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Thermally Conductive Adhesive Films


TF T2321F

Adhesive; One Part; B-staged film; Epoxy; Heat;
A high performance, highly thermally conductive\electrically insulating, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, high glass transition temperature and good adhesion to various substrates. It also features good chemical, heat, and moisture resistance.;
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): Highly thermally conductive; 0.90
Dielectric Strength (V/mil): Highly electrically insulating
Substrate: Aluminum; Various substrates

AF-42

Bond; One Part; Thermoset film; Epoxy; Heat;
Unsupported, thermosetting film adhesives designed for the structural bonding of metals and glass.;
Manufacturer: 3M
Thermal Conductivity (W/m°K): 0.21
Dielectric Strength (V/mil): 900
Substrate: Aluminum, Etched aluminum, Al (solvent wiped), Al (scour pad abraded), Al (sanded); Black E-coat; Borosilicate Glass; Copper; FR-4 (solvent wiped); Glass; LCP (solvent wiped); Metal; PEN Plastic; Phenolic Board; Polyester Film; Stainless Steel (solvent wiped); Steel, CRS (cold rolled steel), CRS (scour pad abraded, solvent wiped); Ultem® 1000

TF T2781F

Bond; One Part; Film; Epoxy; Heat;
A high performance, highly thermally conductive\electrically insulating, B-staged film adhesive that features a fast cure time, high thermal conductivity and good adhesion to various substrates and good chemical, heat, and moisture resistance.;
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): High; 2.63
Dielectric Strength (V/mil): High
Substrate: 101 Copper ; 316 SS; Aluminum; FR4; Various substrates

TF T2222F

Bond; One Part; B-Staged Film; Epoxy; Heat;
A high performance, thermally conductive, B-staged film adhesive specially formulated for bonding to gold and other hard to bond substrates.;
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): Thermally Conductive; 0.75
Substrate: Aluminum; Nickel; Other hard to bond substrates

Loctite Ablestik 5025E

Bond; One Part; Film; Epoxy; Heat;
● Epoxy Film ● Heat cure ● Thin, uniform bondline control ● Provides RF/EMI shielding ● Electrically conductive in x, y, z axes ● Excellent electrical and thermal conductivity ● ;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): Excellent; 6.50
Electrical Conductivity (mhos/cm): Excellent
Substrate: Ag/Cu leadframe; Al

TF T2521F

Bond; One Part; Film; Epoxy; Heat;
A high performance, thermally conductive, B-Staged film adhesive that features a relatively low coefficient of thermal expansion, high glass transition temperature and good adhesion to various substrates and good chemical, heat, and moisture resistance.;
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): 0.45
Substrate: Aluminum; Ceramic; Copper; Glass; Nickel

TF T2232F

Bond; One Part; B-Staged Film; Epoxy; Heat;
A high performance, high strength, highly thermally conductive\electrically insulating, B-staged film adhesive that features a relatively low coefficient of thermal expansion, good adhesion to gold and high strength and good chemical, heat, and moisture resistance.;
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): High; 0.90
Dielectric Strength (V/mil): High
Substrate: Aluminum

Loctite Ablestik CF 3366

Bond; One Part; Film; Epoxy; Heat cure;
● One part ● High electrical conductivity ● High thermal conductivity ● Passes NASA outgassing ● Heat cure ● Copper, Brass, Kovar and Aluminum ● Epoxy Film ● Gray Tan ● High adhesion strength at elevated temperatures ;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): High
Electrical Conductivity (mhos/cm): High
Substrate: Aluminum; Ceramic circuits; Copper; Metal backplanes

TF T2122F

Bond; One Part; B-Staged Film; Epoxy; Heat;
A high performance thermally conductive B-staged film adhesive specially formulated for bonding to hard to bond substrates;
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): Thermally Conductive; 0.41
Substrate: 101 Copper ; 316 SS ; Aluminum; Hard to bond substrates

TF T2726F

Bond; One Part; B-staged Film; Epoxy; Heat;
A high performance, electrically insulative, B-staged film adhesive cast from 100% solids that features a relatively low coefficient of thermal expansion, fairly high glass transition temperature and good adhesion to various substrates and good chemical, heat, and moisture resistance.;
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): 0.31
Dielectric Strength (V/mil): Electrically Insulative
Substrate: Aluminum

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Highly thermally conductive

;

0.90

Highly electrically insulating

B-staged film

Adhesive

Epoxy

Heat

Aluminum

;

Various substrates

Order Sample

0.21

900

Thermoset film

Bond

Epoxy

Heat

Aluminum, Etched aluminum, Al (solvent wiped), Al (scour pad abraded), Al (sanded)

;

Black E-coat

;

Borosilicate Glass

;

Copper

;

FR-4 (solvent wiped)

;

Glass

;

LCP (solvent wiped)

;

Metal

;

PEN Plastic

;

Phenolic Board

;

Polyester Film

;

Stainless Steel (solvent wiped)

;

Steel, CRS (cold rolled steel), CRS (scour pad abraded, solvent wiped)

;

Ultem® 1000

Order Sample

High

;

2.63

High

Film

Bond

Epoxy

Heat

101 Copper

;

316 SS

;

Aluminum

;

FR4

;

Various substrates

Order Sample

Thermally Conductive

;

0.75

B-Staged Film

Bond

Epoxy

Heat

Aluminum

;

Nickel

;

Other hard to bond substrates

Order Sample

Excellent

;

6.50

Excellent

Film

Bond

Epoxy

Heat

Ag/Cu leadframe

;

Al

Order Sample

0.45

Film

Bond

Epoxy

Heat

Aluminum

;

Ceramic

;

Copper

;

Glass

;

Nickel

Order Sample

High

;

0.90

High

B-Staged Film

Bond

Epoxy

Heat

Aluminum

Order Sample

High

High

Film

Bond

Epoxy

Heat cure

Aluminum

;

Ceramic circuits

;

Copper

;

Metal backplanes

Order Sample

Thermally Conductive

;

0.41

B-Staged Film

Bond

Epoxy

Heat

101 Copper

;

316 SS

;

Aluminum

;

Hard to bond substrates

Order Sample

0.31

Electrically Insulative

B-staged Film

Bond

Epoxy

Heat

Aluminum

Order Sample
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