Dow Dowsil 3-4170 Dielectric Gel

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Description for Dow Dowsil 3-4170 Dielectric Gel

• Clear • Fast heat cure • Long working time and low viscosity aid process flexibility • Impregnation may be successful without vacuum

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Brand	Dowsil
Application Type	Coating, Encapsulating , Seal, Potting
1 Part or 2 Part	2-Part
Material Form	Gel
Industry	Circuits, PCB system assemblies, Smart Meters, E-Mobility Solutions, Smart Home Devices, Electronics, Optoelectronics
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	Addition Cure, Heat
Cure Temperature (°C)	100, 125, 150
Cure Time (min)	9, 5.00, 3.00
Viscosity (cPs)	475, Low
Color	Soft Clear
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	9.5E+14 (ohms/cm)
Light Refractive Index (RI)	High

Best Practices for Dow Dowsil 3-4170 Dielectric Gel

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Technical Data for Dow Dowsil 3-4170 Dielectric Gel

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Overview

Application Type
- Coating
- Pottant / Encapsulant - Encapsulating , Potting
- Sealant - Seal
1 Part or 2 Part
- 2-Part
Material Form
- Gel
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Circuits, Optoelectronics
- Printed Circuit Board (PCB) - PCB system assemblies
- Industrial - Delicate components
Chemistry
- Solvent-Free
- Silicone
Application Method
- Dispenser - Automated dispensing equipment
Cure Method
- Heat
- 2-Part Cure - Addition Cure
Color
- Clear / Transparent - Soft Clear
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	100, 125, 150	Test Method
Cure Time (min)	9, 5.00, 3.00	Test Method
Viscosity (cPs)	475, Low	Test Method
Work / Pot Time (min)	Long, >1,440	Test Method
Mix Ratio	1:1 (by volume)

Material Resistance

High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00160, 0.00007	Test Method
Dielectric Strength (V/mil)	Excellent, 500, Electrical insulation
Dielectric Constant	2.85, 2.85	Test Method
Volume Resistivity (O)	9.5E+14 (ohms/cm)

Hardness

Flexibility	Flexible, Resilient

Other Properties

Light Refractive Index (RI)	High
Coefficient of Thermal Expansion (CTE)	425 (ppm/ºC)	Test Method

Business Information

Shelf Life Details	Storage conditions and shelf life (“Use By” date) are indicated on the product label.
Shelf Life Temperature (°F)	77
Shelf Life (mon)	12

Best Practices for Dow Dowsil 3-4170 Dielectric Gel

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1. Mixing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. In general, gels are supplied as two-part products that are mixed in a 1:1 ratio (Parts A and B)
  
  one-part gels are available that eliminate the need for mixing. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
2. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
Comparable Materials for Dow Dowsil 3-4170 Dielectric Gel

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Spec Engine^® Results
- Sylgard 527 Silicone Dielectric Gel(Dow)
  Two-part, 1 to 1 mix ratio dielectric gel, Room temperature or heat accelerated cure, Available in clear or red, Low viscosity allows good flow under components, UL flammability rating
- Hipec Q3-6646 SemiconDuctor Protective Coating(Dow)
  Transparent, low-modulus LED gel encapsulant; low viscosity; long working time.
- Dowsil 3-6512 Elastomer(Dow)
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