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Thermal Adhesives


EP1200 Black

Bond; Two Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;
Manufacturer: Resinlab
Thermal Conductivity (W/m°K): 1.04; High
Substrate: Ceramic; Aluminum; Copper; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood

Dowsil 1-4173 Thermally Conductive Adhesive

Bond; One Part; Liquid; Aluminum Oxide; Heat cure;
A one-part gray, flowable thermally conductive adhesive with high tensile strength.;
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.80; Thermally Conductive
Substrate: A variety of common substrates; Al; Ceramics; Filled plastic; Metals; Primerless adhesion; Reactive materials; Wet most surfaces

Loctite Ablestik 56C w/ Cat 11

Bond; Two Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure;
Two component, high temperature, general purpose. Adhesive - Electrically Conductive;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 3.00; Ultimate
Substrate: Aluminum; Ceramics; Glass; Metals; Plastics

Dowsil 1-4174 Thermally Conductive Adhesive

Bond; One Part; Liquid; 7 mil glass beads ; Heat cure;
One-part gray, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads ;
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.78; Thermally Conductive
Substrate: A variety of common substrates; Al; Ceramics; Filled plastics; Metals; Primerless adhesion; Reactive materials

EccoBond 285

Bond; Two Part; Thixotropic Paste; Epoxy; 2 Parts;
Highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive. Low coefficient of thermal expansion and good bond strength.;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.22; 1.44; 1.44
Substrate: Aluminum; Ceramics; Crystallization; Metals; Prone

Loctite Ablestik CT 5047-2

Bond; Two Part; Liquid (Comp. B); Epoxy; Heat;
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 2.00
Substrate: Aluminum

SEC1233

Bond; Two Part; Paste; Epoxy; Part A/Part B;
A silver filled, two component, room temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications.;
Manufacturer: Resinlab
Thermal Conductivity (W/m°K): 1.35; Very high
Substrate: 2024 T3 Al Abraded; Electrical contacts and components; Metals

SEC1222

Bond; Two Part; Paste; Epoxy; 2-Part Cure;
A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.;
Manufacturer: Resinlab
Thermal Conductivity (W/m°K): 1.60; 3.90; Very high
Substrate: 2024 T3 Al Abraded; Other common assembly materials; Various metals

Loctite Ablestik 64C

Bond; Two Part; Liquid (Component B); Epoxy; 2-Part Cure;
A low cost, two component, non-silver, electrically conductive epoxy adhesive.;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.44

Loctite Ablestik 286

Bond; Two Part; Paste; Epoxy; 2-Part Cure;
A two component, thermally conductive, room temperature curing, epoxy adhesive. The proper amount of thixotropy is built in to assure minimum flow without sacrificing wetting. ;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.04; Good
Substrate: Aluminum; Metals; Most metals; Most plastics; Plastics

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

1.04

;

High

Bond

;

Casting Resin

;

Potting

Epoxy

Part A/Part B

Ceramic

;

Aluminum

;

Copper

;

Fabric

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Order Sample

1.80

;

Thermally Conductive

Bond

Aluminum Oxide

;

No added solvents

;

Polydimethylsiloxane

;

Silicone elastomer

;

Versatile

Heat cure

A variety of common substrates

;

Al

;

Ceramics

;

Filled plastic

;

Metals

;

Primerless adhesion

;

Reactive materials

;

Wet most surfaces

Order Sample

3.00

;

Ultimate

Bond

Epoxy

2-Part Cure

;

Heat Cure

Aluminum

;

Ceramics

;

Glass

;

Metals

;

Plastics

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1.78

;

Thermally Conductive

Bond

7 mil glass beads

;

No added solvents

;

Silicone elastomer

;

Versatile

Heat cure

A variety of common substrates

;

Al

;

Ceramics

;

Filled plastics

;

Metals

;

Primerless adhesion

;

Reactive materials

Order Sample

1.22

;

1.44

;

1.44

Bond

Epoxy

2 Parts

Aluminum

;

Ceramics

;

Crystallization

;

Metals

;

Prone

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2.00

Bond

Epoxy

Heat

;

Part A/Part B

Aluminum

Order Sample

1.35

;

Very high

Bond

Epoxy

Part A/Part B

2024 T3 Al Abraded

;

Electrical contacts and components

;

Metals

Order Sample

1.60

;

3.90

;

Very high

Bond

Epoxy

2-Part Cure

2024 T3 Al Abraded

;

Other common assembly materials

;

Various metals

Order Sample

1.44

Bond

Epoxy

2-Part Cure

;

Heat

;

Room temperature cure

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1.04

;

Good

Bond

2-Part Cure

;

Heat

Aluminum

;

Metals

;

Most metals

;

Most plastics

;

Plastics

Order Sample
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