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Thermal Gels


Loctite PE 3142 / PE 3165

Encapsulate; Two Part; Gel; Epoxy; Resin/Hardener;
With Hardener 3165™: This mixture forms a resilient, low exotherm, room temperature gel material that develops high Tg after exposure to elevated temperatures. High thermal conductivity.;
Manufacturer: Henkel
Thermal Conductivity (W/m°K): 1.13; High
Viscosity (cPs): 18,000

TIA216G

Potting; Two Part; Gel; Silicone; Heat;
Momentive TIA216G is a 2 Part Heat Silicone Gel used to Pot and Encapsulate Soft Rubber;
Manufacturer: Momentive
Thermal Conductivity (W/m°K): 1.60; Good
Viscosity (cPs): 7.8 (Pa s); Low

SE 4445 CV Thermally ConDuctive Gel

Encapsulate; Two Part; Gel; Silicone; Heat;
Two-part; thermally conductive gel; heat cure; moderate viscosity.;
Manufacturer: Dow
Thermal Conductivity (W/m°K): 1.26
Viscosity (cPs): Moderate; 14,000

TSE3051FR

Potting; One Part; Soft, Tacky gel; Silicone; Fast heat cure;
Momentive TSE3051FR is a 1 Part Fast heat cure Silicone Soft, Tacky gel used to Pot and Encapsulate ;
Manufacturer: Momentive
Thermal Conductivity (W/m°K): 0.17
Viscosity (cPs): 0.7 (Pa ·s); Low

20-1705

Potting and Encapsulant; Two Part; Gel; Silicone elastomeric; Resin/Activator ;
Epoxies Etc 20-1705 is a 2 Part Resin/Activator Silicone elastomeric Gel used to Pot and Encapsulate ;
Manufacturer: Epoxies Etc
Thermal Conductivity (W/m°K): 1.90

TSE3051

Potting; One Part; Gel; Silicone; Heat cure;
Momentive TSE3051 is a 1 Part Heat cure Silicone Gel used to Pot and Encapsulate Difficult-to-bond-to substrates;
Manufacturer: Momentive
Thermal Conductivity (W/m°K): 0.17
Viscosity (cPs): 0.7 (Pa•s); Low; Pours easily

20-1700

Potting and Encapsulant; Two Part; Gel; Silicone; Resin/Activator;
Epoxies Etc 20-1700 is a 2 Part Resin/Activator Silicone Gel used to Pot and Encapsulate ;
Manufacturer: Epoxies Etc
Thermal Conductivity (W/m°K): 1.90

TSE3070

Potting; Two Part; Gel; Silicone; Room temperature cure;
Momentive TSE3070 is a 2 Part Heat Silicone Gel used to Pot and Encapsulate ;
Manufacturer: Momentive
Thermal Conductivity (W/m°K): 0.17
Viscosity (cPs): Low

Silopren Gel 6209FC

Potting; Two Part; Gel; Silicone; 2-Part Cure;
Momentive Silopren Gel 6209FC is a 2 Part 2-Part Cure Silicone Gel used to Pot and Encapsulate Many substrates;
Manufacturer: Momentive
Thermal Conductivity (W/m°K): 0.17
Viscosity (cPs): Easily pourable; Low

Silopren Gel 6209

Potting ; Two Part; Gel; Silicone; Room Temperature Cure;
Momentive Silopren Gel 6209 is a 2 Part Heat Silicone Gel used to Pot and Encapsulate Many substrates;
Manufacturer: Momentive
Thermal Conductivity (W/m°K): 0.17
Viscosity (cPs): Easily pourable; Low

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Gel

1.13

;

High

Encapsulate

;

Pot

Epoxy

Resin/Hardener

18,000

Order Sample

Gel

1.60

;

Good

Potting

Silicone

Heat

;

Part A/Part B

7.8 (Pa s)

;

Low

Order Sample

Gel

1.26

Encapsulate

;

Pot

Silicone

2 Parts

;

Heat

Moderate

;

14,000

Order Sample

Soft, Tacky gel

0.17

Potting

Silicone

Fast heat cure

0.7 (Pa ·s)

;

Low

Order Sample

Gel

;

Silicone elastomeric

1.90

Potting and Encapsulant

Low Toxicity

;

Silicone elastomeric

;

Solvent-free

Resin/Activator

Order Sample

Gel

0.17

Potting

Silicone

Heat cure

0.7 (Pa•s)

;

Low

;

Pours easily

Order Sample

Gel

1.90

Potting and Encapsulant

Silicone

;

Solvent-free

Resin/Activator

Order Sample

Gel

0.17

Potting

Silicone

Curing agent

;

Heat

;

Room temperature cure

Low

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Gel

0.17

Potting

Silicone

;

Solvent free

2-Part Cure

Easily pourable

;

Low

Order Sample

Gel

0.17

Potting

Silicone

;

Solvent free

2-Part Cure

;

Heat

;

Room Temperature Cure

Easily pourable

;

Low

Order Sample
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