Dow Fox-23 Flowable Oxide Datasheet Dow Fox-23 Flowable Oxide

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  • Description for Dow Fox-23 Flowable Oxide

    State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses volatile methyl siloxane as a carrier solvent.

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    Application Type Excellent gap fill
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Manufacturer Dow
    Chemistry Flowable Oxides, Hydrogen silsesquioxane
    Cure Method Carrier Solvent
    Cure Temperature (°C) 400
    Gap Fill (in) Excellent Gap Fill
    Viscosity (cPs) 1.50
    Density (g/cm³) Very low Defect Density
  • Technical Data for Dow Fox-23 Flowable Oxide

    Overview
    • Application Type
      • Gap Filler - Excellent gap fill
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Chemistry
      • Other - Flowable Oxides, Hydrogen silsesquioxane
    • Application Method
      • Spin-On
    • Cure Method
      • Solvent - Carrier Solvent
    Specifications
    Cure Specs
    Cure Temperature (°C) 400
    Gap Fill (in) Excellent Gap Fill
    Viscosity (cPs) 1.50
    Conductivity
    Dielectric Constant 3.00, Low Test Method
    Other Properties
    Density (g/cm³) Very low Defect Density
    Business Information
    Shelf Life Details Refer to the Sales Specifications and/or Product Label for these products. These products have a shelf life of 6 months from date of manufacture.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
  • Best Practices for Dow Fox-23 Flowable Oxide

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  • Comparable Materials for Dow Fox-23 Flowable Oxide

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Dielectric Constant Test Methods
Dielectric Constant Test Method
3.00 Dielectric Constant, 1 MHz
Low