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Description for Dow Sylgard 184 Silicone Elastomer
Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.Brand Sylgard Chemical Resistance Good Application Type Adhesive, Pot , Encapsulate 1 Part or 2 Part 2-Part Material Form Liquid, Silicone elastomer Industry Relays, Solar cells, Sensors, Transformers, Connectors, Amplifiers, Smart Meters, High voltage resistor packs, E-Mobility Solutions, Smart Home Devices, Electronics, Lead integrated circuit Manufacturer Dow Chemistry Silicone, Solvent-free, Silicone elastomer Cure Method Base/Curing Agent, Heat, Room Temperature Cure Cure Temperature (°C) 20 to 25, 100, 125, 150 Viscosity (cPs) 3,500, Flowable Color Colorless Ozone Resistance Ozone resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 2.9e14(ohms/cm) Light Refractive Index (RI) Good, 1.4118, 1.4225, 1.4028, 1.3997 Key Specifications Mil-Spec (United States Military Standard): I-81550C: MIL-I-81550C, Type II, QPL, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1 -
Technical Data for Dow Sylgard 184 Silicone Elastomer
Overview
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Chemical Resistance
- Chemical Resistance - Good
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Application Type
- Adhesive
- Pottant / Encapsulant - Pot , Encapsulate
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1 Part or 2 Part
- 2-Part
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Material Form
- Elastomer - Silicone elastomer
- Liquid
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Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Lead integrated circuit, Relays
- Solar Energy - Solar cells
- Sensors
- Transformers
- Connectors
- Amplifiers
- Voltage Resistors - High voltage resistor packs
- Power Supplies
- Industrial - Industrial controls
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Chemistry
- Solvent-Free
- Silicone - Silicone elastomer
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Application Method
- Dispenser - Automated mixing, Dispensing equipment, Manual mixing
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Cure Method
- Room Temperature / Air Dry - Room Temperature Cure
- Heat
- 2-Part Cure - Base/Curing Agent
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Color
- Clear / Transparent - Colorless
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Key Specifications
- Mil-Spec (United States Military Standard) : I-81550C : Type II, QPL - MIL-I-81550C, Type II, QPL
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V-1 - UL 94 V-1
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Brand
- Sylgard
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25, 100, 125, 150 Test Method Viscosity (cPs) 3,500, Flowable Linear Shrinkage (%) Minimal shrinkage Mix Ratio 10:1 (by volume), 10:1 (by weight) Bond Strength
Tensile Strength (psi) 980 Material Resistance
Ozone Resistance Ozone resistance UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.00257, 0.00133 Test Method Dielectric Strength (V/mil) Good, Durable Dielectric Constant 2.72, 2.68 Test Method Thermal Conductivity (W/m°K) 0.27 Volume Resistivity (O) 2.9e14(ohms/cm) Hardness
Shore D Hardness 43 Test Method Flexibility Flexible Other Properties
Light Refractive Index (RI) Good, 1.4118, 1.4225, 1.4028, 1.3997 Test Method Specific Gravity 1.030 Coefficient of Thermal Expansion (CTE) 340 (Linear (micron/m °C or ppm )) Flash Point (°F) 213.8 Business Information
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements. Shelf Life Temperature (°F) 77 Shelf Life Type From date of manufacture Shelf Life (mon) 24 -
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Best Practices for Dow Sylgard 184 Silicone Elastomer
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Surface Preparation
In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.
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Mixing
The 10 to 1 mix ratio these products are supplied in gives one latitude to tune the modulus and hardness for specific application needs and production lines. In most cases de-airing is not required.
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Deairing/Degassing
If air bubbles are still present, vacuum deairing may be required. Deair in a container with at least four times the liquid volume to allow for expansion of material. Air entrapped in the mixture can be removed by using a vacuum of 28 to 30 inches Hg. Continue the vacuum until the liquid expands and settles to its original volume and bubbling subsides. This may take 15 minutes to 2 hours depending on the amount of air introduced during stirring. For best curing results, glassware and glass or metal stirring implements should be used. Mix with a smooth action that does not introduce excess air.
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Testing
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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20 to 25°C | These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature. |
100°C | These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature. |
125°C | These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature. |
150°C | These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature. |
Cure Time Test Methods
Cure Time | Test Method |
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Work / Pot Time Test Methods
Work / Pot Time | Temperature |
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Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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2.72 | Dielectric constant, 100 Hz |
2.68 | Dielectric constant, 100 KHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00257 | Dissipation factor, 100 Hz |
0.00133 | Dissipation factor, 100 KHz |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method |
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43 | Durometer |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Test Method |
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Good | |
1.4118 | @ 589 nm |
1.4225 | @ 632.8 nm |
1.4028 | @1321 nm |
1.3997 | @ 1554 nm |