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Loctite Ablestik 2600BT
Thermal Management; 1-Part; Liquid; Silver and resin particles suspended in solvent carrier.; Heat Cure;
Designed for thermal management applications requiring high heat extraction from the die.;
Manufacturer:
Henkel
Bergquist Hi Flow THF 1000F-AC
Thermally conductive adhesive; 1-Part; Kiss-cut part; Silicone; Pressure Sensitive;
A high performance, thermal interface material for use between a computer processor and a heat sink.;
Manufacturer:
Henkel
Loctite Ablestik 2600K
Thermal Management; 1-Part; Liquid; Thermoplastic and thermoset resin particles suspended in a solvent
carrier; Heat Cure;
Designed for thermal management applications requiring high heat extraction from the die.;
Manufacturer:
Henkel
Bergquist Hi Flow THF 900
Thermally conductive adhesive; 1-Part; Die-cut parts; Low volatility – less than 1%; Pressure Sensitive;
A phase change material coated on both sides of an aluminum substrate. It is a Thermal management, Thermally conductive adhesive.;
Manufacturer:
Henkel
Bond Ply 800
Thermal Adhesive; 1-Part; Tape; Acrylic; Pressure sensitive;
A thermally conductive, electrically isolating double-sided tape and High bond strength.;
Manufacturer:
Henkel
Cooltherm TC-2002
Thermal Adhesive; 2-Part; Paste; Epoxy; 2-Part Cure;
It is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.
;
Manufacturer:
Parker Lord
Epo-Tek 930-1
Thermal adhesive; 2-Part; Paste; Epoxy; 2-Part Cure;
A two part, thermally conductive, electrically insulating epoxy, can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics.;
Manufacturer:
Epoxy Technology
KE-4962
Liquid-dispensed Thermal Adhesive; 1-Part; Paste; Low Molecular Weight Siloxane Stripped; Room-temperature cure;
• Single component • Superior thermal conductivity • UL 94 V-0 equivalent • Room-temperature cure • Quick tack free time • Thixotropic paste.;
Manufacturer:
Shinetsu
Bergquist Sil Pad TSP PPK1300
Thermally Conductive Insulation Material; 1-Part; Die-cut parts; Polyester Based; Pressure sensitive;
It is a composite of film coated with a polyester resin. Polyester-Based, Thermally Conductive Insulation Material.;
Manufacturer:
Henkel
Thermeez 397
Insulation Tape; 1-Part; Tape; Asbestos
Free; Pressure Sensitive;
High strength, flexible, durable, dimensionally and chemically stable and have excellent electrical resistance.;
Manufacturer:
Cotronics
Chemical Resistance:
Chemically stable; Resistant to most chemicals; Resistant to most solvents
Loctite Ablestik 2600BT
Thermal Management; 1-Part; Liquid; Silver and resin particles suspended in solvent carrier.; Heat Cure
Designed for thermal management applications requiring high heat extraction from the die.
Manufacturer: Henkel
Bergquist Hi Flow THF 1000F-AC
Thermally conductive adhesive; 1-Part; Kiss-cut part; Silicone; Pressure Sensitive
A high performance, thermal interface material for use between a computer processor and a heat sink.
Manufacturer: Henkel
Loctite Ablestik 2600K
Thermal Management; 1-Part; Liquid; Thermoplastic and thermoset resin particles suspended in a solvent
carrier; Heat Cure
Designed for thermal management applications requiring high heat extraction from the die.
Manufacturer: Henkel
Bergquist Hi Flow THF 900
Thermally conductive adhesive; 1-Part; Die-cut parts; Low volatility – less than 1%; Pressure Sensitive
A phase change material coated on both sides of an aluminum substrate. It is a Thermal management, Thermally conductive adhesive.
Manufacturer: Henkel
Bond Ply 800
Thermal Adhesive; 1-Part; Tape; Acrylic; Pressure sensitive
A thermally conductive, electrically isolating double-sided tape and High bond strength.
Manufacturer: Henkel
Cooltherm TC-2002
Thermal Adhesive; 2-Part; Paste; Epoxy; 2-Part Cure
It is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.
Manufacturer: Parker Lord
Epo-Tek 930-1
Thermal adhesive; 2-Part; Paste; Epoxy; 2-Part Cure
A two part, thermally conductive, electrically insulating epoxy, can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics.
Manufacturer: Epoxy Technology
KE-4962
Liquid-dispensed Thermal Adhesive; 1-Part; Paste; Low Molecular Weight Siloxane Stripped; Room-temperature cure
• Single component • Superior thermal conductivity • UL 94 V-0 equivalent • Room-temperature cure • Quick tack free time • Thixotropic paste.
Manufacturer: Shinetsu
Bergquist Sil Pad TSP PPK1300
Thermally Conductive Insulation Material; 1-Part; Die-cut parts; Polyester Based; Pressure sensitive
It is a composite of film coated with a polyester resin. Polyester-Based, Thermally Conductive Insulation Material.
Manufacturer: Henkel
Thermeez 397
Insulation Tape; 1-Part; Tape; Asbestos
Free; Pressure Sensitive
High strength, flexible, durable, dimensionally and chemically stable and have excellent electrical resistance.
Manufacturer: Cotronics
Chemical Resistance: Chemically stable; Resistant to most chemicals; Resistant to most solvents
Application Type
Chemical Resistance
1 Part or 2 Part
Material Form
Description
Thermal Management
1-Part
Liquid
Designed for thermal management applications requiring high heat extraction from the die.
Thermally conductive adhesive; Reinforced Phase Change Thermal Interface Material
1-Part
Kiss-cut part; Roll Form; Sheet Form
A high performance, thermal interface material for use between a computer processor and a heat sink.
Thermal Management
1-Part
Liquid
Designed for thermal management applications requiring high heat extraction from the die.
Thermally conductive adhesive; Coat; Phase change material
1-Part
Die-cut parts; Roll form; Sheet form
A phase change material coated on both sides of an aluminum substrate. It is a Thermal management, Thermally conductive adhesive.
Thermal Adhesive; Bond
1-Part
Tape
A thermally conductive, electrically isolating double-sided tape and High bond strength.
Thermal Adhesive; Bonding
2-Part
Paste
It is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.
Thermal adhesive
2-Part
Paste
A two part, thermally conductive, electrically insulating epoxy, can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics.
Liquid-dispensed Thermal Adhesive
1-Part
Paste
• Single component • Superior thermal conductivity • UL 94 V-0 equivalent • Room-temperature cure • Quick tack free time • Thixotropic paste.
Thermally Conductive Insulation Material
1-Part
Die-cut parts; Roll form; Sheet form
It is a composite of film coated with a polyester resin. Polyester-Based, Thermally Conductive Insulation Material.
Insulation Tape; Door gaskets; Ideal for gaskets
Chemically stable; Resistant to most chemicals; Resistant to most solvents
1-Part
Tape
High strength, flexible, durable, dimensionally and chemically stable and have excellent electrical resistance.
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