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Pottant / Encapsulant Grid


Sylgard 184 Silicone Elastomer

Pot ; Two Part; Liquid; Silicone; Base/Curing Agent;
Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.;
Manufacturer: Dow
Viscosity (cPs): Flowable; 3,500

UR3010

Encapsulate; Two Part; Liquid; Polyurethane; 2-Part Cure;
A two component, room temperature curing polyurethane potting system. It is designed to cure completely at room temperature. ;
Manufacturer: Resinlab
Viscosity (cPs): Low; 615

Dowsil 3140 RTV Coating

Encapsulant; One Part; Liquid; Polydimethylsiloxane; RTV;
One-part, translucent adhesive or coating with good flowability, good flame resistance, UL, IPC and Mil spec tested.;
Manufacturer: Dow
Viscosity (cPs): Good flowability; High; Self-leveling; Smooth; 34,400

ThermoSink 35-1

Potting; Two Part; Liquid; Silicone; Room temperature;
A two-component, flowable, thermally conductive silicone elastomer, water resistant, room temperature cure.;
Manufacturer: Resin Designs
Viscosity (cPs): Flowable; 40,000

2 Ton Epoxy

Pot; Two Part; Liquid; Epoxy; 2-Part Cure;
Extremely strong, water-resistant epoxy adhesive that forms a powerful bond with ferrous and non-ferrous metals, ceramics wood, concrete, or glass in any combination. Self-levels after application.;
Manufacturer: Devcon (ITW)
Viscosity (cPs): Self-level; 8,000

Loctite SI 5240

Potting; One Part; Liquid; Silicone; Moisture cure;
A flowable sealant with the benefit of deep light cure capability, ultraviolet and visible, combined with a secondary neutral moisture cure mechanism for shadow curing.;
Manufacturer: Henkel
Viscosity (cPs): Flowable; 15,000 to 35,000

EP1200 Black

Potting; Two Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;
Manufacturer: Resinlab
Viscosity (cPs): Medium; 30,000; 39,000

Dowsil 3-4207 Dielectric Tough Gel

Encapsulant; Two Part; Gel (Post-cure); Silicone; Part A/Part B;
Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.;
Manufacturer: Dow
Viscosity (cPs): Low

Loctite Stycast 5954

Encapsulate; Two Part; Liquid; Silicone; Heat;
● High thermal conductivity ● Reversion resistant ● Non-Corrosive ● High electrical insulation ● Easy mix ratio ● Heat Cure ● Encapsulant ;
Manufacturer: Henkel
Viscosity (cPs): 35,000

EP1121 Black

Encapsulate; Two Part; Liquid; Epoxy; Part A/Part B;
It is a two-part, unfilled epoxy encapsulant designed for medium to large sized castings. It cures completely at room temperature to a tough, flexible yet soft polymer. ;
Manufacturer: Resinlab
Viscosity (cPs): Low; 2,900; 4,500

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Encapsulate

;

Pot

;

Adhesive

Silicone

;

Silicone elastomer

;

Solvent-free

Base/Curing Agent

;

Heat

;

Room Temperature Cure

Flowable

;

3,500

Order Sample

Encapsulate

;

Potting

MOCA

;

Polyurethane

;

TDI

2-Part Cure

;

Heat

Low

;

615

Order Sample

Encapsulant

;

Adhesive

;

Coating

;

Sealing

Polydimethylsiloxane

;

Silicone elastomer

;

Solvent-free

Heat (optional)

;

Moisture Cure

;

Pressure sensitive

;

Room temperature cure

;

RTV

Good flowability

;

High

;

Self-leveling

;

Smooth

;

34,400

Order Sample

Potting

Silicone

2-Part Cure

;

Room temperature

Flowable

;

40,000

Order Sample

Pot

;

Bond

Epoxy

2-Part Cure

;

Room temperature cure

Self-level

;

8,000

Order Sample

Potting

;

Bonding

;

Coating

;

Instant Adhesives

;

Sealant

Alkoxy silicone

;

Silicone

Moisture cure

;

UV/visible

Flowable

;

15,000 to 35,000

Order Sample

Potting

;

Bond

;

Casting Resin

Epoxy

Part A/Part B

Medium

;

30,000

;

39,000

Order Sample

Encapsulant

;

Pottant

;

Sealant

Silicone

;

Solvent-free

Part A/Part B

Low

Order Sample

Encapsulate

;

Pot

Silicone

Heat

;

Part A/Part B

35,000

Order Sample

Encapsulate

Epoxy

Part A/Part B

Low

;

2,900

;

4,500

Order Sample
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