Dymax Dual-Cure 29978-E Datasheet Dymax Dual-Cure 29978-E

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  • Description for Dymax Dual-Cure 29978-E

    A light- and moisture-cure conformal coating specifically formulated to ensure complete cure for coating that flows underneath components on printed circuit boards. It contain no nonreactive solvents.

    *See Terms of Use Below

    Chemical Resistance Chemically resistant
    Application Type Conformal coating
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Ceramic, Silicon (Limited applications)
    Industry Formulated to ensure complete cure for coating that flows underneath components on printed circuit boards, Leadframe
    Manufacturer Dymax
    Chemistry Acrylated urethane, Contain no nonreactive solvents, Acrylated urethane, Acrylated urethane
    Cure Method UV/Visible light cure , Moisture cure, Heat cure, Room temperature cure
    Cure Temperature (°C) 25, 25, 25, 40 to 60
    Odor Details Low odor
    Cure Time (min) 14,400, 2,880 to 4,320, >10,080
    Viscosity (cPs) 125
    Fluorescent Bright blue fluorescing
    Color Colorless/Light amber
    Volume Resistivity (O) 1.01e16 (ohm-cm)
    Density (g/cm³) 1.07 (g/ml)
    Key Specifications Full compliance with RoHS directives 2015/863/EU, Mil-Spec (United States Military Standard): MIL-I-46058C, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V0 Flammability, IPC (Association Connecting Electronics Industries): IPC-CC-830B, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 746-E

  • Technical Data for Dymax Dual-Cure 29978-E

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance - Chemically resistant
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
      • Ceramic
      • Silicon - Silicon (Limited applications)
    • Industry
      • Leadframe
      • Printed Circuit Board (PCB) - Formulated to ensure complete cure for coating that flows underneath components on printed circuit boards
    • Chemistry
    • Application Method
      • Dispenser - variety of manual, semi-automated and fully automated fluid delivery systems
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • UV / Visible Light - UV/Visible light cure
      • Moisture / Condensation Cure - Moisture cure
      • Heat - Heat cure
    • Color
      • Red - Colorless/Light amber
    • Key Specifications
      • RoHS (Restriction of Hazardous Substances) - Full compliance with RoHS directives 2015/863/EU
      • Mil-Spec (United States Military Standard) : I-46058-C - MIL-I-46058C
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V0 Flammability
      • IPC (Association Connecting Electronics Industries) : CC-830B - IPC-CC-830B
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : 746E - UL 746-E
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 25, 25, 40 to 60 Test Method
    Odor Details Low odor
    Cure Time (min) 14,400, 2,880 to 4,320, >10,080 Test Method
    Viscosity (cPs) 125 Test Method
    Fixture or Handling Strength Time (min) 0.67, 1.5 (m/min), 0.3 (m/min), 0.08 Test Method
    Linear Shrinkage (%) 1.60 Test Method
    Fluorescent Bright blue fluorescing
    Bond Strength
    Tensile Strength (psi) 1,600 Test Method
    Conductivity
    Dissipation Factor 0.01000 Test Method
    Dielectric Strength (V/mil) >1500 (V) Test Method
    Dielectric Constant 3.90 Test Method
    Surface Resistivity (O) 3.92e15 (ohm) Test Method
    Volume Resistivity (O) 1.01e16 (ohm-cm) Test Method
    Hardness
    Shore D Hardness 75, 65 Test Method
    Elongation (%) 60 Test Method
    Modulus (psi) 21,800 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 56 Test Method
    Coefficient of Thermal Expansion (CTE) 74 (µm/m/°C), 210 (µm/m/°C) Test Method
    Density (g/cm³) 1.07 (g/ml) Test Method
    Business Information
    Shelf Life Details This material has a 12-month shelf life from date of manufacture, unless otherwise specified, when stored between 10°C (50°F) and 32°C (90°F) in the original, unopened container.
    Shelf Life Temperature (°F) 50 to 90
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12

  • Best Practices for Dymax Dual-Cure 29978-E

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces in contact with the material should be clean and free from flux residue, grease, mold release, or other contaminants prior to dispensing the material.

