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A halide-free, no clean, pin testable Pb-free solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing.;
A fast flow, fast cure underfill. It is a one component, non-anhydride curing epoxy for enhanced moisture resistance. The combined attributes of this innovative encapsulant make it one of the most reliable capillary underfills on the market today. ;
A halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste. Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC.;
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Need help? Our knowledgeable experts help you achieve your goals by giving you application insights. They are available personally to help you before, during or after your search.