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Technomelt PA 682 (e)
Low Pressure Molding; 1-Part; Pellets; Polyamide; Hot melt;
Hot melt adhesive is designed for molding compound applications., Polyamide, Amber, Molding compound thermoplastic, Encapsulation, Operating Temperature -40 to 150 °C;
Manufacturer:
Henkel
Chemical Resistance:
Solvent resistance
Technomelt PA 638 Black
Low Pressure Molding; 1-Part; Pellet; Polyamide; Hotmelt;
A one-component, used for molding applications.;
Manufacturer:
Henkel
Elemelt PA515
Low Pressure Molding applications; 1-Part; Pellets; Copolymer polyamide resin; Hot Melt;
Pure copolymer polyamide hot melt resin, non reactive and solvent free, specially designed for Low Pressure Molding applications.;
Manufacturer:
Elemelt
Technomelt PA 652
Low pressure molding process requirements; 1-Part; Pellets; Polyamide; Hot melt;
Moldable polyamide where excellent adhesion and cold temperature flexibility are important such as in an automotive exterior. Also used extensively in white goods.;
Manufacturer:
Henkel
Chemical Resistance:
Solvent resistance
Technomelt PA 678 Black
Low Pressure Molding; 1-Part; Pellet; Polyamide; Physical setting;
Moldable polyamide with good adhesion for higher temperature applications such as in an automotive under-hood.;
Manufacturer:
Henkel
Elemelt PA513
Low Pressure Molding applications; 1-Part; Pellets; Copolymer polyamide resin; Hot Melt;
Pure copolymer polyamide hot melt resin, non reactive and solvent free, specially designed for Low Pressure Molding applications.;
Manufacturer:
Elemelt
Technomelt PA 633 (e)
Low Pressure Molding; 1-Part; Pellets; Thermoplastic polyamide; Hot Melt;
● Molding compound thermoplastic ● Encapsulation ● Easy moldability ● Good adhesion to a variety of substrates ● Excellent moisture resistance ● Excellent environmental resistance ● Simplified process flow;
Manufacturer:
Henkel
Technomelt TC 50
Low pressure molding; 1-Part; Pellets; Polyamide; Physical setting;
High performance, filled thermoplastic polyamide is formulated for use as a protective encapsulant for heat
generating devices requiring thermal management.;
Manufacturer:
Henkel
Elemelt PA512
Low Pressure Molding applications; 1-Part; Pellets; Copolymer polyamide resin; Hot Melt;
Pure copolymer polyamide hot melt resin.;
Manufacturer:
Elemelt
Technomelt PA 673 (e)
Low Pressure Molding; 1-Part; Pellets; Hot melt; Hot melt;
Moldable polyamide with good adhesion for higher temperature applications such as in an automotive under-hood.;
Manufacturer:
Henkel
Chemical Resistance:
Solvent resistance
Technomelt PA 682 (e)
Low Pressure Molding; 1-Part; Pellets; Polyamide; Hot melt
Hot melt adhesive is designed for molding compound applications., Polyamide, Amber, Molding compound thermoplastic, Encapsulation, Operating Temperature -40 to 150 °C
Manufacturer: Henkel
Chemical Resistance: Solvent resistance
Technomelt PA 638 Black
Low Pressure Molding; 1-Part; Pellet; Polyamide; Hotmelt
A one-component, used for molding applications.
Manufacturer: Henkel
Package Sizes
44 lb Bag
Elemelt PA515
Low Pressure Molding applications; 1-Part; Pellets; Copolymer polyamide resin; Hot Melt
Pure copolymer polyamide hot melt resin, non reactive and solvent free, specially designed for Low Pressure Molding applications.
Manufacturer: Elemelt
Package Sizes
20 Kg bag
Technomelt PA 652
Low pressure molding process requirements; 1-Part; Pellets; Polyamide; Hot melt
Moldable polyamide where excellent adhesion and cold temperature flexibility are important such as in an automotive exterior. Also used extensively in white goods.
Manufacturer: Henkel
Chemical Resistance: Solvent resistance
Technomelt PA 678 Black
Low Pressure Molding; 1-Part; Pellet; Polyamide; Physical setting
Moldable polyamide with good adhesion for higher temperature applications such as in an automotive under-hood.
Manufacturer: Henkel
Package Sizes
Black 44 lb
Elemelt PA513
Low Pressure Molding applications; 1-Part; Pellets; Copolymer polyamide resin; Hot Melt
Pure copolymer polyamide hot melt resin, non reactive and solvent free, specially designed for Low Pressure Molding applications.
Manufacturer: Elemelt
Package Sizes
20 Kg bag
Technomelt PA 633 (e)
Low Pressure Molding; 1-Part; Pellets; Thermoplastic polyamide; Hot Melt
● Molding compound thermoplastic ● Encapsulation ● Easy moldability ● Good adhesion to a variety of substrates ● Excellent moisture resistance ● Excellent environmental resistance ● Simplified process flow
Manufacturer: Henkel
Package Sizes
44 lb
Technomelt TC 50
Low pressure molding; 1-Part; Pellets; Polyamide; Physical setting
High performance, filled thermoplastic polyamide is formulated for use as a protective encapsulant for heat
generating devices requiring thermal management.
Manufacturer: Henkel
Elemelt PA512
Low Pressure Molding applications; 1-Part; Pellets; Copolymer polyamide resin; Hot Melt
Pure copolymer polyamide hot melt resin.
Manufacturer: Elemelt
Package Sizes
20 Kg bag
Application Type
Chemical Resistance
1 Part or 2 Part
Material Form
Description
Low Pressure Molding; Adhesive; Encapsulation; Molding
Solvent resistance
1-Part
Pellets
Hot melt adhesive is designed for molding compound applications., Polyamide, Amber, Molding compound thermoplastic, Encapsulation, Operating Temperature -40 to 150 °C
Low Pressure Molding; Encapsulation; Molding
1-Part
Pellet
A one-component, used for molding applications.
Low Pressure Molding applications; Molding
1-Part
Pellets
Pure copolymer polyamide hot melt resin, non reactive and solvent free, specially designed for Low Pressure Molding applications.
Low pressure molding process requirements; Bond; Encapsulation; Molding
Solvent resistance
1-Part
Pellets
Moldable polyamide where excellent adhesion and cold temperature flexibility are important such as in an automotive exterior. Also used extensively in white goods.
Low Pressure Molding; Encapsulation
1-Part
Pellet
Moldable polyamide with good adhesion for higher temperature applications such as in an automotive under-hood.
Low Pressure Molding applications; Molding
1-Part
Pellets
Pure copolymer polyamide hot melt resin, non reactive and solvent free, specially designed for Low Pressure Molding applications.
Low Pressure Molding; Easy moldability; Encapsulation
1-Part
Pellets
● Molding compound thermoplastic ● Encapsulation ● Easy moldability ● Good adhesion to a variety of substrates ● Excellent moisture resistance ● Excellent environmental resistance ● Simplified process flow
Low pressure molding; Low Pressure Molding; Encapsulant
1-Part
Pellets
High performance, filled thermoplastic polyamide is formulated for use as a protective encapsulant for heat
generating devices requiring thermal management.
Low Pressure Molding applications; Molding
1-Part
Pellets
Pure copolymer polyamide hot melt resin.
Low Pressure Molding; Encapsulation; Molding compound thermoplastic
Solvent resistance
1-Part
Pellets
Moldable polyamide with good adhesion for higher temperature applications such as in an automotive under-hood.
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