Hi-Flow 625
Film-reinforced phase change material; 1-Part; Pen Film; Aluminium oxide; Pressure Sensitive;
A film-reinforced phase change material and compound coated on PEN film.;
Hi-Flow 565UT
Phase Change Material; 1-Part; Tabulated Pad Form; Aluminium; Pressure Sensitive;
It is a naturally tacky, thermally conductive phase change material which is supplied in an easy to use tabulated pad form.;
Hi-Flow 565U
Non-Reinforced, Pressure Sensitive; 1-Part; Kiss-cut parts – no holes; Aluminium; Pressure Sensitive;
It is a thermally conductive, phase change temperature which is applied in tabulated in pad form. It is attached to the target surface via pressure from a hard rubber roller or squeegee.;
Hi-Flow 225UT
Un-reinforced phase change thermal interface material; 1-Part; Roll Form; Graphite; Pressure Sensitive;
A pressure sensitive thermal interface material for use between a high performance processor and a heat sink.;
Hi-Flow 225U
Un-reinforced phase change thermal interface material; 1-Part; Roll form; Graphite; Pressure Sensitive;
It is designed for use as a thermal interface material between a computer processor and a heat sink.;
Loctite EIF 1000
Phase Change Material; 1-Part; Pad; Dry compound coated onto a Kapton™ MT substrate; None;
Electrically isolating phase change thermal interface material is suitable for use between a heat sink and variety heat generating components.;
Hi-Flow 225FT
Phase Change Material; 1-Part; Kiss-cut parts; Aluminium; Pressure Sensitive;
It provides a low thermal resistance path between hot components such as high performance processors and heat sinks.;
Loctite TCP 4000 PM
Phase Change Material; 1-Part; Liquid; Heat;
A reworkable and repeatable phase change material suitable for use between heat generating devices.;
Bergquist Hi Flow THF 900
Phase change material; 1-Part; Die-cut parts; Low volatility – less than 1%; Pressure Sensitive;
A phase change material coated on both sides of an aluminum substrate. It is a Thermal management, Thermally conductive adhesive.;
Bergquist Hi Flow THF 1500P
Thermally Conductive Phase Change Material; 1-Part; Polyimide Film; Polyimide Reinforcement; Pressure Sensitive;
Electrically insulating thermally conductive phase change material, reinforced with a polyimide film. The polyimide film provides a high dielectric strength and high cut through resistance.;