5420
Gasketing of EMI/RF shielded enclosures; 1-Part; Paste; Silicone; Heat;
Used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures.;
9703
EMI/RFI shield; 1-Part; Transfer tape; Acrylic; Pressure Sensitive;
Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically
conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films • ;
TF E2213F
EMI/RFI grounding; 1-Part; B-Staged Film; Epoxy; Heat;
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. ;
Loctite CC 40A E&C
Use in radar reflection; 1-Part; Liquid; Solvent based elastomer; Hot air drying;
● One component ● Electrically conductive ● Elastomeric ● Silver-filled ● Elastomeric surface coating ● use in a variety of electrical and electronic applications ● Hot air drying;
9712
EMI/RFI shield; 1-Part; Tape; Filled Acrylic; Pressure Sensitive;
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.;
9713
EMI/RFI shield; 1-Part; Tape; Filled Acrylic; Pressure Sensitive;
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.;
Aluminum Foil Tape 1120
EMI/RFI shielding; 1-Part; Tape; Acrylic adhesive; Pressure-sensitive;
Commonly used for EMI/RFI shielding applications in the electronics industry and for static charge draining, seaming shielded rooms, cable wrapping and surface contact to non-solderable materials.;
Epo-Tek 430
EMI RF shielding; 2-Part; Thick paste; Epoxy; 2- Part Cure;
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics.
It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.;
Dynaloy 335
RFI shielding; 2-Part; Paste; Epoxy; 2-Part Cure;
A two component pure silver filled epoxies, which combine the excellent adhesive properties of the epoxies with the electrical conductivity of pure silver.;
PR-1764 Class B Electrically Conductive Sealant
Excellent long-term RMI protection; 2-Part; Paste; Manganese dioxide; 2-Part Cure;
An electrically conductive, corrosion inhibitive sealant. The cured sealant maintains electrical continuity in
aircraft applications. This material provides excellent long-term EMI/RMI protection.;