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Electrically Insulating Adhesive Films


TF I2701F

Bond; One Part; B-Staged Film; Unfilled Epoxy; Heat;
A high performance electrically isolating B-staged film adhesive specially formulated for bonding at lower temperatures.;
Manufacturer: Resin Designs
Dielectric Strength (V/mil): Electrically Isolating
Substrate: 101 Copper ; Aluminum

406

Bond; One Part; Film; Ethylene Acrylic Acid Copolymer; Pressure Sensitive;
A flexible, light colored, thermoplastic adhesive bonding film which exhibits good adhesion to a variety of substrates, especially metals.;
Manufacturer: 3M
Dielectric Strength (V/mil): 2,300
Substrate: ABS; Acrylic; Aluminum, Etched, Aluminum foil , Aluminum; Cold Rolled Steel; FR-4 PCB; Glass; Metal; Nylon 6,6; Polycarbonate; Polyester; Polypropylene; PVC; Stainless Steel; Thermoplastic; variety of substrates

AF-42

Bond; One Part; Thermoset film; Epoxy; Heat;
Unsupported, thermosetting film adhesives designed for the structural bonding of metals and glass.;
Manufacturer: 3M
Dielectric Strength (V/mil): 900
Substrate: Aluminum, Etched aluminum, Al (solvent wiped), Al (scour pad abraded), Al (sanded); Black E-coat; Borosilicate Glass; Copper; FR-4 (solvent wiped); Glass; LCP (solvent wiped); Metal; PEN Plastic; Phenolic Board; Polyester Film; Stainless Steel (solvent wiped); Steel, CRS (cold rolled steel), CRS (scour pad abraded, solvent wiped); Ultem® 1000

583

Bond; One Part; Film; nitrile phenolic; Pressure Sensitive;
A high strength, flexible, nitrile phenolic based thermoplastic bonding film.;
Manufacturer: 3M
Dielectric Strength (V/mil): 990; 3,000
Substrate: ABS (acrylonitrile-butadiene-styrene); Acrylic; Aluminum (solvent wiped), Aluminum (etched), Aluminum (sanded, solvent wiped), Aluminum (scour pad abraded, solvent wiped), Aluminum; CRS (Cold Rolled Steel); Denim Fabric; FR-4; Neoprene; Nitrile; PET (polyester film); Phenolic Board; Polyetherimide; Polypropylene; PVC (polyvinyl chloride); Soda Lime Glass; Stainless Steel; Thermoplastic; Ultem® 1000 (polyetherimide)

TF I2202F

Bond; One Part; B-Staged Film; Epoxy; Heat;
A high performance B-staged film adhesive that relatively high flow with good wetting properties, fairly high glass transition temperature and good adhesion to gold and high strength and good chemical, heat, and moisture resistance.;
Manufacturer: Resin Designs
Dielectric Strength (V/mil): Electrically Insulative
Substrate: Aluminum

TF T2321F

Adhesive; One Part; B-staged film; Epoxy; Heat;
A high performance, highly thermally conductive\electrically insulating, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, high glass transition temperature and good adhesion to various substrates. It also features good chemical, heat, and moisture resistance.;
Manufacturer: Resin Designs
Dielectric Strength (V/mil): Highly electrically insulating
Substrate: Aluminum; Various substrates

TF T2722F

Bond; One Part; B-Staged Film; Epoxy; Heat;
A high performance, electrically insulative, B-staged film adhesive. It features a relatively low coefficient of thermal expansion moderately high glass transition temperature and good adhesion to various substrates.;
Manufacturer: Resin Designs
Dielectric Strength (V/mil): Electrically insulative
Substrate: 101 Copper ; Aluminum

AF111

Bond; One Part; Film; Epoxy; Heat;
An epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic). ;
Manufacturer: 3M
Dielectric Strength (V/mil): 650
Substrate: Al (etched), Al (sanded, solvent wiped), Al (scour pad abraded, solvent wiped), Al (solvent wiped), Etched Aluminum; Black E-coat; Borosilicate Glass; CRS (scour pad abraded, solvent wiped); FR-4 (solvent wiped); LCP (solvent wiped); Metals; PEN Plastic; Phenolic Board; Polyester Film; Polyetherimide; Stainless Steel (solvent wiped), Stainless Steel; Ultem®1000

