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Thermal Silicone Pottants and Encapsulants


ThermoSink 35-1

Potting; Two Part; Liquid; Silicone; 2-Part Cure;
A two-component, flowable, thermally conductive silicone elastomer that cures rapidly at room temperature. It is designed for electrical potting and/or thermal interfacial applications where high-performance thermal management is required.;
Manufacturer: Resin Designs
Thermal Conductivity (W/m°K): >3.40; Thermally Conductive
Viscosity (cPs): Flowable; 40,000

Loctite Stycast 5954

Encapsulate; Two Part; Liquid; Silicone; Heat;
● High thermal conductivity ● Reversion resistant ● Non-Corrosive ● High electrical insulation ● Easy mix ratio ● Heat Cure ● Encapsulant ;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.15; High
Viscosity (cPs): 35,000

Dowsil TC-4605 HLV Thermally Conductive Encapsulant

Encapsulant; Two Part; Liquid; Silicone rubber; Heat-cure;
A two-component silicone rubber material. It is designed especially for the use in the manufacture of PCB module and system components. It cures with heat to form elastic, thermal conductive and flame retardant rubber.;
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.00; Thermal management; Thermally Conductive
Viscosity (cPs): Flowable; Low; 1,900

TIA222G Thermally Conductive Silicone

Encapsulating; Two Part; Liquid; Silicone; Heat;
Momentive TIA222G Thermally Conductive Silicone is a 2 Part Heat Silicone Liquid used to Pot and Encapsulate ;
Manufacturer: Momentive
Thermal Conductivity (W/m°K): 2.20; Good Thermally Conductive
Viscosity (cPs): 20 (Pa.s)

Dowsil TC-6020 Thermally Conductive Encapsulant

Encapsulant; Two Part; Liquid; Silicone; 2-Part Cure;
Two-part, 1 to 1 gray silicone elastomer, heat and room temperature cure for manufacturing flexibility. Thermally conductive encapsulant/pottant for electronics.;
Manufacturer: Dow
Thermal Conductivity (W/m°K): 2.72; Thermally Conductive
Viscosity (cPs): Good flowability; 10,640

Dowsil TC-4605 Thermally Conductive Encapsulant

Encapsulant; Two Part; Liquid; Silicone rubber; Heat-cure;
A two component silicone rubber material. It is designed especially for the use in the manufacture of electrical and PCB system products and modules.;
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.00; Thermally Conductive
Viscosity (cPs): Low; Provides good flow ; Reduces the possibility of void and bubbles; 2,900

Cooltherm SC-320

Encapsulant; Two Part; Liquid; Polydimethyl siloxane polymer; 2-Part Cure;
A two-component system designed to provide excellent thermal conductivity for electrical/ electronic encapsulating applications, while retaining desirable properties associated with silicones.;
Manufacturer: Parker Lord
Thermal Conductivity (W/m°K): 3.20; Excellent
Viscosity (cPs): Low; 22,000

Loctite Ablestik 813J01 BIPAX

Encapsulate; Two Part; Liquid; Silicone; Heat Cure;
• Silicone • Red • Room Temperature Cure • Heat Cure • Excellent thermal conductivity • Bonds well to difficult substrates • Low stress • Encapsulation • Transformers • Thermistors • Power supplies • Heat sinks;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.10; Excellent
Viscosity (cPs): 40,000

RTVS 8127

Potting; Two Part; Liquid; Silicone; RTV;
A flame retardant, reversion resistant silicone compound. The low viscosity and high thermal conductivity makes the RTVS 8127 ideal for potting dense component packages requiring heat dissipation. ;
Manufacturer: Insulcast (ITW)
Thermal Conductivity (W/m°K): 8.99; Heat dissipation; High; 0.75
Viscosity (cPs): Low; 4,000

Cooltherm SC-420

Encapsulant; Two Part; Silicone; 2-Part Cure;
It is a two-component system designed to provide excellent thermal conductivity and flexibility for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.;
Manufacturer: Parker Lord
Thermal Conductivity (W/m°K): 3.20; Excellent
Viscosity (cPs): Low; 50,000

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

>3.40

;

Thermally Conductive

Silicone

Potting

;

Gap Filler

2-Part Cure

;

Heat

Flowable

;

40,000

Order Sample

1.15

;

High

Silicone

Encapsulate

;

Pot

Heat

;

Part A/Part B

35,000

Order Sample

1.00

;

Thermal management

;

Thermally Conductive

Silicone rubber

;

Flame retardant rubber

Encapsulant

;

Pottant

2-Part Cure

;

Heat-cure

;

Room temperature cure

Flowable

;

Low

;

1,900

Order Sample

2.20

;

Good Thermally Conductive

Silicone

;

Flame Retardant

Encapsulating

;

Potting

;

Gap filling

2-Part Cure

;

Heat

;

Room Temperature

20 (Pa.s)

Order Sample

2.72

;

Thermally Conductive

Silicone

Encapsulant

2-Part Cure

;

Heat

Good flowability

;

10,640

Order Sample

1.00

;

Thermally Conductive

Silicone rubber

;

Flame retardant

Encapsulant

;

Potting

2-Part Cure

;

Heat-cure

Low

;

Provides good flow

;

Reduces the possibility of void and bubbles

;

2,900

Order Sample

3.20

;

Excellent

Polydimethyl siloxane polymer

;

Excellent flame retardancy

Encapsulant

2-Part Cure

Low

;

22,000

Order Sample

1.10

;

Excellent

Silicone

Encapsulate

;

Bond

2-Part Cure

;

Heat Cure

;

Room Temperature Cure

40,000

Order Sample

8.99

;

Heat dissipation

;

High

;

0.75

Silicone

;

Flame Retardant

Potting

2-Part Cure

;

Room Temperature Cure

;

RTV

Low

;

4,000

Order Sample

3.20

;

Excellent

Silicone

Encapsulant

2-Part Cure

Low

;

50,000

Order Sample
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