    2. Application

      This material may be dispensed with a variety of manual, semi-automated and fully automated fluid delivery systems. Dymax has several dispensing systems that may be suitable for use with conformal coating materials such as our model 110 mountable atomizing needle valve or SG-100-RS handheld spray gun. Small area applications including beads and small dots can be achieved using hand-held dispensers such as our SD-100 syringe dispenser and our Model 400 needle valve systems. These valve systems can be used in a manual, semi-automated or fully automated application. Questions relating to and defining the best fluid delivery system and curing equipment for specific applications should be discussed with the Dymax Application Engineering Team.

    3. Curing

      Full cure is best determined empirically by curing at different times and intensities, and measuring the corresponding change in cured properties such as tackiness, adhesion, hardness, etc. Full cure is defined as the point at which more light exposure no longer improves cured properties. Higher intensities or longer cures (up to 5x) generally will not degrade Dymax light-curable materials.

      Secondary Moisture Cure: A combination of light and moisture cure is required to achieve full cured mechanical properties. Moisture is also used as a secondary cure mechanism for shadow areas that cannot be cured with light. While moisture cure time in shadow areas is typically 2-3 days at 25°C [77°F], 50% RH, actual moisture cure time is application specific and may vary. For material that has been light cured, typical full property development is after 7 days at 25°C [77°F], 50% RH.

      Cure time for both light-cured and shadow areas depends on humidity level, amount of material in shadow areas, and its proximity to humidity. Material entrapped under large components may have a prolonged cure time. Exposure to heat (typically 40°C-60°C) and higher relative humidity will accelerate cure.

      Dymax recommends that customers employ a safety factor by curing longer and/or at higher intensities than required for full cure. Although Dymax Application Engineering can provide technical support and assist with process development, each customer must ultimately determine and qualify the appropriate curing parameters required for their unique application.

      This product cures with exposure to UV and visible light. Exposure to ambient and artificial light should be kept to a minimum before curing. Dispensing components including needles and fluid lines should be 100% light blocking, not just UV blocking.

      Cure speed is dependent upon many variables, including lamp \intensity, distance from the light source, required depth of cure, coating thickness and amount of material in shadowed areas.

      Oxygen in the atmosphere may inhibit surface cure. Surfaces exposed to air may require high-intensity (>100 mW/cm²) UV light to produce a dry surface cure. Flooding the curing area with an inert gas, such as nitrogen, can also reduce the effects of oxygen inhibition.

      Parts should be allowed to cool after cure before testing and subjecting to any loads or electrical testing.

      Light curing generally produces some heat. If necessary, cooling fans can be placed in the curing area to reduce the heating effect on components.

      At the point of curing, an air exhaust system is recommended to dissipate any heat and vapors formed during the curing process.

      Resealing opened containers under nitrogen extends shelf life.

    4. Clean-Up

      Uncured material may be removed from dispensing components and parts with organic solvents. Cured material will be impervious to many solvents and difficult to remove.

    5. Removal

      Cleanup of cured material may require mechanical methods such as ultrasonic bath, water jet, vacuum tweezers, air knife and/ or warming to aid in the removal.

  • Comparable Materials for Dymax Dual-Cure 29978-E

    *See Terms of Use Below

    Spec Engine® Results

    • Dymax
      Dual-Cure 9481-E(Dymax)

      It is a light- and moisture-cure conformal coating specifically formulated to ensure complete cure for coating that flows underneath components on printed circuit boards. Colorless/Light amber liquid.

    • Dymax
      9481(Dymax)

      A Dual-Cure™ light & moisture cure conformal coating specifically formulated to ensure complete cure in applications where shadowed areas on high density circuits boards are concern. Shadowed areas cure over time with moisture.

