MicroCoat Technologies E53102 Datasheet MicroCoat Technologies E53102

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  • Description for MicroCoat Technologies E53102

    Two Part Epoxy. Excellent thermal conductivity potting compound and adhesive. High Tg for use in severe heat, chemical and environmental conditions.<br/>

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    Chemical Resistance High Tg for use in chemical conditions
    Application Type Bond, Potting
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Manufacturer MicroCoat Technologies
    Chemistry Epoxy
    Cure Method 2-Part Cure, Heat
    Cure Temperature (°C) 150
    Cure Time (min) 180
    High Temperature Resistance (°C) High Tg for use in severe heat conditions
  • Technical Data for MicroCoat Technologies E53102

    Overview
    • Chemical Resistance
      • Chemical Resistance - High Tg for use in chemical conditions
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Chemistry
    • Cure Method
      • Heat
      • 2-Part Cure
    Specifications
    Cure Specs
    Cure Temperature (°C) 150
    Cure Time (min) 180
    Set Time (min) >180 Test Method
    Work / Pot Time (min) >180 Test Method
    Mix Ratio 7.2:1
    Material Resistance
    Environmental Resistance High Tg for use in environmental conditions
    High Temperature Resistance (°C) High Tg for use in severe heat conditions
    Vibration Resistance/Shock Resistance Shock resistance
    Conductivity
    Dielectric Strength (V/mil) High
    Thermal Conductivity (W/m°K) Excellent
    Hardness
    Shore D Hardness 88
    Other Properties
    Glass Transition Temp (Tg) (°C) High
  • Best Practices

    Best Practices information currently not available.
  • Comparable Materials for MicroCoat Technologies E53102

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    Spec Engine® Results

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Set Time Test Methods
Set Time Set Temperature Test Method
>180 min 20 to 25°C RT Gel Time
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
>180 min Pot Life 20 to 25°C RT