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Solder Grid


Loctite LF 318

Solder paste; 1 Part; Paste; Halide-Free; Solder;
A halide-free, no clean, pin testable Pb-free solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing.;
Manufacturer: Henkel
Substrate: Au; Copper Mirror Corrosion; Copper Plate Corrosion; OSP copper

R520A Solder Paste

Solder paste; 1 Part; Paste; Lead free; Solder;
Kester R520A Solder Paste is a 1 Part Solder Lead free Paste used to Solder ;

E 1172 A

Solder; 1 Part; Liquid; Epoxy; Non-Anhydride Curing;
A fast flow, fast cure underfill. It is a one component, non-anhydride curing epoxy for enhanced moisture resistance. The combined attributes of this innovative encapsulant make it one of the most reliable capillary underfills on the market today. ;
Manufacturer: Henkel
Substrate: Glass; Plastic: Epoxy - Epoxy

EM808 Solder Paste - Lead Free

Solder paste; 1 Part; Paste; Lead free; Solder;
Kester EM808 Solder Paste - Lead Free is a 1 Part Solder Lead free Paste used to Solder ;

C8830 Silver Conductor Paste

Conductor Paste; 1 Part; Paste; Lead-free; Heat;
Heraeus C8830 Silver Conductor Paste is a 1 Part Heat Silver Paste used to Solder A wide range of glass substrates;
Manufacturer: Heraeus
Substrate: A wide range of glass substrates

Vaculoy Wavesolder

Solder; 1 Part; Liquid; Tin; Solder;
Alpha Metals Vaculoy Wavesolder is a 1 Part Solder Lead Liquid used to Solder ;

R276 Solder Paste

Solder paste; 1 Part; Solder Paste; Leaded and Lead-free Alloys; Solder;
Kester R276 Solder Paste is a 1 Part Solder Leaded and Lead-free Alloys Solder Paste used to Solder ;

HiFLO High Fluidity Bar Solder

Solder; 1 Part; Liquid; Tin; Solder;
Alpha Metals HiFLO High Fluidity Bar Solder is a 1 Part Solder Tin Liquid used to Solder Metals;
Manufacturer: Alpha Metals
Substrate: Metals

Loctite HF 212

Soldering; 1 Part; Paste; Halogen-free; Solder;
A halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste. Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC.;
Manufacturer: Henkel
Substrate: CuNiZn; Immersion Ag; Metal: Gold - ENIG; OSP-Cu

Loctite HF 2W

Solder; 1 Part; Paste; Halogen-free; Solder;
Water washable, tin-lead solder paste. Excellent resistance to solder balling and slump, excellent solderability in air.;
Manufacturer: Henkel
Substrate: ENIG surface; Metal: Silver - Silver surface; OSP-Cu surface

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Solder paste

1 Part

Paste

Au

;

Copper Mirror Corrosion

;

Copper Plate Corrosion

;

OSP copper

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Solder paste

1 Part

Paste

Order Sample

Solder

1 Part

Liquid

Glass

;

Plastic: Epoxy - Epoxy

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Solder paste

1 Part

Paste

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Conductor Paste

1 Part

Paste

A wide range of glass substrates

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Solder

1 Part

Liquid

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Solder paste

1 Part

Solder Paste

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Solder

1 Part

Liquid

Metals

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Soldering

1 Part

Paste

CuNiZn

;

Immersion Ag

;

Metal: Gold - ENIG

;

OSP-Cu

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Solder

1 Part

Paste

ENIG surface

;

Metal: Silver - Silver surface

;

OSP-Cu surface

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