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Key Specs
Pottant / Encapsulant
Manufacturer
Industry
Chemistry
Substrate
More Filters

Sylgard 184 Silicone Elastomer

Pot ; Two Part; Liquid; Silicone; Base/Curing Agent;
Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.;

UR3010

Encapsulate; Two Part; Liquid; Polyurethane; 2-Part Cure;
A two component, room temperature curing polyurethane potting system. It is designed to cure completely at room temperature. ;

Dowsil 3140 RTV Coating

Encapsulant; One Part; Liquid; Polydimethylsiloxane; RTV;
One-part, translucent adhesive or coating with good flowability, good flame resistance, UL, IPC and Mil spec tested.;

ThermoSink 35-1

Potting; Two Part; Liquid; Silicone; Room temperature;
A two-component, flowable, thermally conductive silicone elastomer, water resistant, room temperature cure.;

2 Ton Epoxy

Pot; Two Part; Liquid; Epoxy; 2-Part Cure;
Extremely strong, water-resistant epoxy adhesive that forms a powerful bond with ferrous and non-ferrous metals, ceramics wood, concrete, or glass in any combination. Self-levels after application.;

EP1200 Black

Potting; Two Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;

Dowsil 3-4207 Dielectric Tough Gel

Encapsulant; Two Part; Gel (Post-cure); Silicone; Part A/Part B;
Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.;

Loctite Stycast 5954

Encapsulate; Two Part; Liquid; Silicone; Heat;
● High thermal conductivity ● Reversion resistant ● Non-Corrosive ● High electrical insulation ● Easy mix ratio ● Heat Cure ● Encapsulant ;

EP1121 Black

Encapsulate; Two Part; Liquid; Epoxy; Part A/Part B;
It is a two-part, unfilled epoxy encapsulant designed for medium to large sized castings. It cures completely at room temperature to a tough, flexible yet soft polymer. ;

EP1282 Black

Encapsulate; Two Part; Liquid; Epoxy; 2-Part Cure;
A two part unfilled epoxy encapsulant designed for medium sized castings, a tough, semi-rigid polymer, a good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release, very good resistance, high elongation.;

Sylgard 184 Silicone Elastomer

Pot ; Two Part; Liquid; Silicone; Base/Curing Agent
Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.

Dowsil 3140 RTV Coating

Encapsulant; One Part; Liquid; Polydimethylsiloxane; RTV
One-part, translucent adhesive or coating with good flowability, good flame resistance, UL, IPC and Mil spec tested.

ThermoSink 35-1

Potting; Two Part; Liquid; Silicone; Room temperature
A two-component, flowable, thermally conductive silicone elastomer, water resistant, room temperature cure.
Manufacturer: Resin Designs

Package Sizes

25KG plastic pails

2 Ton Epoxy

Pot; Two Part; Liquid; Epoxy; 2-Part Cure
Extremely strong, water-resistant epoxy adhesive that forms a powerful bond with ferrous and non-ferrous metals, ceramics wood, concrete, or glass in any combination. Self-levels after application.

Dowsil 3-4207 Dielectric Tough Gel

Encapsulant; Two Part; Gel (Post-cure); Silicone; Part A/Part B
Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

Loctite Stycast 5954

Encapsulate; Two Part; Liquid; Silicone; Heat
● High thermal conductivity ● Reversion resistant ● Non-Corrosive ● High electrical insulation ● Easy mix ratio ● Heat Cure ● Encapsulant
Application Type
Chemistry
Tape Backing
Cure Method
Description
Sylgard 184 Silicone Elastomer
Dow
Encapsulate ; Pot ; Adhesive
Silicone; Silicone elastomer; Solvent-free
Base/Curing Agent; Heat; Room Temperature Cure
Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.
Dowsil 3140 RTV Coating
Dow
Encapsulant; Adhesive; Coating; Sealing
Polydimethylsiloxane; Silicone elastomer; Solvent-free
Heat (optional); Moisture Cure; Pressure sensitive; Room temperature cure; RTV
One-part, translucent adhesive or coating with good flowability, good flame resistance, UL, IPC and Mil spec tested.
ThermoSink 35-1
Resin Designs
Potting
Silicone
2-Part Cure; Room temperature
A two-component, flowable, thermally conductive silicone elastomer, water resistant, room temperature cure.
View Datasheet

Interested in Package Size:

25KG plastic pails
2 Ton Epoxy
Devcon (ITW)
Pot; Bond
Epoxy
2-Part Cure; Room temperature cure
Extremely strong, water-resistant epoxy adhesive that forms a powerful bond with ferrous and non-ferrous metals, ceramics wood, concrete, or glass in any combination. Self-levels after application.
Dowsil 3-4207 Dielectric Tough Gel
Dow
Encapsulant; Pottant; Sealant
Silicone; Solvent-free
Part A/Part B
Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.
Loctite Stycast 5954
Henkel
Encapsulate; Pot
Silicone
Heat; Part A/Part B
● High thermal conductivity ● Reversion resistant ● Non-Corrosive ● High electrical insulation ● Easy mix ratio ● Heat Cure ● Encapsulant
Manufacturer | Material
Application Type Chemistry Tape Backing Cure Method
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Encapsulate

;

Pot

;

Adhesive

Silicone

;

Silicone elastomer

;

Solvent-free

Base/Curing Agent

;

Heat

;

Room Temperature Cure

Order Sample

Encapsulate

;

Potting

MOCA

;

Polyurethane

;

TDI

2-Part Cure

;

Heat

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Encapsulant

;

Adhesive

;

Coating

;

Sealing

Polydimethylsiloxane

;

Silicone elastomer

;

Solvent-free

Heat (optional)

;

Moisture Cure

;

Pressure sensitive

;

Room temperature cure

;

RTV

Order Sample

Potting

Silicone

2-Part Cure

;

Room temperature

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Pot

;

Bond

Epoxy

2-Part Cure

;

Room temperature cure

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Potting

;

Bond

;

Casting Resin

Epoxy

Part A/Part B

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Encapsulant

;

Pottant

;

Sealant

Silicone

;

Solvent-free

Part A/Part B

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Encapsulate

;

Pot

Silicone

Heat

;

Part A/Part B

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Encapsulate

Epoxy

Part A/Part B

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Encapsulate

Epoxy

2-Part Cure

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