TF T2781F

Bond; One Part; Film; Epoxy; Heat;
A high performance, highly thermally conductive\electrically insulating, B-staged film adhesive that features a fast cure time, high thermal conductivity and good adhesion to various substrates and good chemical, heat, and moisture resistance.;
Manufacturer: Resin Designs
Dielectric Strength (V/mil): High
Substrate: 101 Copper ; 316 SS; Aluminum; FR4; Various substrates

TF F2591

Bond; One Part; Film; Epoxy; Heat;
An electrically isolating material that features, a V-0 flammability rating, good chemical, heat, and moisture resistance. ;
Manufacturer: Resin Designs
Dielectric Strength (V/mil): Electrically Isolating
Substrate: Aluminum

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Electrically Isolating

B-Staged Film

Bond

Unfilled Epoxy

Heat

101 Copper

;

Aluminum

Order Sample

2,300

Film

Bond

Ethylene Acrylic Acid Copolymer

Pressure Sensitive

ABS

;

Acrylic

;

Aluminum, Etched, Aluminum foil , Aluminum

;

Cold Rolled Steel

;

FR-4 PCB

;

Glass

;

Metal

;

Nylon 6,6

;

Polycarbonate

;

Polyester

;

Polypropylene

;

PVC

;

Stainless Steel

;

Thermoplastic

;

variety of substrates

Order Sample

900

Thermoset film

Bond

Epoxy

Heat

Aluminum, Etched aluminum, Al (solvent wiped), Al (scour pad abraded), Al (sanded)

;

Black E-coat

;

Borosilicate Glass

;

Copper

;

FR-4 (solvent wiped)

;

Glass

;

LCP (solvent wiped)

;

Metal

;

PEN Plastic

;

Phenolic Board

;

Polyester Film

;

Stainless Steel (solvent wiped)

;

Steel, CRS (cold rolled steel), CRS (scour pad abraded, solvent wiped)

;

Ultem® 1000

Order Sample

990

;

3,000

Film

Bond

nitrile phenolic

Pressure Sensitive

ABS (acrylonitrile-butadiene-styrene)

;

Acrylic

;

Aluminum (solvent wiped), Aluminum (etched), Aluminum (sanded, solvent wiped), Aluminum (scour pad abraded, solvent wiped), Aluminum

;

CRS (Cold Rolled Steel)

;

Denim Fabric

;

FR-4

;

Neoprene

;

Nitrile

;

PET (polyester film)

;

Phenolic Board

;

Polyetherimide

;

Polypropylene

;

PVC (polyvinyl chloride)

;

Soda Lime Glass

;

Stainless Steel

;

Thermoplastic

;

Ultem® 1000 (polyetherimide)

Order Sample

Electrically Insulative

B-Staged Film

Bond

Epoxy

Heat

Aluminum

Order Sample

Highly electrically insulating

B-staged film

Adhesive

Epoxy

Heat

Aluminum

;

Various substrates

Order Sample

Electrically insulative

B-Staged Film

Bond

Epoxy

Heat

101 Copper

;

Aluminum

Order Sample

650

Film

Bond

Epoxy

Heat

Al (etched), Al (sanded, solvent wiped), Al (scour pad abraded, solvent wiped), Al (solvent wiped), Etched Aluminum

;

Black E-coat

;

Borosilicate Glass

;

CRS (scour pad abraded, solvent wiped)

;

FR-4 (solvent wiped)

;

LCP (solvent wiped)

;

Metals

;

PEN Plastic

;

Phenolic Board

;

Polyester Film

;

Polyetherimide

;

Stainless Steel (solvent wiped), Stainless Steel

;

Ultem®1000

Order Sample

High

Film

Bond

Epoxy

Heat

101 Copper

;

316 SS

;

Aluminum

;

FR4

;

Various substrates

Order Sample

Electrically Isolating

Film

Bond

Epoxy

;

Flame Retardant

Heat

Aluminum

Order Sample
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