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TP-1560 Thermally Conductive Pad

Gap Pad; 1 Part; Pad; Silicone; Low Pressures;
Thin thermal interface; fiberglass reinforced; one side tacky.;

TP-1562 Thermal Pad

Gap Pad; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

TP-2200HP Thermal Pad

Thin; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

TP-2260HP Thermal Pad

Thin; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

TP-2860 Thermal Pad

Gap Pad; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

TP-3500 Thermal Pad

Thin; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

TP-3500-SOFT Thermal Pad

Thin; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

TP-3560-SOFT Thermal Pad

Gap Pad; 1 Part; Gel; Silicone; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

Bergquist Gap Pad TGP 1000VOUS

Gap Pad; 1 Part; Pad; Silicone; Pressure Sensitive;
Ultra Conformable, Thermally Conductive Material for Filling Air Gaps .Electrically isolating, Puncture, Shear and Tear resistant.;

Bergquist Gap Pad TGP HC5000

Gap Pad; 1 Part; Pad; Silicone; None;
Highly Conformable, Thermally Conductive, Low Modulus Material. A soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The enhanced material is ideal for applications requiring low stress on components and boards during assembly;
Manufacturer: Henkel
Substrate: Bulk Rubber; Fiberglass

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