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Surface Mount Adhesives


Loctite 3609

Bond; One Part; Gel; Epoxy; Heat;
It is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.;
Manufacturer: Henkel
Industry: Bonding of surface mounted devices to printed circuit boards; Bonding of surface mounted devices to printed circuit boards; Mounted devices
Substrate: FR4 board; SMD components; Steel (grit blasted), Mild steel (grit blasted)

Loctite 3615

Bond; One Part; Gel; Epoxy; Heat;
Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is specially formulated to have excellent moisture resistance and high adhesion to SMT components encapsulated in low stress molding compounds.;
Manufacturer: Henkel
Industry: Surface mounted devices to printed circuit boards; Surface mounted devices to printed circuit boards
Substrate: FR4 board; SMD components; Steel (grit blasted), Mild steel (grit blasted)

Loctite 3627

Bond; One Part; Gel; Epoxy; Heat;
Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.;
Manufacturer: Henkel
Industry: Surface mount adhesive; Small parts bonding; SMD components to PCB; Stencil print applications; Surface mount adhesive
Substrate: FR4 board; SMD components; Steel (grit blasted), Mild steel (grit blasted)

Loctite 368

Bond; One Part; Gel; Epoxy; Heat;
A very fast heat curing, one-component, thixotropic adhesive for bonding surface mounted devices to circuit boards.;
Manufacturer: Henkel
Industry: Bonding surface mounted devices to circuit boards, Surface mount adhesive; Bonding electronic components to printed circuit boards (PCB).; Bonding surface mounted devices to circuit boards; Surface mount adhesive
Substrate: Aluminum; FR4 board; Steel (grit blasted)

Loctite 3619

Bond; One Part; Paste; Epoxy; Heat;
Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.;
Manufacturer: Henkel
Industry: Surface mounted devices; Printed circuits board (PCB), SMD components to PCB; Wave soldering
Substrate: Bare FR4 board; Steel (grit blasted), Mild steel (grit blasted)

Technomelt PA 682 (e)

Adhesive; One Part; Pellets; Polyamide; Hot melt;
Hot melt adhesive is designed for molding compound applications., Polyamide, Amber, Molding compound thermoplastic, Encapsulation, Operating Temperature -40 to 150 °C;
Manufacturer: Henkel
Industry: Delicate electronic surface mount components; Circuit boards; Connectors; Delicate electronic surface mount components; Electronics; Electronics modules; Grommets; Industrial sensors, Hall effect sensors, Automotive sensors, Industrial sensors; Most demanding high humidity applications; On the inside of an automobile tire; PCB protection; Strain Relief; Switches
Substrate: ABS; PA 6,6; PC; PE (crosslinked); PEI; PES; PUR; PVC; Steel; Thermoplastics

Loctite Ablestik XCE 3104XL

Bond; One Part; Liquid; Epoxy; Heat cure;
● One component ● Thermosetting ● Controlled particle size ● Electrically conductive ●Pb-free alternative to solder ● Long stencil work life at high print speed ● Low temperature cure ● No post cure required ● Low CTE ● Intrinsically clean ● ;
Manufacturer: Henkel
Industry: Surface mount device (SMD) interconnect formation; Metal mash screen; Metal mask stencil; Pitch stencil; Printed circuit boards (PCBs); Screen printing; Surface mount device (SMD) interconnect formation
Substrate: Copper; Lead; Nickel; Stainless Steel; Tin

Loctite 3611

Bond; One Part; Viscous gel; Epoxy; Heat cure;
Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines.;
Manufacturer: Henkel
Industry: Surface mount adhesive; Small parts bonding; SMD components to PCB
Substrate: FR4 board; Steel (grit blasted)

CircuitWorks 60 Minute Conductive Epoxy CW2460

Bond; Two Part; Liquid; Epoxy; Adhesive/Hardener;
A two part, silver epoxy used in prototype, repair and general solder-less conductive bonding applications.;
Manufacturer: Chemtronics (ITW)
Industry: Solderless Surface Mount Connections; Circuit Board Trace Repair; Conductive Bonds Between Heat Sensitive Components; Conductive Structural Adhesions; General solder-less conductive bonding applications; Printed circuit board; Prototype applications; Solderless Surface Mount Connections; Static Discharge and Grounding
Substrate: Dissimilar surfaces; Most materials

