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Pottant / Encapsulant Grid


EP1200 Black

Potting; Two Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;
Manufacturer: Resinlab
Viscosity (cPs): Medium; 30,000; 39,000
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Sylgard 184 Silicone Elastomer

Pot ; Two Part; Liquid; Silicone; Base/Curing Agent;
Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.;
Manufacturer: Dow
Viscosity (cPs): Flowable; 3,500
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UR3010

Encapsulate; Two Part; Liquid; Polyurethane; 2-Part Cure;
A two component, room temperature curing polyurethane potting system. It is designed to cure completely at room temperature. ;
Manufacturer: Resinlab
Viscosity (cPs): Low; 615
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EP965

Mass Potting; Two Part; Liquid; Epoxy; Part A/Part B;
Medium viscosity, fast gel, mass potting, unfilled.;
Manufacturer: Resinlab
Viscosity (cPs): Free flowing; 11,000
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EP1282 Black

Encapsulate; Two Part; Liquid; Epoxy; 2-Part Cure;
A two part unfilled epoxy encapsulant designed for medium sized castings, a tough, semi-rigid polymer, a good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release, very good resistance, high elongation.;
Manufacturer: Resinlab
Viscosity (cPs): Good wetting; 3,000
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EP965LVLX

Encapsulate; Two Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer.;
Manufacturer: Resinlab
Viscosity (cPs): Free flowing; 2,500
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ThermoSink 35-1

Potting; Two Part; Liquid; Silicone; 2-Part Cure;
A two-component, flowable, thermally conductive silicone elastomer that cures rapidly at room temperature. It is designed for electrical potting and/or thermal interfacial applications where high-performance thermal management is required.;
Manufacturer: Resin Designs
Viscosity (cPs): Flowable; 40,000
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EP1121 Black

Encapsulate; Two Part; Liquid; Epoxy; Part A/Part B;
It is a two-part, unfilled epoxy encapsulant designed for medium to large sized castings. It cures completely at room temperature to a tough, flexible yet soft polymer. ;
Manufacturer: Resinlab
Viscosity (cPs): Low; 2,900; 4,500
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EP965SC7

Encapsulate; Two Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled electronic grade epoxy encapsulant, room temperature to a tough, semi-rigid polymer, Good wetting and adhesion, Good resistnace to water, acids and bases and most organic solvents.;
Manufacturer: Resinlab
Viscosity (cPs): Free flowing; 8,000
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Dowsil 3-4207 Dielectric Tough Gel

Encapsulant; Two Part; Gel (Post-cure); Silicone; Part A/Part B;
Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.;
Manufacturer: Dow
Viscosity (cPs): Low
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Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.
EP1200 Black

Potting

;

Bond

;

Casting Resin

Epoxy

Part A/Part B

Medium

;

30,000

;

39,000

 Order Sample
Sylgard 184 Silicone Elastomer

Encapsulate

;

Pot

;

Adhesive

Silicone

;

Silicone elastomer

;

Solvent-free

Base/Curing Agent

;

Heat

;

Room Temperature Cure

Flowable

;

3,500

 Order Sample
UR3010

Encapsulate

;

Potting

MOCA

;

Polyurethane

;

TDI

2-Part Cure

;

Heat

Low

;

615

 Order Sample
EP965

Encapsulate

;

Mass Potting

;

Casting

Epoxy

Part A/Part B

Free flowing

;

11,000

 Order Sample
EP1282 Black

Encapsulate

Epoxy

2-Part Cure

Good wetting

;

3,000

 Order Sample
EP965LVLX

Encapsulate

;

Medium Sized Castings

Epoxy

Part A/Part B

Free flowing

;

2,500

 Order Sample
ThermoSink 35-1

Potting

;

Gap Filler

Silicone

2-Part Cure

;

Heat

Flowable

;

40,000

 Order Sample
EP1121 Black

Encapsulate

Epoxy

Part A/Part B

Low

;

2,900

;

4,500

 Order Sample
EP965SC7

Encapsulate

;

Medium Sized Castings

Epoxy

Part A/Part B

Free flowing

;

8,000

 Order Sample
Dowsil 3-4207 Dielectric Tough Gel

Encapsulant

;

Pottant

;

Sealant

Silicone

;

Solvent-free

Part A/Part B

Low

 Order Sample
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