
|
2.59E+10 (ohm-cm) |
31 |
126 (?m/m/°C) ,171 (?m/m/°C) |
900 |
110°C ,120°C ,150°C |
|
|
1.61 E+15 (ohms/cm) |
|
325 (Linear (micron/m °C or ppm )) |
1,050 |
25°C ,100°C ,125°C ,150°C |
|
|
1.80E+13 ohm-cm |
55 |
131 µm/m/°C ,230 µm/m/°C |
6,500 |
|
|
|
6.57e15 (ohms/cm) |
135 |
123 (ppm/°C) ,43 (ppm/°C) |
8,700 |
140 to 150°C |
|
|
9.70E+13 (ohm-cm) |
51 |
107 (µm/m/°C) ,192 (µm/m/°C) |
17,300 |
25°C |
|
|
|
Low ,2 |
217 (ppm/°C) ,57 (ppm/°C) |
Low ,67,589 |
Moderate temperatures ,130°C |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Color | Viscosity (cPs) | Cure Time (min) | High Temperature Resistance (°C) | Industry | |
|---|---|---|---|---|---|
|
Clear |
Non-flow |
2,880 min @ 20 to 25°C |
200 |
Power Supplies |
|
|
Gray |
Non-flow |
2,880 min @ 20 to 25°C |
200 |
Power Supplies |
|
|
Colorless |
Flowable ,3,500 |
10 min @ 150°C ,20 min @ 125°C ,35 min @ 100°C ,2,880 min @ 20 to 25°C |
200 |
Power Supplies |
|
|
Blue ,Translucent |
Non-flow |
2,880 min @ 20 to 25°C |
200 |
Power Supplies |
|
|
Transparent |
Flowable ,4,575 |
20 min @ 150°C ,30 min @ 125°C ,75 min @ 100°C ,20,160 min @ 25°C |
200 |
Power Supplies |
|
|
Translucent |
High ,66,700 |
15 min @ 125°C ,15 min @ 150°C ,25 min @ 100°C |
200 |
Power Supplies |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Volume Resistivity (O) | Shore A Hardness () | Tensile Strength (psi) | Coefficient of Thermal Expansion (CTE) | Cure Temperature (°C) | |
|---|---|---|---|---|---|
|
4.4E+14 (ohms/cm) |
46 |
High ,864 psi |
375 (Linear (micron/m °C or ppm )) |
Faster or lower ,20 to 25°C |
|
|
4.4E+14 (ohm-cm) |
51 |
High ,1,035 psi |
375 (Linear micron/m °C or ppm) |
Faster or lower ,20 to 25°C |
|
|
2.5E+14 (ohms/cm) |
32 |
285 psi |
300 (Linear (micron/m °C or ppm )) |
20 to 25°C |
|
|
2.4E+15 (ohms/cm) |
35 |
125 psi |
250 (Linear (micron/m °C or ppm )) |
Faster or lower ,20 to 25°C |
|
|
1.1E+15 (ohms/cm) |
37 |
395 psi |
|
20 to 25°C ,25°C |
|
|
|
32 |
2.5 (Mpa) |
|
20 to 25°C ,23°C |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Viscosity (cPs) | High Temperature Resistance (°C) | Cure Time (min) | Color | Volume Resistivity (O) | |
|---|---|---|---|---|---|
|
Medium ,950 |
200 |
10 min @ 20 to 25°C ,4,320 min @ 25°C |
Clear ,Transparent |
5E+13 (ohms/cm) |
|
|
Medium ,350 |
200 |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Light Straw ,Translucent |
5.5 E15 (ohms/cm) |
|
|
Moderate low ,150 |
175 |
Rapid @ 25°C ,0.02 min ,0.50 min ,15 min @ 150°C ,30 min @ 120°C ,60 min @ 110°C |
Clear flourescing liquid |
35.8e12 (ohm-cm) |
|
|
Medium ,1,050 |
200 |
10 min @ 25°C ,10 min @ 80°C ,10 min @ 60°C ,4,320 min @ 25°C |
Transparent |
1.9e14 (ohms/cm) |
|
|
120 |
130 |
Rapid ,<0.08 min ,3,000 min @ 25°C Room Temperature ,6,000 min @ 25°C Room Temperature |
Translucent yellow |
2.2e16 (ohm-cm) |
|
|
Medium ,2,300 |
150 |
0.75 min |
Clear ,Colorless Transparent ,Light Yellow |
1.48e15 (ohm-cm) |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Volume Resistivity (O) | Shore A Hardness () | Tensile Strength (psi) | Cure Time (min) | Viscosity (cPs) | |
|---|---|---|---|---|---|
|
2.9e14(ohms/cm) |
|
980 psi |
10 min @ 150°C ,20 min @ 125°C ,35 min @ 100°C ,2,880 min @ 20 to 25°C |
Flowable ,3,500 |
|
|
4.4E+14 (ohms/cm) |
46 |
High ,864 psi |
2,880 min @ 20 to 25°C |
Non-flow |
|