Technomelt PA 652

Bond; One Part; Pellets; Polyamide; Hot melt;
Moldable polyamide where excellent adhesion and cold temperature flexibility are important such as in an automotive exterior. Also used extensively in white goods.;
Manufacturer: Henkel
Industry: Delicate electronic surface mount components; Applications where excellent adhesion and cold temperature flexibility are demanded; Automotive exterior; Automotive sensors; Circuit boards; Connectors; Delicate electronic surface mount components; Electronic; Electronics modules; Grommets; Hall effect sensors, Automotive sensors, Industrial sensors; Industrial sensors; PCB protection; Strain Relief; Switches; White goods
Substrate: ABS; FR4; Fragile components; PA 6,6; PC; PE (crosslinked); PEI; PES; PUR; PVC; Steel; Thermoplastic

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Bonding of surface mounted devices to printed circuit boards

;

Bonding of surface mounted devices to printed circuit boards

;

Mounted devices

Bond

;

Mount

Epoxy

Heat

FR4 board

;

SMD components

;

Steel (grit blasted), Mild steel (grit blasted)

Order Sample

Surface mounted devices to printed circuit boards

;

Surface mounted devices to printed circuit boards

Bond

;

Mount

Epoxy

Heat

FR4 board

;

SMD components

;

Steel (grit blasted), Mild steel (grit blasted)

Order Sample

Surface mount adhesive

;

Small parts bonding

;

SMD components to PCB

;

Stencil print applications

;

Surface mount adhesive

Bond

Epoxy

Heat

FR4 board

;

SMD components

;

Steel (grit blasted), Mild steel (grit blasted)

Order Sample

Bonding surface mounted devices to circuit boards, Surface mount adhesive

;

Bonding electronic components to printed circuit boards (PCB).

;

Bonding surface mounted devices to circuit boards

;

Surface mount adhesive

Bond

Epoxy

Heat

Aluminum

;

FR4 board

;

Steel (grit blasted)

Order Sample

Surface mounted devices

;

Printed circuits board (PCB), SMD components to PCB

;

Wave soldering

Bond

Epoxy

Heat

Bare FR4 board

;

Steel (grit blasted), Mild steel (grit blasted)

Order Sample

Delicate electronic surface mount components

;

Circuit boards

;

Connectors

;

Delicate electronic surface mount components

;

Electronics

;

Electronics modules

;

Grommets

;

Industrial sensors, Hall effect sensors, Automotive sensors, Industrial sensors

;

Most demanding high humidity applications

;

On the inside of an automobile tire

;

PCB protection

;

Strain Relief

;

Switches

Adhesive

;

Encapsulation

;

Molding

Polyamide

Hot melt

ABS

;

PA 6,6

;

PC

;

PE (crosslinked)

;

PEI

;

PES

;

PUR

;

PVC

;

Steel

;

Thermoplastics

Order Sample

Surface mount device (SMD) interconnect formation

;

Metal mash screen

;

Metal mask stencil

;

Pitch stencil

;

Printed circuit boards (PCBs)

;

Screen printing

;

Surface mount device (SMD) interconnect formation

Bond

;

Coat

;

Encapsulate

Epoxy

Heat cure

Copper

;

Lead

;

Nickel

;

Stainless Steel

;

Tin

Order Sample

Surface mount adhesive

;

Small parts bonding

;

SMD components to PCB

Bond

;

Surface mount adhesive

Epoxy

Heat cure

FR4 board

;

Steel (grit blasted)

Order Sample

Solderless Surface Mount Connections

;

Circuit Board Trace Repair

;

Conductive Bonds Between Heat Sensitive Components

;

Conductive Structural Adhesions

;

General solder-less conductive bonding applications

;

Printed circuit board

;

Prototype applications

;

Solderless Surface Mount Connections

;

Static Discharge and Grounding

Bond

;

Repair

Epoxy

Adhesive/Hardener

;

Room temperature cure

Dissimilar surfaces

;

Most materials

Order Sample

Delicate electronic surface mount components

;

Applications where excellent adhesion and cold temperature flexibility are demanded

;

Automotive exterior

;

Automotive sensors

;

Circuit boards

;

Connectors

;

Delicate electronic surface mount components

;

Electronic

;

Electronics modules

;

Grommets

;

Hall effect sensors, Automotive sensors, Industrial sensors

;

Industrial sensors

;

PCB protection

;

Strain Relief

;

Switches

;

White goods

Bond

;

Encapsulation

;

Low pressure molding process requirements

;

Molding

Hot melt

;

Polyamide

Hot melt

ABS

;

FR4

;

Fragile components

;

PA 6,6

;

PC

;

PE (crosslinked)

;

PEI

;

PES

;

PUR

;

PVC

;

Steel

;

Thermoplastic

Order Sample
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