Plastic Metal CBC
Shimming ; 2-Part; Liquid; Epoxy resin; 2-Part Cure;
It is suitable for the shimming and backfilling of systems difficult to align in the industrial and maritime sector, a low viscosity, very flowable , self-levelling, vibration, shock and temperature resistant.
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Cooltherm SC-1200 Thermally Conductive Silicone Gap Filler
Gap Filler; 2-Part; Paste; Silicone; 2-Part Cure;
A two-component system designed to provide excellent thermal conductivity for electronic applications, low Stress, durable, environmentally resistant.;
Chem-Calk 600
Spacer shims; 1-Part; Paste; Acrylic; Pressure Sensitive;
One-component acrylic latex compound; non-sag; easy gunnability and tooling; mold and mildew resistance and outstanding flexibility.;
Loctite PC 7202
Chocking system; 2-Part; Liquid; Epoxy; Resin/Hardener;
A two-part epoxy chocking system. It is recommended for the installation of main engines and other equipment. Its high compressive strength withstands maximum loads.;
Cooltherm SC-1500 Thermally Conductive Silicone Gap Filler
Gap Filler; 2-Part; Paste; Silicone; 2-Part Cure;
A two-component system designed to provide excellent thermal conductivity for electronic applications, low Stress, durable.;
Fox-23 Flowable Oxide
Excellent gap fill; 1-Part; Liquid; Flowable Oxides; Carrier Solvent ;
State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses volatile methyl siloxane as a carrier solvent.;
TP-2160 Thermally ConDuctive Pad
Gap filler; 1-Part; Pad; Silicone; Pressure Sensitive;
Gap filler interface; foam-based thermal gel; one side tacky.;
TIA222G Thermally Conductive Silicone
Gap filling; 2-Part; Liquid; Silicone; Heat;
A two-component material used for encapsulating, gap filling, and as a thermal path to heat sinks. It quickly cures to a soft rubber gel with exposure to heat, and will also cure at room temperatures.;
Bergquist Gap Filler TGF 1000
Thermally Conductive Gap Filling Material; 2-Part; Liquid; Silicone; Elevated temperature cure;
A thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system.;
Bergquist Gap Pad TGP 1500
Thermally Conductive Gap Filling Material; 1-Part; Pad; Silicone; Pressure-Sensitive;
A thermally conductive, un-reinforced gap filling material. Ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.;