|
4.4E+14 (ohm-cm) |
51 |
High ,1,035 psi |
2,880 min @ 20 to 25°C |
Non-flow |
|
|
1.6 x 10E12 (Ohm-Cm) |
45 to 55 |
|
<5.00 min @ 125°C ,120 min @ 20 to 25°C RT |
Flowable ,40,000 |
|
|
5.5 E15 (ohms/cm) |
34 |
80 psi |
Fast ,2.00 min @ 60°C ,30 min @ 20 to 25°C |
Medium ,350 |
|
|
5E+13 (ohms/cm) |
80 |
|
10 min @ 20 to 25°C ,4,320 min @ 25°C |
Medium ,950 |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Shear Strength (psi) | Softening Point (°C) | Industry | Chemistry | Application Type | |
|---|---|---|---|---|---|
|
|
135 to 145 |
Multipurpose assembly |
Thermoplastic hot melt polyamide |
Adhesive |
|
|
|
197 to 204 |
Housing and Assembly |
Copolyamide resin |
Adhesive |
|
|
21,315 to 142,100 |
182 to 192 |
Housing and Assembly |
Hot melt |
Encapsulation ,Low Pressure Molding ,Molding compound thermoplastic |
|
|
|
175 to 190 |
Housing and Assembly |
Copolymer polyamide resin |
Low Pressure Molding applications ,Molding |
|
|
|
|
Assembly |
PUR |
Adhesive |
|
|
|
|
General assembly |
PUR |
Adhesive |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
| Key Specifications | Color | Viscosity (cPs) | Cure Time (min) | Industry | |
|---|---|---|---|---|---|
|
|
Black ,Off White |
65,000 |
30 min @ 100°C ,120 min @ 65°C ,360 to 720 min @ 20 to 25°C Room Temperature |
Housing and Assembly |
|
|
|
Silver |
318,500 ,560,000 |
60 min @ 60°C ,480 min @ 25°C ,1,440 min @ 25°C ,1,440 to 4,320 min @ 25°C |
Control Module |
|
|
|
Cream |
40,000 to 80,000 |
10 min @ 120°C ,30 min @ 90°C ,90 min @ 70°C ,270 min @ 50°C ,1,440 min @ 23°C |
Housing and Assembly |
|
|
|
Black |
80,000 ,100,000 |
Fast ,5.00 min @ 140 to 150°C |
Master Control Module |
|
|
Passes ResinLab testing with HB rating at both 3 mm and 0.25 mm thickness. Not UL Certified. |
Black |
34,000 |
960 to 1,440 min @ 20 to 25°C Room temperature ,>1,440 min @ 25°C Room Temperature ,2,880 to 4,320 min @ 25°C |
Bonding battery assemblies |
|
|
In full compliance with RoHS directives 2015/863/EU. ,Passes ASTM E595 Outgassing Testing |
Off White Opaque |
60,000 |
20 to 25 min @ 85°C ,30 to 35 min @ 80°C |
Battery Systems |
If you already know what you need or if you need assistance in determining the material for your application, ask our tech team.
Energy storage solutions are evolving rapidly. Through Gluespec’s custom database and technical expertise, we can help you drive discovery, innovation, and development of new production methods and technologies.
*This is a summary description only. No decision on usability should be made based solely on this summary info.
Gluespec makes no warranty or guarantee that the information on our Website, product data sheets, product descriptions, prices or other content is current, accurate, complete, reliable, suitable for a particular purpose or error-free. Consult the relevant manufacturer's website and product data sheet for more information.
Please test and evaluate materials carefully to ensure compliance with all specifications and requirements of your application.
We have no control over the conditions of use of materials, so (even if you use the Ask an ESR feature) it is solely up to you to independently determine the efficacy, suitability, performance and safety of the material for your application.
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