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Pottant / Encapsulant Grid
UR3010
Encapsulate; Two Part; Liquid; Polyurethane; 2-Part Cure;
A two component, room temperature curing polyurethane potting system. It is designed to cure completely at room temperature.
;
Manufacturer:
Resinlab
Viscosity (cPs):
Low; 615
EP965
Mass Potting; Two Part; Liquid; Epoxy; Part A/Part B;
Medium viscosity, fast gel, mass potting, unfilled.;
Manufacturer:
Resinlab
Viscosity (cPs):
Free flowing; 11,000
Sylgard 184 Silicone Elastomer
Pot
; Two Part; Liquid; Silicone; Base/Curing Agent;
Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.;
Manufacturer:
Dow
Viscosity (cPs):
Flowable; 3,500
EP1200 Black
Potting; Two Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;
Manufacturer:
Resinlab
Viscosity (cPs):
Medium; 30,000; 39,000
ThermoSink 35-1
Potting; Two Part; Liquid; Silicone; Room temperature;
A two-component, flowable, thermally conductive silicone elastomer, water resistant, room temperature cure.;
Manufacturer:
Resin Designs
Viscosity (cPs):
Flowable; 40,000
EP965LVLX
Encapsulate; Two Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer.;
Manufacturer:
Resinlab
Viscosity (cPs):
Free flowing; 2,500
EP1282 Black
Encapsulate; Two Part; Liquid; Epoxy; 2-Part Cure;
A two part unfilled epoxy encapsulant designed for medium sized castings, a tough, semi-rigid polymer, a good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release, very good resistance, high elongation.;
Manufacturer:
Resinlab
Viscosity (cPs):
Good wetting; 3,000
EP1121 Black
Encapsulate; Two Part; Liquid; Epoxy; Part A/Part B;
It is a two-part, unfilled epoxy encapsulant designed for medium to large sized castings. It cures completely at
room temperature to a tough, flexible yet soft polymer. ;
Manufacturer:
Resinlab
Viscosity (cPs):
Low; 2,900; 4,500
Dowsil 3-4207 Dielectric Tough Gel
Encapsulant; Two Part; Gel (Post-cure); Silicone; Part A/Part B;
Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.;
EP965SC7
Encapsulate; Two Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled electronic grade epoxy encapsulant, room temperature to a tough, semi-rigid polymer, Good wetting and adhesion, Good resistnace to water, acids and bases and most organic solvents.;
Manufacturer:
Resinlab
Viscosity (cPs):
Free flowing; 8,000
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