    • Dymax
      Dual-Cure E-Max 903-E(Dymax)

      • One Part • UV/Visible Light Cure • Secondary Moisture Cure • Conformal Coating • Solvent Free • Very Low VOCs • Low Odor • Chemically Resistant.

    • Compare All
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
25°C 75% RH
25°C 50% RH
25°C 50% RH
40 to 60°C Exposure to heat
Cure Time Test Methods
Cure Time Test Method
14,400 min 75% RH
2,880 to 4,320 min 50% RH
>10,080 min 50% RH
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Test Method
0.67 min Fixture time is defined as the time to develop a shear strength of 0.1 N/mm2[10 psi] between glass slides. Actual cure time typically is 3 to 5 times fixture time. No moisture cure time was allowed for this evaluation.; 5000-EC (225 mW/cm²), Intensity was measured over the UVA range (320-395 nm) using a Dymax ACCU-CAL™ 50 Radiometer
1.5 (m/min) Fixture time is defined as the time to develop a shear strength of 0.1 N/mm2[10 psi] between glass slides. Actual cure time typically is 3 to 5 times fixture time. No moisture cure time was allowed for this evaluation.; UVCS Conveyor with Fusion D lamp (2.5 W/cm²), Intensity was measured over the UVA range (320-395 nm) using a Dymax ACCU-CAL™ 150 Radiometer.
0.3 (m/min) Fixture time is defined as the time to develop a shear strength of0.1 N/mm2[10 psi] between glass slides. Actual cure time typically is3 to 5 times fixture time. No moisture cure time was allowed for this evaluation.; UVCS Conveyor with one 5000-EC (250 mW/cm²), Intensity was measured over the UVA range (320-395 nm) using a Dymax ACCU-CAL™ 150 Radiometer.
0.08 min Fixture time is defined as the time to develop a shear strength of0.1 N/mm2[10 psi] between glass slides. Actual cure time typically is 3 to 5 times fixture time. No moisture cure time was allowed for this evaluation.; BlueWave® 200 (10 W/cm²), Intensity was measured over the UVA range (320-395 nm) using a Dymax ACCU-CAL™ 50 Radiometer
Linear Shrinkage Test Methods
Linear Shrinkage Test Method
1.60 % Cured, Not specifications, ASTM D2566, Measured after UV cure followed by 10 days at 25°C / 75% RH
Viscosity Test Methods
Viscosity Test Method
125 cPs Uncured, 20 rpm, Nominal, ASTM D2556, Not specifications
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Test Method
1,600 psi 14,400 min 25°C At break, Cured, Not specifications, Measured after UV cure followed by 75% RH, ASTM D638
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.90 1 MHz, ASTM D-150, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH
Dielectric Strength Test Methods
Dielectric Strength Test Method
>1500 (V) Dielectric Withstand Voltage, Not specifications, MIL-I-46058C, Measured after UV cure followed by 10 days at 25°C / 75% RH
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.01000 1 MHz, ASTM D-150, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH
Surface Resistivity Test Methods
Surface Resistivity Test Method
3.92e15 (ohm) ASTM D-257, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.01e16 (ohm-cm) ASTM D-257, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH
Elongation Test Methods
Elongation Test Method
60 % At break, Cured, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH, ASTM D638
Modulus Test Methods
Modulus Test Method
21,800 psi Modulus of elasticity, Cured, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH, ASTM D638
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
75 Cured, Durometer, ASTM D2240, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH
65 Cured, Durometer, ASTM D2240, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
74 (µm/m/°C) Cured, a1, ASTM E831, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH
210 (µm/m/°C) Cured, a2, ASTM E831, Not specifications, Measured after UV cure followed by 10 days at 25°C / 75% RH
Density Test Methods
Density Test Method
1.07 (g/ml) Uncured, ASTM D1875, Not specifications
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
56°C Cured, Not specifications, ASTM D5418, Measured after UV cure followed by 10 days at 25°C / 75% RH