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Conapoxy AD-10
Staking; 1-Part; Paste; Epoxy; Elevated temperature cure;
A one-component, 100% solids, elevated temperature cure epoxy adhesive system and miniature electronic potting compound ideal for electrical applications.;
Manufacturer:
Elantas (Altana)
Chemical Resistance:
Resistant to many acids; Resistant to many bases
Loctite EA E-30CL
Staking; 2-Part; Liquid; Epoxy; Room temperature cure;
A low viscosity, industrial grade epoxy adhesive. Once mixed, the two component epoxy cures at room temperature with minimal shrinkage with excellent impact resistance.;
Manufacturer:
Henkel
Chemical Resistance:
95% RH; Acetone; Air; Condensing Humidity; Isopropanol; Motor oil; Resistant to a wide range of chemicals; Resistant to a wide range of solvents; Salt fog; Unleaded gasoline ; Water Resistance; Water/glycol 50/50 Resistance
EP1330 Black
Staking compound; 1-Part; Paste; Epoxy; Heat cure;
A one-part heat cure epoxy polymer system. A high-performance thixotropic polymer system for applications requiring high thermal conductivity, low shrinkage, low CTE and excellent adhesion to a wide variety of plastics, metals and circuit board materials.;
Manufacturer:
Resinlab
EP1325LV Black
Staking ; 1-Part; Paste; Epoxy; Heat Curing;
A one part, thixotropic, heat curing epoxy adhesive. It is a high-performance polymer system for applications requiring low shrinkage, and excellent adhesion to a wide variety of plastics, metals and circuit board materials. It provides very good environmental protection and dielectric properties over a wide temperature range.;
Manufacturer:
Resinlab
EP1330-SB5 Black
Staking compound; 1-Part; Paste; Epoxy; Heat cure;
A one-part heat cure epoxy polymer system used as a component staking compound, thermally conductive paste adhesive or a dam barrier in a “dam and fill” application when used in conjunction with EP1330LV.;
Manufacturer:
Resinlab
Conapoxy AD-10
Staking; 1-Part; Paste; Epoxy; Elevated temperature cure
A one-component, 100% solids, elevated temperature cure epoxy adhesive system and miniature electronic potting compound ideal for electrical applications.
Manufacturer: Elantas (Altana)
Chemical Resistance: Resistant to many acids; Resistant to many bases
Loctite EA E-30CL
Staking; 2-Part; Liquid; Epoxy; Room temperature cure
A low viscosity, industrial grade epoxy adhesive. Once mixed, the two component epoxy cures at room temperature with minimal shrinkage with excellent impact resistance.
Manufacturer: Henkel
Chemical Resistance: 95% RH; Acetone; Air; Condensing Humidity; Isopropanol; Motor oil; Resistant to a wide range of chemicals; Resistant to a wide range of solvents; Salt fog; Unleaded gasoline ; Water Resistance; Water/glycol 50/50 Resistance
EP1330 Black
Staking compound; 1-Part; Paste; Epoxy; Heat cure
A one-part heat cure epoxy polymer system. A high-performance thixotropic polymer system for applications requiring high thermal conductivity, low shrinkage, low CTE and excellent adhesion to a wide variety of plastics, metals and circuit board materials.
Manufacturer: Resinlab
EP1325LV Black
Staking ; 1-Part; Paste; Epoxy; Heat Curing
A one part, thixotropic, heat curing epoxy adhesive. It is a high-performance polymer system for applications requiring low shrinkage, and excellent adhesion to a wide variety of plastics, metals and circuit board materials. It provides very good environmental protection and dielectric properties over a wide temperature range.
Manufacturer: Resinlab
EP1330-SB5 Black
Staking compound; 1-Part; Paste; Epoxy; Heat cure
A one-part heat cure epoxy polymer system used as a component staking compound, thermally conductive paste adhesive or a dam barrier in a “dam and fill” application when used in conjunction with EP1330LV.
Manufacturer: Resinlab
Package Sizes
30CC Syringe
Application Type
Chemical Resistance
1 Part or 2 Part
Material Form
Description
Staking; Bond; Potting; Sealing
Resistant to many acids; Resistant to many bases
1-Part
Paste
A one-component, 100% solids, elevated temperature cure epoxy adhesive system and miniature electronic potting compound ideal for electrical applications.
Staking; Bonding; Laminating; Potting
95% RH; Acetone; Air; Condensing Humidity; Isopropanol; Motor oil; Resistant to a wide range of chemicals; Resistant to a wide range of solvents; Salt fog; Unleaded gasoline ; Water Resistance; Water/glycol 50/50 Resistance
2-Part
Liquid
A low viscosity, industrial grade epoxy adhesive. Once mixed, the two component epoxy cures at room temperature with minimal shrinkage with excellent impact resistance.
View Datasheet
Contact Rep
Contact Rep
Interested in Package Size:
Resin 5 Gal Pail Hardener 5 Gal Pail 50 ml Cartridge 200 ml Cartridge 400 ml Cartridge
Staking compound; Bond
1-Part
Paste
A one-part heat cure epoxy polymer system. A high-performance thixotropic polymer system for applications requiring high thermal conductivity, low shrinkage, low CTE and excellent adhesion to a wide variety of plastics, metals and circuit board materials.
Staking ; Bond; Small mass potting compound
1-Part
Paste
A one part, thixotropic, heat curing epoxy adhesive. It is a high-performance polymer system for applications requiring low shrinkage, and excellent adhesion to a wide variety of plastics, metals and circuit board materials. It provides very good environmental protection and dielectric properties over a wide temperature range.
Staking compound; Bond
1-Part
Paste
A one-part heat cure epoxy polymer system used as a component staking compound, thermally conductive paste adhesive or a dam barrier in a “dam and fill” application when used in conjunction with EP1330LV.
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