Dow Dowsil SE 4485 L Thermally Conductive Adhesive Datasheet Dow Dowsil SE 4485 L Thermally Conductive Adhesive

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  • Description for Dow Dowsil SE 4485 L Thermally Conductive Adhesive

    One-part, white, moisture cure, thermally conductive silicone adhesive.

    *See Terms of Use Below

    Brand Dowsil
    Chemical Resistance Chemical Resistance: Resistance to minimal or intermittent solvent exposure
    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Ceramics, Glass, Many reactive metals, Selected plastics
    Industry Lamp devices, PCB system assemblies, Smart Meters, Advanced driver-assistance systems (ADAS), E-Mobility Solutions, Smart Home Devices, Cooling of modules, Consumer devices, Power supply devices, Cooler device
    Manufacturer Dow
    Chemistry Low volatility, Polydimethylsiloxane
    Cure Method RTV-cure, Moisture cure, Room temperature cure
    Cure Temperature (°C) 20 to 25 Room temperature
    Cure Time (min) 240 to 420, 10,080
    Viscosity (cPs) Semi-flowable
    Color White
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low thermal resistance
    Stress Relief Low-stress
    Durability Durable
    Elastomeric Elastomer
  • Technical Data for Dow Dowsil SE 4485 L Thermally Conductive Adhesive

    Overview
    • Chemical Resistance
      • Chemical Resistance : Relative Solvent Resistance - Resistance to minimal or intermittent solvent exposure
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
      • Ceramic - Ceramics
      • Glass
      • Metal - Many reactive metals
      • Plastic - Selected plastics
      • Other - Selected resins, Selected laminates
    • Industry
      • Smart Meters
      • Smart Home Devices
      • Advanced driver-assistance systems (ADAS)
      • E-Mobility Solutions
      • Electronics - Lamp devices, Cooling of modules, Consumer devices, Power supply devices, Cooler device
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Other - Spot protection of other devices, Spot protection of pins, Thin section encapsulation
    • Chemistry
      • Other - Low volatility
      • Silicone - Polydimethylsiloxane
    • Application Method
      • Dispenser - Automated or manual dispense
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • Moisture / Condensation Cure - Moisture cure
      • RTV (Room Temperature Vulcanization) - RTV-cure
    • Color
      • White
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room temperature Test Method
    Cure Time (min) 240 to 420, 10,080 Test Method
    Viscosity (cPs) Semi-flowable
    Tack Free Time (min) Fast, 8 Test Method
    Bond Strength
    Shear Strength (psi) 262 Test Method
    Tensile Strength (psi) 740
    Material Resistance
    Non-Corrosive Noncorrosive
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low thermal resistance
    Conductivity
    Filler Thermally conductive filler
    Dielectric Strength (V/mil) Good dielectric properties, 965
    Thermal Conductivity (W/m°K) Thermally conductive, 2.20
    Hardness
    Stress Relief Low-stress
    Durability Durable
    Shore A Hardness 90 Test Method
    Elastomeric Elastomer
    Elongation (%) 20
    Other Properties
    Specific Gravity 2.840 Test Method
    Business Information
    Shelf Life Details The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Expiration Date found on the label.
    Not Good For
    Don't Use With Non-reactive metal substrates, Teflon, Plastic or rubber substrates that are highly plasticized, Non-reactive plastic surfaces, Polyethylene, Polypropylene, Plastic, Rubber
  • Best Practices for Dow Dowsil SE 4485 L Thermally Conductive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      Good adhesion cannot be expected on non-reactive metal substrates or non-reactive plastic surfaces such as Teflon®, polyethylene or polypropylene. Special surface treatments such as chemical etching or plasma treatment can sometimes provide a reactive surface and promote adhesion to these types of substrates. Dow Corning® brand primers can be used to increase the chemical activity on difficult substrates. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, primers should be thoroughly air dried prior to application of the silicone elastomer. Alternatively, use a lowviscosity primerless adhesive to pot your components.

    2. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 0 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 4 to 7 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days.

    3. Testing

      To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room temperature 0 to 80 percent relative humidity
Cure Time Test Methods
Cure Time Test Method
240 to 420 min Greater than 90 percent
10,080 min Generally cure about 0.25 inch (6.35 mm)
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Fast
8 min 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
262 psi Lap shear Glass to glass Unprimed adhesion
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
90 Durometer, JIS: Japanese Industrial Standard.
Specific Gravity Test Methods
Specific Gravity Test Method
2.840 Cured